| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/15/2011 | CN201868427U Spiral encapsulating structure of luminescent semiconductor chip and luminous semiconductor light-source device thereof |
| 06/15/2011 | CN201868426U LED light source |
| 06/15/2011 | CN201868425U LED lighting module |
| 06/15/2011 | CN201868424U Light-emitting diode (LED) module |
| 06/15/2011 | CN201868423U Multiple-chip LED (Light-Emitting Diode) |
| 06/15/2011 | CN201868422U Cascade wafer structure |
| 06/15/2011 | CN201868421U Battery module assembled with more than two solar batteries |
| 06/15/2011 | CN201868420U Chip integrated substrate for tool machine |
| 06/15/2011 | CN201866580U Semiconductor light emitting structure and semiconductor light source |
| 06/15/2011 | CN1765162B Ceramic multilayer substrate |
| 06/15/2011 | CN102098876A Manufacturing process for circuit substrate |
| 06/15/2011 | CN102097809A Thyristor valve block of static var compensator (SVC) |
| 06/15/2011 | CN102097572A Light emitting apparatus |
| 06/15/2011 | CN102097562A Alternating current surface mounted type vertical structure semiconductor light-emitting diode |
| 06/15/2011 | CN102097549A Chip scale integration packaging process and light emitting diode (LED) device |
| 06/15/2011 | CN102097456A Organic light emitting diode device |
| 06/15/2011 | CN102097455A Organic light emitting diode device |
| 06/15/2011 | CN102097427A Laminate Electronic Device |
| 06/15/2011 | CN102097426A Photovoltaic module |
| 06/15/2011 | CN102097425A Light emitting diode, method for fabricating phosphor layer, and lighting apparatus |
| 06/15/2011 | CN102097424A Light-emitting device |
| 06/15/2011 | CN102097423A Light emitting device package and lighting system |
| 06/15/2011 | CN102097422A Light-emitting device, method of manufacturing light-emitting device, and illumination device |
| 06/15/2011 | CN102097421A Lighting emitting module |
| 06/15/2011 | CN102097420A Light-emitting diode (LED) and manufacturing method thereof |
| 06/15/2011 | CN102097419A Light-emitting device, display device, and electronic apparatus |
| 06/15/2011 | CN102097418A IGBT driving unit |
| 06/15/2011 | CN102097417A Integrated power semiconductor power module |
| 06/15/2011 | CN102097416A High-power module with novel packaging structure |
| 06/15/2011 | CN102097399A Heat conduction for chip stacks and 3-D circuits |
| 06/15/2011 | CN102097395A Substrate structure with embedded chip |
| 06/15/2011 | CN102097391A Power semiconductor module |
| 06/15/2011 | CN102097336A Semiconductor structure and manufacturing method thereof |
| 06/15/2011 | CN102095093A Novel high-power LED (light emitting diode) integrated light source |
| 06/15/2011 | CN101719491B Structure and method for encapsulating light-emitting diode |
| 06/15/2011 | CN101615584B Packaging method of chip reconfiguration structure |
| 06/15/2011 | CN101599480B Semiconductor chip encapsulating structure |
| 06/15/2011 | CN101548394B Photovoltaic module and its use |
| 06/15/2011 | CN101533784B Light emitting diode encapsulating structure and production method thereof |
| 06/15/2011 | CN101521194B High-speed photoelectric subassembly |
| 06/15/2011 | CN101459203B Infrared sensor IC, infrared sensor and method for producing same |
| 06/15/2011 | CN101414605B Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same |
| 06/15/2011 | CN101345234B Electronic module and fabrication method thereof |
| 06/15/2011 | CN101115351B Electronic components packaging structure |
| 06/14/2011 | US7961478 Integrated circuit, and a mobile phone having the integrated circuit |
| 06/14/2011 | US7961004 FPGA having a direct routing structure |
| 06/14/2011 | US7960842 Structure of high performance combo chip and processing method |
| 06/14/2011 | US7960820 Semiconductor package |
| 06/14/2011 | US7960816 Semiconductor package with passive device integration |
| 06/14/2011 | US7960270 Method for fabricating circuit component |
| 06/14/2011 | US7960212 Structure of high performance combo chip and processing method |
| 06/09/2011 | WO2011068913A1 Methods and apparatus for inductors with integrated passive and active elements |
| 06/09/2011 | US20110136297 Integrated circuit chip that supports through-chip electromagnetic communication |
| 06/09/2011 | US20110133828 Semiconductor Device |
| 06/09/2011 | US20110133827 Semiconductor integrated circuit device |
| 06/09/2011 | US20110133826 Integrated circuit package with multiple dies and queue allocation |
| 06/09/2011 | US20110133825 Integrated circuit package with multiple dies and sampled control signals |
