| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 05/19/2011 | WO2011058094A1 Thin-film semiconductor device with protection diode structure and method for producing a thin-film semiconductor device |
| 05/19/2011 | WO2011057433A1 Light emitting diode lamp bar and manufacture method thereof, light emitting diode lamp tube |
| 05/19/2011 | WO2010096715A3 Photovoltaic multi-junction wavelength compensation system and method |
| 05/19/2011 | US20110116078 Infrared image sensor |
| 05/19/2011 | US20110115758 Semiconductor Device and Method of Driving the Semiconductor Device |
| 05/19/2011 | US20110115098 Integrated circuit package system with dual side connection and method for manufacturing thereof |
| 05/19/2011 | DE112009001638T5 Leistungshalbleitermodul The power semiconductor module |
| 05/19/2011 | DE102008029194B4 Verfahren zum Ausbilden einer Metallelektrode eines Systems in einem Gehäuse A method of forming a metal electrode of a system in a housing |
| 05/18/2011 | EP2321851A2 Support for solar cells and method for producing a group of solar cells |
| 05/18/2011 | EP2321576A1 Color tunable light source |
| 05/18/2011 | EP2001050B1 Method for manufacturing substrate having electric component |
| 05/18/2011 | CN201838595U Light-mixed type luminous diode encapsulating structure capable of adjusting brightness and divisionally lightening light source |
| 05/18/2011 | CN201838594U Annular packaging structure |
| 05/18/2011 | CN201838593U Rapid recovery diode module |
| 05/18/2011 | CN201838592U LED light source |
| 05/18/2011 | CN201838591U Anti-static protection diode structure |
| 05/18/2011 | CN201838590U Twin-wafer high-color-rendering-property warm white light packaging structure |
| 05/18/2011 | CN201838589U LED luminous module |
| 05/18/2011 | CN201838588U Power type LED lamp |
| 05/18/2011 | CN201838587U Single-phase rectifying bridge |
| 05/18/2011 | CN201838586U Encapsulation, synchronous rectification circuit, integrated circuit and power supply adapter of synchronous rectification unit |
| 05/18/2011 | CN201838585U Stackable chip packaging structure and base plate thereof |
| 05/18/2011 | CN102067310A Stacking of wafer-level chip scale packages having edge contacts |
| 05/18/2011 | CN102067309A Power semiconductor module |
| 05/18/2011 | CN102067308A Active thermal control for stacked ic devices |
| 05/18/2011 | CN102067307A Apparatus and system for a single element solar cell |
| 05/18/2011 | CN102064267A Light emitting diode (LED) support unit for display screen, LED support and method for manufacturing LED support unit |
| 05/18/2011 | CN102064265A Semiconductor chip assembly with post/base heat spreader and substrate |
| 05/18/2011 | CN102064247A Packaging method and packaging structure for embedded light emitting diode |
| 05/18/2011 | CN102064172A Light-emitting diode packaging structure |
| 05/18/2011 | CN102064171A Light-emitting diode (LED) device |
| 05/18/2011 | CN102064170A White LED chip and preparation method thereof |
| 05/18/2011 | CN102064169A Single-chip white-light LED and preparation method thereof |
| 05/18/2011 | CN102064168A Electroluminescent/photoinduced mixed white LED chip and manufacturing method |
| 05/18/2011 | CN102064167A Helical packaging structure of light-emitting semiconductor chip and light-emitting semiconductor light source device thereof |
| 05/18/2011 | CN102064166A Curved surface package structure of light-emitting semiconductor chip and light-emitting semiconductor light source device thereof |
| 05/18/2011 | CN102064165A Novel LED (Light Emitting Diode) device |
| 05/18/2011 | CN102064164A Freely combined lamp wick of flip-chip power LED tube core |
| 05/18/2011 | CN102064163A Stack package assembly |
| 05/18/2011 | CN102064162A Stacked package structure, package structure thereof and manufacture method of the package structure |
| 05/18/2011 | CN102064161A Optimized power package structure of intelligent power module |
| 05/18/2011 | CN102064160A Power module containing special power terminal |
| 05/18/2011 | CN102064159A Multi-module packaged component |
| 05/18/2011 | CN102064158A Compact power module |
| 05/18/2011 | CN102064157A System encapsulation module of wireless local area network |
| 05/18/2011 | CN102064156A Poly-crystal type LED (light emitting diode) package structure for generating quasi-circular light-emitting effect |
| 05/18/2011 | CN102064153A Semiconductor device and method of manufacturing the semiconductor device |
| 05/18/2011 | CN102064119A Method of fabricating a semiconductor device |
