| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/28/2011 | WO2011048063A1 Improvements in or relating to opto-electrical assemblies and associated apparatus and methods |
| 04/28/2011 | WO2008144573A3 Semiconductor device including stacked dies |
| 04/28/2011 | US20110097848 Method for Connecting a Die Assembly to a Substrate in an Integrated Circuit and a Semiconductor Device Comprising a Die Assembly |
| 04/28/2011 | US20110095816 Network on chip building bricks |
| 04/28/2011 | US20110095385 Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same |
| 04/28/2011 | US20110095311 Configuration of Multiple LED Module |
| 04/28/2011 | US20110095300 Thin film transistor array panel and method for manufacturing the same |
| 04/28/2011 | DE102010047609A1 Multichipmodul Multi-chip module |
| 04/28/2011 | DE102010042979A1 Array aus skalierbaren keramischen Diodenträgern mit LED's Scalable array of diodes ceramic carriers with LED's |
| 04/28/2011 | DE102009045948A1 Method for producing application-specific integrated circuit of layer composite, involves applying conductive material by ink jet printing process or dispensation such that material continuously passes from contact points up to substrate |
| 04/28/2011 | DE102004025279B4 Anlage für ein Bestücken von Substraten mit Kugelkontakten und Verfahren zum Bestücken von Substraten mit Kugelkontakten System for a loading substrates with ball contacts, and method for loading substrates with ball contacts |
| 04/27/2011 | EP2315245A1 Power semiconductor module with a substrate having a three dimensional surface contour and method for producing same |
| 04/27/2011 | EP2315243A1 Interposer between integrated circuits |
| 04/27/2011 | EP2313924A1 Grounding system and apparatus |
| 04/27/2011 | EP2313922A1 3d integrated circuit device fabrication using interface wafer as permanent carrier |
| 04/27/2011 | EP2313919A1 Through wafer via and method of making same |
| 04/27/2011 | EP1466371B1 Multi substrate organic light emitting devices |
| 04/27/2011 | CN201813319U Dual-grain rectifier |
| 04/27/2011 | CN201812855U Thermal serial combination type semiconductor refrigerator |
| 04/27/2011 | CN201812819U Schottky dual-cell chip |
| 04/27/2011 | CN201812818U Chip bipolar Schottky diode |
| 04/27/2011 | CN201812100U Night-vision safety goggles |
| 04/27/2011 | CN1926685B Light-emitting diode arrangement, and method for producing a light-emitting diode arrangement |
| 04/27/2011 | CN102037649A Formation of a hybrid integrated circuit device |
| 04/27/2011 | CN102037560A Method for making microstructures by converting porous silicon into porous metal or ceramics |
| 04/27/2011 | CN102034924A Light-emitting device and illumination device |
| 04/27/2011 | CN102034805A Package integrating thermoelectric component with chip |
| 04/27/2011 | CN102034804A Multilayer stacked storage and manufacture method thereof |
| 04/27/2011 | CN102034803A Semiconductor apparatus and control method of the same |
| 04/27/2011 | CN102034802A Standing chip scale package |
| 04/27/2011 | CN102034801A Semiconductor package structure |
| 04/27/2011 | CN102034800A Semiconductor device and adhesive sheet |
| 04/27/2011 | CN102034799A Chip package and fabrication method thereof |
| 04/27/2011 | CN102034798A Packaging structure and packaging process |
| 04/27/2011 | CN102034793A Relay board and semiconductor device having the relay board |
| 04/27/2011 | CN102034775A Semiconductor package with sectioned bonding wire scheme |
| 04/27/2011 | CN102034718A Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP |
| 04/27/2011 | CN102034528A System encapsulation integrated circuit for providing input reference voltage thereby |
| 04/27/2011 | CN102033152A Assemblies and methods for sensing current through semiconductor device leads |
| 04/27/2011 | CN102032486A AC light emitting diode and AC LED drive methods and apparatus |
| 04/27/2011 | CN102032483A Light-emitting diode (LED) plane light source |
| 04/27/2011 | CN101529325B Display system |
| 04/27/2011 | CN101236964B Semiconductor device including switching element and two diodes |
| 04/26/2011 | US7932746 One phase logic |
| 04/26/2011 | US7932743 Sequentially configurable programmable integrated circuit |
| 04/26/2011 | US7932624 Semiconductor module, and hybrid vehicle drive device including the same |
| 04/26/2011 | US7932612 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 04/26/2011 | US7932611 Device for alternately contacting two wafers |
| 04/26/2011 | US7932605 Semiconductor device and manufacturing method therefor |