| 06/09/2011 | US20110133803 Semiconductor chip and semiconductor device |
| 06/09/2011 | DE102010061011A1 Halbleiterbaugruppe und Verfahren zum Herstellen derselben A semiconductor package and method for manufacturing the same |
| 06/09/2011 | DE102010060503A1 Laminatelektronikbauelement Laminate electronic component |
| 06/09/2011 | DE102009057146A1 Druckkontaktiertes Leistungshalbleitermodul mit Hybriddruckspeicher Pressure-contacted power semiconductor module with hybrid accumulator |
| 06/09/2011 | DE102009057145A1 Druckkontaktiertes Leistungshalbleitermodul mit teilweise bandartigen Lastanschlusselementen Pressure-contacted power semiconductor module with partial band-like load connection elements |
| 06/09/2011 | DE102009056463A1 Light emitting device, has wavelength converting element, where spectrum of device is set such that normal of surface of element forms angle of specific degrees with symmetry axis of direction of light emitted by LED |
| 06/09/2011 | DE102009047438A1 Leuchtvorrichtung und Verfahren zum Kontaktieren einer Leuchtvorrichtung A lighting apparatus and method for contacting a lighting device |
| 06/09/2011 | DE102005047566C5 Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse sowie Herstellungsverfahren hierzu Arrangement with a power semiconductor device and a housing and manufacturing method therefor |
| 06/09/2011 | DE102004025153B4 Fahrzeugleuchte Vehicle light |
| 06/08/2011 | EP2330627A2 Display Tile Structure using Organic Light Emitting Materials |
| 06/08/2011 | EP2330623A1 Pressure-contacted high performance semiconductor module with some tape-like load connection elements |
| 06/08/2011 | EP2330622A1 Solid state switch arrangement |
| 06/08/2011 | EP2330621A1 Package on package method, structure and associated PCB system |
| 06/08/2011 | EP2329477A1 Optoelectronic component |
| 06/08/2011 | CN201859892U High-power LED light emitting component |
| 06/08/2011 | CN201859877U Solar battery component |
| 06/08/2011 | CN201859876U Heat radiating structure of IGBT module and device |
| 06/08/2011 | CN1885535B Power semiconductor module |
| 06/08/2011 | CN102089826A Proximity optical memory module |
| 06/08/2011 | CN102088241A Stacked inductor-electronic package assembly and technique for manufacturing the same |
| 06/08/2011 | CN102088018A Light emitting device and light emitting device package having the same |
| 06/08/2011 | CN102088017A LED SMD (surface mount type)packaging module |
| 06/08/2011 | CN102088016A Semiconductor voltage-stabilizing and rectifying integrated device |
| 06/08/2011 | CN102088015A Semiconductor packaging piece and manufacture method thereof |
| 06/08/2011 | CN102088014A 3D (Three Dimensional) integrated circuit structure, semiconductor device and forming methods thereof |
| 06/08/2011 | CN102088013A Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same |
| 06/08/2011 | CN102086977A Method for manufacturing alternating current light emitting diode package device |
| 06/08/2011 | CN101794771B SIP (Session Initiation Protocol) chip and SOC (System On Chip) thereof |
| 06/08/2011 | CN101622708B Semiconductor module and inverter apparatus |
| 06/08/2011 | CN101582385B Light-emitting diode display and method for manufacturing the same |
| 06/08/2011 | CN101483173B Semiconductor cooling structure |
| 06/08/2011 | CN101292348B Stackable wafer or die packaging with enhanced thermal and device performance |
| 06/08/2011 | CN101180728B Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip |
| 06/07/2011 | USRE42429 Semiconductor module with serial bus connection to multiple dies |
| 06/07/2011 | US7958294 Integrated circuit having data transceivers and method of positioning circuits on an integrated circuit |
| 06/07/2011 | US7956368 Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device |
| 06/07/2011 | US7956367 Light-emitting device having light-emitting elements connected in series |
| 06/07/2011 | US7956325 Imaging apparatus and image signal processing device |
| 06/07/2011 | US7955942 Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame |
| 06/07/2011 | CA2354753C Formation of an embedded capacitor plane using a thin dielectric |
| 06/03/2011 | WO2011065544A1 Semiconductor device, three-dimensionally mounted semiconductor device, semiconductor module, electronic equipment, and manufacturing method therefor |
| 06/03/2011 | WO2011064971A1 Production method for electronic device, electronic device, production method for electronic device package, and electronic device package |
| 06/03/2011 | WO2011064363A1 Retrofit led lamp with warm-white, more particularly flame-like white light |