| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/11/2011 | CN102054824A Semiconductor apparatus and chip selection method thereof |
| 05/11/2011 | CN102054823A Semiconductor apparatus and chip selection method thereof |
| 05/11/2011 | CN102054822A Integrated circuits |
| 05/11/2011 | CN102054821A Packaging structure with internal shield and manufacturing method thereof |
| 05/11/2011 | CN102054793A Substrate member, module, electric equipment, and manufacturing method of modules |
| 05/11/2011 | CN102054787A Stack type package structure and manufacture method thereof |
| 05/11/2011 | CN102052624A Dimmer lighting assembly and manufacturing method thereof |
| 05/11/2011 | CN101740417B Method for producing stackable dies |
| 05/11/2011 | CN101630676B Novel isolated gate bipolar transistor module distributed with direct coated copper base plates |
| 05/11/2011 | CN101567357B Electronic device provided with wiring board, and wiring board for such electronic device |
| 05/11/2011 | CN101290929B Stack type chip packaging structure |
| 05/11/2011 | CN101075605B Structure for packing light-emitting diodes, backlight module and liquid crystal display device thereof |
| 05/10/2011 | USRE42349 Wafer treating method for making adhesive dies |
| 05/10/2011 | US7941689 Minimizing clock uncertainty on clock distribution networks using a multi-level de-skewing technique |
| 05/10/2011 | US7939927 Semiconductor memory apparatus |
| 05/10/2011 | US7939924 Stack type ball grid array package and method for manufacturing the same |
| 05/10/2011 | US7939831 Semiconductor device and method of manufacturing the same |
| 05/10/2011 | US7939745 Compound thin-film solar cell and process for producing the same |
| 05/10/2011 | US7939373 Manufacturing method for semiconductor device containing stacked semiconductor chips |
| 05/10/2011 | US7938005 Acceleration sensor chip package |
| 05/05/2011 | WO2011053182A1 Information storage and processing device (ispd) |
| 05/05/2011 | WO2011052746A1 Element mounting substrate, semiconductor module, and portable apparatus |
| 05/05/2011 | WO2011051084A1 Optoelectronic component and method for producing an opto-electronic component |
| 05/05/2011 | WO2011050642A1 Led street lamp |
| 05/05/2011 | US20110103020 Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices |
| 05/05/2011 | US20110102076 Semiconductor integrated circuit |
| 05/05/2011 | US20110102075 Power distribution system for integrated circuits |
| 05/05/2011 | US20110102074 Programmable rf array |
| 05/05/2011 | US20110102019 Semiconductor device formed on a soi substrate |
| 05/05/2011 | US20110102014 Three dimensional integrated circuits |
| 05/05/2011 | US20110102010 Method and apparatus for reconfigurable at-speed test clock generator |
| 05/05/2011 | US20110101522 Multichip semiconductor device, chip therefor and method of formation thereof |
| 05/05/2011 | US20110101512 Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate |
| 05/05/2011 | US20110101497 Method for fabricating a flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor |
| 05/05/2011 | DE112009001706T5 Metallische Nanotinte und Verfahren zur Herstellung der metallischen Nanotinte, sowie Verfahren zum Chipbonden und Vorrichtung zum Chipbonden unter Verwendung der metallischen Nanotinte Metallic nano ink and process for preparing the metal nano ink, and to methods of chip bonding and die bonding apparatus for using the metal nano ink |
| 05/05/2011 | DE102009046858B3 Leistungshalbleitermodul und Verfahren zum Betrieb eines Leistungshalbleitermoduls The power semiconductor module and method of operating a power semiconductor module |
| 05/05/2011 | DE102009046403A1 Leistungshalbleitermodul The power semiconductor module |
| 05/04/2011 | EP2317567A1 Organic photosensitive optoelectronic device |
| 05/04/2011 | EP2317552A2 Light-emitting device, method of manufacturing light-emitting device, and illumination device |
| 05/04/2011 | EP2317551A1 Power module assembly with reduced inductance |
| 05/04/2011 | EP2317543A2 Gas for plasma reaction, process for producing the same and use |
| 05/04/2011 | EP2317206A1 Illuminating device and method for manufacturing the same |
| 05/04/2011 | EP2317205A1 Housing of LED light source comprising electrical connector |
| 05/04/2011 | EP2316131A1 Thermally optimised led chip-on-board module |
| 05/04/2011 | EP2316130A2 Optoelectronic component |
| 05/04/2011 | EP2316128A1 Power electronics device |
| 05/04/2011 | CN201820787U Copolar full-colored surface-mounted light emitting diode |
| 05/04/2011 | CN201820758U LED integrated structure with cooling device |
| 05/04/2011 | CN201820757U LED (light-emitting diode) light source module packaging structure |
| 05/04/2011 | CN201820756U LED (light-emitting diode) device based on metal plate radiating |
