| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 06/03/2011 | WO2011064180A1 Led lamp having a pin socket for halogen lamps ('bi-pin') |
| 06/03/2011 | WO2011044385A3 Vertically stackable dies having chip identifier structures |
| 06/03/2011 | WO2010102911A3 Led module for modified lamps and modified led lamp |
| 06/02/2011 | US20110128073 Semiconductor integrated circuit |
| 06/02/2011 | US20110128072 Repair circuit and semiconductor apparatus including the same |
| 06/01/2011 | EP2328265A1 Inverter device |
| 06/01/2011 | EP2327100A1 Method and system for converting light to electric power |
| 06/01/2011 | EP2327099A1 Device, system and method for directly generating alternating current electricity from photovoltaic cells |
| 06/01/2011 | EP2327096A1 Improvements in or relating to solid-state lasers |
| 06/01/2011 | EP2327094A1 Signal delivery in stacked device |
| 06/01/2011 | EP2327092A1 Corrosion control of stacked integrated circuits |
| 06/01/2011 | EP2326868A1 Colour mixing method for consistent colour quality |
| 06/01/2011 | DE102010002332A1 Retrofit LED-Lampe mit warmweissem, insbesondere flammenartigem Weisslicht Retrofit LED lamp with warmweissem, especially flammenartigem white light |
| 06/01/2011 | DE102009047235A1 Schaltungseinrichtung und Leistungsschaltkreis mit der Schaltungseinrichtung Circuit, and power circuit with the circuit device |
| 06/01/2011 | DE102009034138B4 Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement Power semiconductor module having a sandwich with a power semiconductor component |
| 06/01/2011 | DE102007050893B4 Verfahren zum Positionieren und Montieren einer LED-Baueinheit sowie Positionierkörper hierfür A method for positioning and mounting an LED assembly and positioning body for this purpose |
| 06/01/2011 | CN201853738U Light-emitting diode packaging structure |
| 06/01/2011 | CN201853705U Mounting device for RC (resistor-capacitor) absorption circuit |
| 06/01/2011 | CN201853704U LED module |
| 06/01/2011 | CN201853703U Light-emitting diode lamp substrate with high cooling efficiency and lamp module of same |
| 06/01/2011 | CN201853702U Flexible semi-conductor component |
| 06/01/2011 | CN201853701U High-power brake unit |
| 06/01/2011 | CN201853700U Array type double in-line package (DIP) lead frame and integrated circuit (IC) encapsulating piece of frame |
| 06/01/2011 | CN102084459A Multi-junction silicon thin film solar cell using plasma inside vapor deposition |
| 06/01/2011 | CN102082220A LED and manufacturing process thereof |
| 06/01/2011 | CN102082142A 封装结构 Package structure |
| 06/01/2011 | CN102082141A Polycrystalline light-emitting diode packaging structure for generating similar round light-emitting effect |
| 06/01/2011 | CN102082140A Bilateral high-voltage transient voltage suppressor (TVS) |
| 06/01/2011 | CN102082132A High-power semiconductor module structure and package thereof |
| 06/01/2011 | CN102082128A Semiconductor package and method of mounting semiconductor die to opposite sides of tsv substrate |
| 06/01/2011 | CN102082102A Semiconductor device and method of forming compliant stress relief buffer |
| 06/01/2011 | CN101661982B LED packager |
| 06/01/2011 | CN101630716B Platy LED metal substrate, platy LED light emitting device and manufacturing method thereof |
| 06/01/2011 | CN101627465B Adhesive film for semiconductor and semiconductor device using the adhesive film |
| 05/31/2011 | US7952201 Semiconductor device including stacked semiconductor chips |
| 05/31/2011 | US7952194 Silicon interposer-based hybrid voltage regulator system for VLSI devices |
| 05/31/2011 | US7952080 Radiation detecting cassette and medical system |
| 05/31/2011 | US7952017 Multifocal light concentrator for a device for the conversion of radiation, and in particular for the conversion of solar radiation into electrical, thermal or chemical energy |
| 05/31/2011 | US7951863 Coated package with filter profile |
| 05/31/2011 | US7950831 Recessed LED lamp unit |
| 05/26/2011 | WO2011062242A1 Sensor device and method of manufacture thereof |
| 05/26/2011 | WO2011061296A1 Method for producing stacks on a plurality of levels of silicon chip assemblies |
| 05/26/2011 | WO2011060714A1 Led light emitting module and manufacturing method thereof |
| 05/26/2011 | US20110122121 Semiconductor device |
| 05/26/2011 | US20110121443 Semiconductor device |
| 05/26/2011 | US20110121435 Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor device |
| 05/26/2011 | US20110121433 Semiconductor chip and stacked semiconductor package having the same |
| 05/26/2011 | US20110121365 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 05/26/2011 | DE102009054067A1 Licht emittierende Vorrichtung Light emitting device |
