| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/24/2015 | US8963335 Tunable composite interposer |
| 02/24/2015 | US8963334 Die-to-die gap control for semiconductor structure and method |
| 02/24/2015 | US8963333 Apparatus, system, and method for wireless connection in integrated circuit packages |
| 02/24/2015 | US8963329 Semiconductor device |
| 02/24/2015 | US8963323 Heat-transfer structure |
| 02/24/2015 | US8963321 Semiconductor device including cladded base plate |
| 02/24/2015 | US8963319 Semiconductor chip with through hole vias |
| 02/24/2015 | US8963318 Packaged semiconductor device |
| 02/24/2015 | US8963317 Thermal dissipation through seal rings in 3DIC structure |
| 02/24/2015 | US8963308 Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device |
| 02/24/2015 | US8963307 Compact device package |
| 02/24/2015 | US8963302 Stacked packaged integrated circuit devices, and methods of making same |
| 02/24/2015 | US8963297 Semiconductor apparatus |
| 02/24/2015 | US8963278 Three-dimensional integrated circuit device using a wafer scale membrane |
| 02/24/2015 | US8963182 Solid state white light emitter and display using same |
| 02/24/2015 | US8963172 Optical semiconductor device including antiparallel semiconductor light-emitting element and Schottky diode element |
| 02/24/2015 | US8963168 LED lamp using blue and cyan LEDs and a phosphor |
| 02/24/2015 | US8963098 Direct conversion X-ray detector with radiation protection for electronics |
| 02/24/2015 | US8962481 Chip-on-wafer structures and methods for forming the same |
| 02/24/2015 | US8962480 ESD network circuit with a through wafer via structure and a method of manufacture |
| 02/24/2015 | US8962393 Integrated circuit packaging system with heat shield and method of manufacture thereof |
| 02/24/2015 | US8962390 Method for manufacturing a chip packaging structure |
| 02/24/2015 | US8961725 Component placement on flexible and/or stretchable substrates |
| 02/24/2015 | US8960970 Light emitting device and method for manufacturing same |
| 02/24/2015 | US8960953 Lighting source using solid state emitter and phosphor materials |
| 02/24/2015 | US8960932 Light emitting device |
| 02/24/2015 | US8959759 Method for assembling computer modules small in thickness |
| 02/19/2015 | US20150050778 Method and apparatus for producing semiconductor device |
| 02/19/2015 | US20150050777 Integrated circuit package having surface-mount blocking elements |
| 02/19/2015 | US20150050761 Light emitting diodes and a method of packaging the same |
| 02/19/2015 | US20150049459 White light emitting module |
| 02/19/2015 | US20150048524 Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another |
| 02/19/2015 | US20150048523 Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer |
| 02/19/2015 | US20150048522 Semiconductor package |
| 02/19/2015 | US20150048520 Magnetic contacts |
| 02/19/2015 | US20150048500 Multi-Chip Structure and Method of Forming Same |
| 02/19/2015 | US20150048407 Optoelectronic chip-on-board module |
| 02/19/2015 | US20150048395 Optical cavity including a light emitting device and wavelength converting material |
| 02/19/2015 | US20150048393 High density multi-chip led devices |
| 02/19/2015 | US20150048392 Wavelength conversion element, light-emitting semiconductor device and display apparatus therewith, and method for producing a wavelength conversion element |
| 02/19/2015 | US20150048391 Semiconductor light-emitting device |
| 02/19/2015 | US20150048390 Semiconductor light emitting device and fabrication method for same |
| 02/19/2015 | DE102014111533A1 Chipanordnung Chip system |
| 02/19/2015 | DE102014110933A1 Mehrchip-Gehäuse auf Glasbasis Multi-chip package on glass base |
| 02/19/2015 | DE102014102018B3 Leistungshalbleitermodul mit niederinduktiv ausgestalteten modulinternen Last- und Hilfsverbindungseinrichtungen Power semiconductor module with low inductance module configured internal load and auxiliary connecting devices |
| 02/19/2015 | DE102013108805A1 Thermoelektrisches Modul sowie Verfahren zum Herstellen eines thermoelektrischen Moduls The thermoelectric module as well as method of making a thermoelectric module |
| 02/19/2015 | DE102013107967A1 Optoelektronischer Halbleiterchip, optoelektronisches Bauelement und Verfahren zur Herstellung von Halbleiterchips The optoelectronic semiconductor chip, optoelectronic component and process for producing semiconductor chips |
| 02/18/2015 | EP2838117A1 LED lighting device |
| 02/18/2015 | EP2838116A1 Stacked packaging structure |
