| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/12/2015 | DE102014111252A1 Elektronisches Bauteil und Verfahren Electronic component and method |
| 02/12/2015 | DE102014111195A1 Verfahren zur Herstellung einer Chip-Anordnung und eine Chip-Anordnung A method of manufacturing a chip assembly and a chip assembly |
| 02/12/2015 | DE102013215913A1 Hochspannungsdiodengleichrichter High voltage diode rectifier |
| 02/12/2015 | DE102013215648A1 Leistungselektronikmodul mit Substrat, Bauelement und Leiterplatte Power electronics module with substrate component and circuit board |
| 02/12/2015 | DE102013215647A1 Leistungselektronisches Modul und Verfahren zur Herstellung eines leistungselektronischen Moduls Power electronic module and method of producing a power electronics module |
| 02/12/2015 | DE102013215646A1 Anzeigevorrichtung und Verfahren zum Herstellen einer Anzeigevorrichtung Display device and method of manufacturing a display device |
| 02/12/2015 | DE102013013292A1 Leuchte und Verfahren zum Betrieb einer Leuchte Method for operating a lamp and lamp |
| 02/12/2015 | DE102008045721B4 Halbleitervorrichtung Semiconductor device |
| 02/11/2015 | EP2835824A2 Interconnection of a plurality of levels of a stack of electronic component media |
| 02/11/2015 | EP2835823A1 Power converter |
| 02/11/2015 | EP2834844A1 Reflowable opto-electronic module |
| 02/11/2015 | EP2834842A1 White light emitting module |
| 02/11/2015 | CN204155961U 新型led发光元件 The new led light-emitting element |
| 02/11/2015 | CN204155931U 一种超小超薄高光效侧射型高亮白光多晶led元件 An ultra-slim high-efficiency side emitting bright white polycrystalline led element |
| 02/11/2015 | CN204153508U 一种led 日光灯管光源 One kind of led fluorescent tube light |
| 02/11/2015 | CN104350642A 组装在柔性支撑件上的电子器件的网络和通信方法 Network and communication method are assembled on flexible supports electronic device |
| 02/11/2015 | CN104350596A 半导体器件和半导体器件制造方法 Semiconductor device and a semiconductor device manufacturing method |
| 02/11/2015 | CN104350594A 半导体模块和半导体模块制造方法 Semiconductor module and method for manufacturing a semiconductor module |
| 02/11/2015 | CN104350588A 可连接到微电子基板的相反表面的用于测试的转换器以及相关的系统和方法 May be connected to the microelectronic substrate opposite to the surface for testing the converter and associated systems and methods |
| 02/11/2015 | CN104347778A 一种荧光粉涂覆方法和一种led灯及其支架 One phosphor coating method and a led lamp and bracket |
| 02/11/2015 | CN104347611A 半导体装置 Semiconductor device |
| 02/11/2015 | CN104347610A 嵌入式led器件及其制作方法和发光设备 Embedded led light-emitting device and manufacturing method and apparatus |
| 02/11/2015 | CN104347609A 一种多色led灯 A multicolor led lights |
| 02/11/2015 | CN104347608A 具有不醒目导电层的柔性照明设备 Flexible lighting device has no striking conductive layer |
| 02/11/2015 | CN104347607A 具有不醒目导电层的柔性照明设备 Flexible lighting device has no striking conductive layer |
| 02/11/2015 | CN104347606A 发光二极管封装结构及光源模块 Light emitting diode package structure and the light source module |
| 02/11/2015 | CN104347605A 一种发光二极管的封装工艺 A light emitting diode packaging technology |
| 02/11/2015 | CN104347604A Led线条光源及其制造方法 Led light source and method of manufacturing lines |
| 02/11/2015 | CN104347603A 发光二极管 Led |
| 02/11/2015 | CN104347602A 附接至热辐射构件的半导体器件 The semiconductor device is attached to the heat radiating member |
| 02/11/2015 | CN104347601A 半导体封装件及其制造方法 Semiconductor package and its manufacturing method |
| 02/11/2015 | CN104347600A 针对多个管芯的封装组件配置及关联的技术 For a plurality of die packaging component configuration and associated technology |
| 02/11/2015 | CN104347578A 层叠式半导体装置 Stacked semiconductor device |
| 02/11/2015 | CN104347577A 重新分布板、电子组件和模块 Redistribution board, electronic components and modules |
| 02/11/2015 | CN104347571A 功率控制器件及其制备方法 The power control device and its preparation method |
| 02/11/2015 | CN104347569A 一种内置dbc基板的塑封式ipm A built dbc plastic substrate type ipm |
| 02/11/2015 | CN104347567A 智能功率模块及其电极引脚结构 Intelligent Power Module and the electrode pin structure |
| 02/11/2015 | CN104347563A 半导体器件 Semiconductor devices |
| 02/11/2015 | CN104347561A 具有无源器件的芯片封装 Chip package with a passive device |
| 02/11/2015 | CN104347556A 二极管封装结构 Diode package structure |
| 02/11/2015 | CN104347541A 电路模块以及电路模块的制造方法 The method of manufacturing a circuit module and circuit module |
| 02/11/2015 | CN104347531A 塑封式智能功率模块及其散热器结构 Plastic smart power module and heat sink structure |
| 02/11/2015 | CN104347526A 双工器封装结构及制造方法 Duplexer package structure and method of manufacture |
| 02/11/2015 | CN104345405A 塑料光纤通讯用光电转换芯片的封装结构 Plastic optical fiber communications package photoelectric conversion chip |
| 02/11/2015 | CN102856314B 6500v二极管高压模块 6500v high voltage diode module |
| 02/11/2015 | CN102760724B 一种联合封装的功率半导体器件 A federated packaged power semiconductor device |
| 02/10/2015 | US8953355 Memory dies, stacked memories, memory devices and methods |
| 02/10/2015 | US8952750 Semiconductor power modules and devices |
| 02/10/2015 | US8952723 Programmable logic device and semiconductor device |