| 05/04/2011 | CN201820755U 发光二极管 Led |
| 05/04/2011 | CN201820754U Chip type bridge rectifier modulated band filter (MBF) packaging structure |
| 05/04/2011 | CN201820753U Multi-chip encapsulation module for electronic equipments under coal mine |
| 05/04/2011 | CN201819032U Heat-to-electricity conversion power-saving light-emitting diode (LED) illuminating equipment |
| 05/04/2011 | CN1744314B Semiconductor device having laminated structure and manufacturing method |
| 05/04/2011 | CN102047419A Four MOSFET full bridge module |
| 05/04/2011 | CN102044600A Light-emitting diode (LED) encapsulating structure and preparation method thereof |
| 05/04/2011 | CN102044537A Light-emitting diode packaging structure |
| 05/04/2011 | CN102044536A Photoelectric energy conversion device |
| 05/04/2011 | CN102044535A Surface mounted device (SMD) light emitting diode (LED) device and display module thereof for outdoor display screen |
| 05/04/2011 | CN102044534A Light-emitting diode encapsulation structure capable of enhancing heat-radiating and light-emitting effects and manufacturing method thereof |
| 05/04/2011 | CN102044533A Multichip package and method of manufacturing the same |
| 05/04/2011 | CN102044532A Wireless communication module and manufacturing method thereof |
| 05/04/2011 | CN102044531A Apparatus and method for vertically-structured passive components |
| 05/04/2011 | CN102044530A System packaging structure and manufacture method thereof |
| 05/04/2011 | CN102044529A System packaging structure and manufacture method thereof |
| 05/04/2011 | CN102044528A Stacked packaging member and manufacturing method thereof |
| 05/04/2011 | CN102044527A Overlapped packaging structure and manufacturing method thereof |
| 05/04/2011 | CN102044522A Multi-chip stacking structure |
| 05/04/2011 | CN102044516A Chip lead rack and photoelectric energy conversion module |
| 05/04/2011 | CN102044512A Integrated circuit and multi-chip module stacked in three dimensions |
| 05/04/2011 | CN102044449A Semiconductor package and method of manufacturing the same |
| 05/04/2011 | CN102044447A Packaging technology and packaging structure |
| 05/04/2011 | CN102044404A System for separating cut semiconductor bare chip from bare chip adhesive tape |
| 05/04/2011 | CN102042500A A light source module and a manufacturing method for the same |
| 05/04/2011 | CN101737662B Method for manufacturing integrated packaged high-power LED illuminating light source, and LED illuminating lamp |
| 05/04/2011 | CN101577267B 芯片封装结构 Chip package structure |
| 05/04/2011 | CN101471334B Light-emitting device and manufacturing method thereof |
| 05/04/2011 | CN101459165B Electronic component wafer module, manufacturing method thereof and electronic information device |
| 05/04/2011 | CN101431068B 半导体封装模块 The semiconductor package module |
| 05/04/2011 | CN101383295B Process for producing optical semiconductor device and slice used in same process |
| 05/04/2011 | CN101359652B Coil type chip encapsulation construction |
| 05/04/2011 | CN101276809B Semiconductor device and method of manufacturing the same |
| 05/04/2011 | CN101276796B Carbon nanotube-reinforced solder caps, methods of assembling same and chip packages and systems containing same |
| 05/04/2011 | CN101273679B Method for mounting electronic-component module, method for manufacturing electronic apparatus using the same, and electronic-component module |
| 05/04/2011 | CN101271915B 发光二极管 Led |
| 05/04/2011 | CN101171685B Rgb热隔离衬底 Rgb thermal insulating substrate |
| 05/04/2011 | CN101170107B Method of manufacturing a white light emitting organic EL device |
| 05/03/2011 | USRE42318 Semiconductor module with serial bus connection to multiple dies |
| 05/03/2011 | US7936210 Gallium nitride traveling wave structures |
| 05/03/2011 | US7936184 Apparatus and methods for adjusting performance of programmable logic devices |
| 05/03/2011 | US7935928 Device and method for producing images |
| 05/03/2011 | US7935884 Encapsulant layer for photovoltaic module, photovoltaic module and method for manufacturing regenerated photovoltaic cell and regenerated transparent front face substrate |
| 05/03/2011 | US7935622 Support with solder ball elements and a method for populating substrates with solder balls |
| 05/03/2011 | US7935572 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages |
| 05/03/2011 | US7935569 Components, methods and assemblies for stacked packages |
| 04/28/2011 | WO2011048858A1 Device mounting structure and device mounting method |
| 04/28/2011 | WO2011048774A1 Process for production of electronic device, electronic device, and device for production of electronic device |
| 04/28/2011 | WO2011048719A1 Power semiconductor module |
| 04/28/2011 | WO2011048717A1 Semiconductor device |