| 05/18/2011 | CN102064113A No-wire bonding packaging method and finished products of power semiconductor chip |
| 05/18/2011 | CN102064107A High-voltage diode for frequency-variable microwave oven and production process thereof |
| 05/18/2011 | CN102062912A Optical interconnect device and method for manufacturing the same |
| 05/18/2011 | CN102062312A 半导体发光结构以及半导体光源 The semiconductor light emitting structure and the semiconductor light source |
| 05/18/2011 | CN101789424B LED circuit board fixedly connected by overbridge board |
| 05/18/2011 | CN101615583B Chip stacking structure forming method |
| 05/18/2011 | CN101593747B A semiconductor device assembly and a method of establishing electric connection in the semiconductor device assembly |
| 05/18/2011 | CN101562174B LED chip encapsulating structure for backlight module and preparing method thereof |
| 05/18/2011 | CN101401197B 电子元器件模块 Electronic Component Module |
| 05/18/2011 | CN101313402B Double-faced electrode package, and its manufacturing method |
| 05/18/2011 | CN101312183B Semiconductor device |
| 05/18/2011 | CN101290104B LED illuminating apparatus |
| 05/17/2011 | USRE42363 Stackable electronic assembly |
| 05/17/2011 | US7944058 Semiconductor device and process for fabricating the same |
| 05/17/2011 | US7944057 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
| 05/17/2011 | US7943905 Infrared solid-state image sensor |
| 05/17/2011 | US7943904 Bispectral detection device and bispectral detector comprising said device |
| 05/17/2011 | US7943847 Apparatus and methods for solar energy conversion using nanoscale cometal structures |
| 05/17/2011 | US7943422 Wafer level pre-packaged flip chip |
| 05/12/2011 | US20110110064 Integrating Circuit Die Stacks Having Initially Identical Dies Personalized With Fuses |
| 05/12/2011 | US20110109762 Pixel and image processing devices having the same |
| 05/12/2011 | US20110109382 Semiconductor apparatus |
| 05/12/2011 | US20110109381 Integrated Circuit Die Stacks With Rotationally Symmetric Vias |
| 05/12/2011 | US20110109352 Summation Circuit in DC-DC Converter |
| 05/12/2011 | US20110108976 Stacked integrated circuit and package system and method for manufacturing thereof |
| 05/12/2011 | US20110108972 Integrated Circuit Die Stacks With Translationally Compatible Vias |
| 05/12/2011 | DE102009053255A1 Verfahren zum Herstellen einer Anordnung A method for manufacturing an array |
| 05/12/2011 | DE102008018221B4 System mit Schutz für Schaltungsplatinen System with protection circuit boards |
| 05/11/2011 | EP2320459A2 Power semiconductor module |
| 05/11/2011 | EP2320458A1 Semiconductor device |
| 05/11/2011 | EP2319099A2 Optoelectronic component |
| 05/11/2011 | EP2319079A1 System and method for utility pole distributed solar power generation |
| 05/11/2011 | CN201829500U Integrated patch unit |
| 05/11/2011 | CN201829499U Heat pipe type high-power LED module |
| 05/11/2011 | CN201829498U Light emitting diode (LED) integrated light source panel |
| 05/11/2011 | CN201829497U High-power multi-chip integrated light-emitting diode (LED) |
| 05/11/2011 | CN201829496U High-brightness light emitting diode (LED) color optical module for illumination or display equipment |
| 05/11/2011 | CN201829495U Common-cathode dual-diode internal encapsulation structure |
| 05/11/2011 | CN201829494U Parallel LED chip packaging structure |
| 05/11/2011 | CN201829493U Hybrid integrated circuit with highly reliable power |
| 05/11/2011 | CN201829477U Plastic biserial collinear packaging plastic package body, plastic package body array and packaging device |
| 05/11/2011 | CN201829476U Straight-side metal cover semiconductor package |
| 05/11/2011 | CN201827836U Radiating device of light emitting diode (LED) array illumination device |
| 05/11/2011 | CN201827760U Multi-chip matrix type structure-packaged light-emitting diode (LED) lamp for growth of plants |
| 05/11/2011 | CN201827733U LED (light-emitting diode) lamp |
| 05/11/2011 | CN102057488A Method for manufacturing semiconductor device |
| 05/11/2011 | CN102054830A Power semiconductor module and method for driving the same |
| 05/11/2011 | CN102054829A Encapsulation structure of LED |
| 05/11/2011 | CN102054828A Packaging shell and packaging structure of edge type light emitting component |
| 05/11/2011 | CN102054827A Light-emitting diode wafer encapsulation body and encapsulation method thereof |
| 05/11/2011 | CN102054826A Novel baseplate-free power module |
| 05/11/2011 | CN102054825A BiDi-ST type miniaturization photoelectric transmit-receive module |