| 02/10/2015 | US8952548 Apparatus and method for increasing bandwidths of stacked dies |
| 02/10/2015 | US8952540 In situ-built pin-grid arrays for coreless substrates, and methods of making same |
| 02/10/2015 | US8952534 Semiconductor device and semiconductor assembly with lead-free solder |
| 02/10/2015 | US8952528 Semiconductor package and fabrication method thereof |
| 02/10/2015 | US8952527 Semiconductor device and manufacturing method thereof |
| 02/10/2015 | US8952526 Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry |
| 02/10/2015 | US8952517 Package-on-package device and method of fabricating the same |
| 02/10/2015 | US8952516 Multiple die stacking for two or more die |
| 02/10/2015 | US8952514 Semiconductor package |
| 02/10/2015 | US8952513 Stack type semiconductor package and method of fabricating the same |
| 02/10/2015 | US8952509 Stacked multi-chip bottom source semiconductor device and preparation method thereof |
| 02/10/2015 | US8952506 Through silicon via structure |
| 02/10/2015 | US8952498 Semiconductor device having plural stacked chips |
| 02/10/2015 | US8952473 Integrated circuit combination of a target integrated circuit and a plurality of cells connected thereto using the top conductive layer |
| 02/10/2015 | US8952471 Arrangements for an integrated sensor |
| 02/10/2015 | US8952407 Lighting device |
| 02/10/2015 | US8952398 LED lighting module |
| 02/10/2015 | US8952390 Optoelectronic component |
| 02/10/2015 | US8951836 Chip package and method for forming the same |
| 02/10/2015 | US8951445 Bridging arrangement and method for manufacturing a bridging arrangement |
| 02/05/2015 | WO2015017091A1 Light emitting diode package with encapsulant having curved and planar surfaces |
| 02/05/2015 | WO2015016140A1 Imaging element, electronic device and method for manufacturing imaging element |
| 02/05/2015 | WO2015016017A1 Semiconductor device |
| 02/05/2015 | WO2015014906A1 Optoelectronic element |
| 02/05/2015 | WO2015014739A1 Assembly of optoelectronic components and method for producing an assembly of optoelectronic components |
| 02/05/2015 | US20150036329 Light emitting module having wafer with integrated power supply device |
| 02/05/2015 | US20150036046 Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules |
| 02/05/2015 | US20150035174 Semiconductor device |
| 02/05/2015 | US20150035170 Multichip device including a substrate |
| 02/05/2015 | US20150035142 Multi-chip package |
| 02/05/2015 | US20150035116 Semiconductor device with circuits connected to each other in contactless manner |
| 02/05/2015 | US20150034981 Chip component |
| 02/05/2015 | DE102014110873A1 Halbleiterbauelement mit kombiniertem passiven Bauelement auf der Chiprückseite A semiconductor device combined with passive component at the chip rear side |
| 02/05/2015 | DE102014110845A1 Mehrchipbauelement mit einem Substrat A multi-chip component having a substrate |
| 02/05/2015 | DE102014109515A1 An ein Wärmeabstrahlelement anzubringende Halbleitervorrichtung A heat radiating element to be mounted semiconductor device |
| 02/05/2015 | DE102013215382A1 Leuchtstoff-LED Fluorescent LED |
| 02/05/2015 | DE102013215350A1 Verfahren zum Herstellen einer Beleuchtungsanordnung A method for producing a lighting arrangement |
| 02/05/2015 | DE102013214896A1 Verfahren zum Herstellen eines Konverterelements und eines optoelektronischen Bauelements, Konverterelement und optoelektronisches Bauelement A method for manufacturing a converter element and an optoelectronic component, converter element and optoelectronic component |
| 02/05/2015 | DE102013108213A1 Optoelektronisches Bauelement Optoelectronic component |
| 02/05/2015 | DE102008045615B4 Leistungshalbleitermodul, Verfahren zur Herstellung eines Leistungshalbleitermoduls und System mit einem Leistungshalbleitermodul Power semiconductor module, method for producing a power semiconductor module and system having a power semiconductor module |
| 02/04/2015 | EP2833405A1 Semiconductor device, and method for manufacturing semiconductor device |
| 02/04/2015 | EP2833404A1 Semiconductor device and method for manufacturing semiconductor device |
| 02/04/2015 | EP2831933A1 Optical cavity including a light emitting device and wavelength converting material |
| 02/04/2015 | EP2831912A1 Conduction cooling of multi-channel flip chip based panel array circuits |
| 02/04/2015 | EP2831493A1 Pre-rotated overmolded bidirectional spreading lens for stretched leadframe architecture |
| 02/04/2015 | CN204144304U 一种透明柔性led显示芯片 A transparent flexible led display chip |
| 02/04/2015 | CN204144256U 三只脚引脚式触发闪灯led Three feet pin-type trigger flashing lights led |
| 02/04/2015 | CN204144255U 两只脚引脚式光敏触发闪灯led Two feet led flash trigger pin type photosensitive |
| 02/04/2015 | CN204144254U 全彩led封装结构 Full color led package |
| 02/04/2015 | CN204144253U 一种快恢复二极管模块 In fast recovery diode module |
| 02/04/2015 | CN204144252U 一体化超量子led发光装置 Ultra-light-emitting devices integrated quantum led |