| 04/26/2011 | US7932596 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 04/26/2011 | US7932566 Structure and system of mixing poly pitch cell design under default poly pitch design rules |
| 04/21/2011 | WO2011046887A1 Light source |
| 04/21/2011 | WO2011046512A1 Photovoltaic cell support assembly |
| 04/21/2011 | WO2011046071A1 Multilayer semiconductor integrated circuit device |
| 04/21/2011 | WO2011045929A1 Sensor device and method for producing sensor device |
| 04/21/2011 | WO2011045836A1 Sensor device and method for fabricating sensor device |
| 04/21/2011 | WO2011045153A1 Semiconductor component having a plated through-hole and method for the production thereof |
| 04/21/2011 | WO2010151340A8 Thin film solar module fabrication |
| 04/21/2011 | US20110092065 Semiconductor device suitable for a stacked structure |
| 04/21/2011 | US20110090005 Semiconductor device, semiconductor element, and substrate |
| 04/21/2011 | US20110090004 Reconfiguring through silicon vias in stacked multi-die packages |
| 04/21/2011 | US20110089564 Adhesive on wire stacked semiconductor package |
| 04/21/2011 | US20110089553 Stack-type solid-state drive |
| 04/21/2011 | US20110089552 Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof |
| 04/21/2011 | DE202010005878U1 Beleuchtungssystem Lighting system |
| 04/21/2011 | DE19937671B4 Luftgekühlte Stromrichter-Brückenschaltung Air-cooled converter bridge circuit |
| 04/21/2011 | DE102009049102A1 Halbleiterbauelement mit Durchkontaktierung und Verfahren zur Herstellung einer Durchkontaktierung in einem Halbleiterbauelement A semiconductor device having through-hole plating and method for making a via hole in a semiconductor device |
| 04/21/2011 | DE102009049057A1 LED-Modul, Verfahren zum Betreiben dieses LED-Moduls und Beleuchtungsvorrichtung mit diesem LED-Modul LED module, this method of operating the LED module and lighting device with this LED module |
| 04/21/2011 | DE102009048985A1 Modul mit mehreren thermoelektrischen Elementen Module having a plurality of thermoelectric elements |
| 04/21/2011 | DE102009045181A1 Leistungshalbleitermodul und Verfahren zum Betrieb eines Leistungshalbleitermoduls The power semiconductor module and method of operating a power semiconductor module |
| 04/20/2011 | EP2312631A1 Light emitting device and light emitting device package having the same |
| 04/20/2011 | EP2311089A1 Optical signaling for a package-on-package stack |
| 04/20/2011 | EP2311088A1 Through silicon via bridge interconnect |
| 04/20/2011 | EP1449268B1 Radial power megasonic transducer |
| 04/20/2011 | CN201804907U High-power LED |
| 04/20/2011 | CN201804865U LED (light-emitting diode) integrated structure with cooling device |
| 04/20/2011 | CN201804864U Power device packaging structure |
| 04/20/2011 | CN201804863U Luminous unit |
| 04/20/2011 | CN201804862U Single three-chip LED particle |
| 04/20/2011 | CN201804861U White light LED package structure with high color rendering index |
| 04/20/2011 | CN201804860U Laser diode device |
| 04/20/2011 | CN201803228U LED integrated structure |
| 04/20/2011 | CN1925155B 集成电路装置 The integrated circuit device |
| 04/20/2011 | CN102027715A Method and apparatus for repeating illumination information on a daisy chain bus structure |
| 04/20/2011 | CN102027596A LED arrangement |
| 04/20/2011 | CN102027593A Cooling arrangement comprising two semiconductor components disposed next to one another |
| 04/20/2011 | CN102027592A Substrate for power module, power module, and method for producing substrate for power module |
| 04/20/2011 | CN102027590A High frequency storing case and high frequency module |
| 04/20/2011 | CN102024883A Light-emitting diode radiating substrate and preparation method thereof |
| 04/20/2011 | CN102024805A Illumination device |
| 04/20/2011 | CN102024804A Mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness |
| 04/20/2011 | CN102024803A 功率模块 Power Modules |
| 04/20/2011 | CN102024802A 集成电路结构及其形成方法 Integrated circuit structure and method of forming |
| 04/20/2011 | CN102024801A Ultrathin chip perpendicular interconnection packaging structure and manufacture method thereof |
| 04/20/2011 | CN102024800A Circuit module |
| 04/20/2011 | CN102024799A 半导体装置 Semiconductor device |
| 04/20/2011 | CN102024798A Packaging structure used for integrating surface adhesive type assembly |
| 04/20/2011 | CN102024797A Protective structure for electronic element |
| 04/20/2011 | CN102024796A Integrated circuit module with display device |
| 04/20/2011 | CN102024766A Integrated circuit package system with through semiconductor vias and method of manufacture thereof |