| 02/18/2015 | EP2837023A1 Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods |
| 02/17/2015 | US8958667 Optical bus in 3D integrated circuit stack |
| 02/17/2015 | US8958225 Electric power converter |
| 02/17/2015 | US8958215 Circuit board for peripheral circuits of high-capacity modules, and a high-capacity module including a peripheral circuit using the circuit board |
| 02/17/2015 | US8957923 Light emitting device, light emitting element array, and image display device |
| 02/17/2015 | US8957695 Semiconductor device having plural semiconductor chip stacked with one another |
| 02/17/2015 | US8957530 Integrated circuit packaging system with embedded circuitry and post |
| 02/17/2015 | US8957529 Power voltage supply apparatus for three dimensional semiconductor |
| 02/17/2015 | US8957527 Microelectronic package with terminals on dielectric mass |
| 02/17/2015 | US8957526 Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages |
| 02/17/2015 | US8957525 3D semiconductor interposer for heterogeneous integration of standard memory and split-architecture processor |
| 02/17/2015 | US8957513 Semiconductor device with embedded interconnect pad |
| 02/17/2015 | US8957511 Apparatus and methods for high-density chip connectivity |
| 02/17/2015 | US8957509 Integrated circuit packaging system with thermal emission and method of manufacture thereof |
| 02/17/2015 | US8957497 Vertically integrated systems |
| 02/17/2015 | US8957488 Self powering application specific integrated circuit |
| 02/17/2015 | US8957457 Method for manufacturing a semiconductor chip stack device |
| 02/17/2015 | US8957444 Semiconductor light emitting device |
| 02/17/2015 | US8957435 Lighting device |
| 02/17/2015 | US8957430 Gel underfill layers for light emitting diodes |
| 02/17/2015 | US8957428 Coated light emitting device and method for coating thereof |
| 02/17/2015 | US8957300 Substrate for photoelectric conversion device, photoelectric conversion device, and stacked photoelectric conversion device |
| 02/17/2015 | US8956922 Coating method for an optoelectronic chip-on-board module |
| 02/17/2015 | US8956921 Method of molding semiconductor package |
| 02/17/2015 | US8956916 Multi-chip module with stacked face-down connected dies |
| 02/17/2015 | US8956915 Method of manufacturing a three-dimensional packaging semiconductor device |
| 02/17/2015 | US8956914 Integrated circuit package system with overhang die |
| 02/17/2015 | US8956899 Method of fabricating a display device with step configuration in the insulating layer |
| 02/17/2015 | US8956889 Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC) |
| 02/17/2015 | US8956887 Method for manufacturing semiconductor light-emitting element |
| 02/17/2015 | US8956007 Encapsulating sheet, producing method thereof, light emitting diode device, and producing method thereof |
| 02/17/2015 | US8955216 Method of making a compliant printed circuit peripheral lead semiconductor package |
| 02/12/2015 | WO2015021160A1 Method to enhance reliability of through mold via package on package assemblies |
| 02/12/2015 | WO2015020836A2 Multi-die fine grain integrated voltage regulation |
| 02/12/2015 | WO2015020176A1 Connection terminal, power module, and energization unit |
| 02/12/2015 | WO2015019931A1 Solid state image pickup device and image pickup device |
| 02/12/2015 | WO2015019519A1 Dc-dc converter module |
| 02/12/2015 | WO2015018784A1 Process for manufacturing a semiconductor structure with temporary bonding via metal layers |
| 02/12/2015 | US20150044821 Method for fabricating multi-chip stack structure |
| 02/12/2015 | US20150044819 Packaging Methods and Structures for Semiconductor Devices |
| 02/12/2015 | US20150041991 Semiconductor device |
| 02/12/2015 | US20150041978 Semiconductor device |
| 02/12/2015 | US20150041976 Semiconductor device sealed in a resin section and method for manufacturing the same |
| 02/12/2015 | US20150041975 Semiconductor package and fabricating method thereof |
| 02/12/2015 | US20150041972 Semiconductor package and fabrication method thereof |
| 02/12/2015 | US20150041835 Light-emitting device and lighting device provided with the same |
| 02/12/2015 | US20150041834 Light-emitting diodes |
| 02/12/2015 | US20150041687 Optical coupling device and method of manufacturing optical coupling device |
| 02/12/2015 | US20150040944 Pv wind performance enhancing methods and apparatus |
| 02/12/2015 | DE102014213541A1 Halbleitervorrichtung Semiconductor device |
| 02/12/2015 | DE102014111438A1 Gekapselte Leistungstransistoren und Leistungsbausteine Encapsulated power transistors and power devices |