| 05/26/2011 | DE102009050178B3 Leistungshalbleitermodul mit einem eine dreidimensionale Oberflächenkontur aufweisenden Substrat sowie Herstellungsverfahren hierzu Power semiconductor module for this purpose with a three-dimensional surface contour containing substrate and manufacturing method |
| 05/26/2011 | DE102008022733B4 Funktionseinheit und Verfahren zu deren Herstellung Functional unit and methods for their preparation |
| 05/26/2011 | DE10160638B4 Halbleiterbauelement Semiconductor device |
| 05/25/2011 | EP2325904A2 Micro-led array with enhanced light extraction |
| 05/25/2011 | EP2325903A1 Light emitting diode with micro-LED array for light extraction enhancement |
| 05/25/2011 | EP2325900A1 Semiconductor light emitting element and semiconductor light emitting device |
| 05/25/2011 | EP2325883A2 Light emitting module and vehicle lamp |
| 05/25/2011 | EP2325882A1 Method for manufacturing semiconductor device |
| 05/25/2011 | EP2325878A1 Wafer-scale encapsulation process of electronic devices |
| 05/25/2011 | EP2324501A1 Illumination means |
| 05/25/2011 | EP2324500A1 System and method for excess voltage protection in a multi-die package |
| 05/25/2011 | EP2324497A1 3d chip-stack with fuse-type through silicon via |
| 05/25/2011 | CN201845774U High color rendering white light LED module |
| 05/25/2011 | CN201845773U High-power LED (Light Emitting Diode) packaging module |
| 05/25/2011 | CN201845772U Miniaturized radiation-resistant detector assembly |
| 05/25/2011 | CN201845771U High-power module with novel encapsulating structure |
| 05/25/2011 | CN201845770U Integrated power semiconductor type power module |
| 05/25/2011 | CN201845769U Compact power module |
| 05/25/2011 | CN201845767U Novel encapsulating structure of N-base diode anode-connected half-bridge in TO-220 |
| 05/25/2011 | CN201845755U Electric crystal of stably arranged crystal plate |
| 05/25/2011 | CN201844245U White light LED capable of adjusting color temperature |
| 05/25/2011 | CN102077345A Grounding system and apparatus |
| 05/25/2011 | CN102077344A Through silicon via bridge interconnect |
| 05/25/2011 | CN102074637A Method and structure for encapsulating solid-state luminous chips and light source device using encapsulation structure |
| 05/25/2011 | CN102074559A SiP (Session Initiation Protocol) system integrated-level IC (Integrated Circuit) chip packaging part and manufacturing method thereof |
| 05/25/2011 | CN102074558A Light-emitting device and lighting appliance |
| 05/25/2011 | CN102074557A Light emitting device |
| 05/25/2011 | CN102074556A Semiconductor device and manufacturing method thereof |
| 05/25/2011 | CN102074555A Device and interconnect in flip chip architecture |
| 05/25/2011 | CN102074554A Heat conduction board and mounting method of electronic components |
| 05/25/2011 | CN102074540A Matrix dual in-line package (DIP) lead frame, integrated circuit (IC) packages based on frame and production method of IC packages |
| 05/25/2011 | CN102074539A Package for semiconductor devices |
| 05/25/2011 | CN102074537A Chip packaging cell |
| 05/25/2011 | CN102074517A Ball grid array (BGA) package structure |
| 05/25/2011 | CN102074487A 半导体组装结构与其形成方法 Structure and its method of forming a semiconductor assembly |
| 05/25/2011 | CN102072422A Packaging structure of high-power LED (light emitting diode) light source module |
| 05/25/2011 | CN102072418A AC light-emitting diode device with high reliability and long service life |
| 05/25/2011 | CN101800214B Construction method of anti-electromagnetic interference electronic module |
| 05/25/2011 | CN101631896B Method of forming film, heat transfer member, power module, inverter for vehicle and vehicle |
| 05/25/2011 | CN101542701B Bonding method of three dimensional wafer lamination based on silicon through holes |
| 05/25/2011 | CN101517757B Led semiconductor element, and use thereof |
| 05/25/2011 | CN101471374B Image sensor and method for manufacturing the sensor |
| 05/25/2011 | CN101419963B Wafer-wafer encapsulation body and manufacturing process therefor |
| 05/25/2011 | CN101320938B Multi-use power module |
| 05/24/2011 | US7949971 Method and apparatus for on-the-fly minimum power state transition |
| 05/24/2011 | US7948307 Dual dielectric tri-gate field effect transistor |
| 05/24/2011 | US7948071 Integrated circuit with re-route layer and stacked die assembly |
| 05/24/2011 | US7947998 LED lamps |
| 05/19/2011 | WO2011058999A1 Method for manufacturing film-like adhesive, adhesive sheet, semiconductor device, and method for manufacturing semiconductor device |
| 05/19/2011 | WO2011058688A1 Semiconductor device and noise suppression method |
| 05/19/2011 | WO2011058607A1 Insulating structure and method for manufacturing same |