| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/24/2011 | WO2011033921A1 Integrated circuit |
| 03/24/2011 | WO2011033601A1 Method and apparatus for manufacturing three-dimensional integrated circuit |
| 03/24/2011 | WO2011033566A1 Semiconductor device and method for manufacturing same |
| 03/24/2011 | WO2011033433A1 Light-source module and light-emitting device |
| 03/24/2011 | WO2011032966A1 Electronic device for switching currents and method for producing the same |
| 03/24/2011 | WO2011032853A1 Optoelectronic module |
| 03/24/2011 | WO2011032647A1 Method for chip to wafer bonding |
| 03/24/2011 | WO2011032300A1 Lighting device for obtaining a uniformly illuminated field |
| 03/24/2011 | WO2002047310A9 Display tile structure using organic light emitting materials |
| 03/24/2011 | US20110068479 Assembly of multi-chip modules using sacrificial features |
| 03/24/2011 | US20110068456 Layered chip package and method of manufacturing same |
| 03/24/2011 | US20110068454 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods |
| 03/24/2011 | US20110068449 Semiconductor package and method of manufacturing the semiconductor package |
| 03/24/2011 | US20110068433 Forming radio frequency integrated circuits |
| 03/24/2011 | DE102009000888B4 Halbleiteranordnung Semiconductor device |
| 03/24/2011 | CA2774232A1 Light-source module and light-emitting device |
| 03/24/2011 | CA2772919A1 Light emitting, photovoltaic or other electronic apparatus and system and method of making same |
| 03/23/2011 | EP2299486A1 Method for bonding chips to wafers |
| 03/23/2011 | EP2297780A1 Optoelectronic module having a carrier substrate and a plurality of radiation-emitting semiconductor components and method for the production thereof |
| 03/23/2011 | CN201773869U Mutli-chip and multi-direction LED frame |
| 03/23/2011 | CN201773838U Improved semiconductor silicon-controlled rectifier |
| 03/23/2011 | CN1992363B Light emitting apparatus, method for producing the same and assembly incorporating the same |
| 03/23/2011 | CN1976014B Semiconductor device and its production method |
| 03/23/2011 | CN101990329A Alternating current light-emitting diode for eliminating generation of harmonic current |
| 03/23/2011 | CN101989598A Multi-die package |
| 03/23/2011 | CN101989597A Power semiconductor module with a load connection terminal having a symmetrical current distribution |
| 03/23/2011 | CN101989596A Thermoelectric module and optical transmission apparatus |
| 03/23/2011 | CN101989595A Power device module |
| 03/23/2011 | CN101989558A Semiconductor device and method of producing the same |
| 03/23/2011 | CN101988656A White light-emitting diode (LED) backlight source and manufacturing method thereof |
| 03/23/2011 | CN101988637A White-light light-emitting diode (LED) light sourceS, manufacturing method thereof and street lamp using white-light LED sources |
| 03/23/2011 | CN101988632A Alternating current light emitting diode for preventing generation of harmonic wave and stroboflash |
| 03/23/2011 | CN101988629A Fiber light combination system for LED light beams of same color |
| 03/23/2011 | CN101988625A Novel LED (Light-Emitting Diode) miner lamp |
| 03/23/2011 | CN101622707B Semiconductor module and inverter apparatus |
| 03/23/2011 | CN101621041B Packaging structure with reconfiguration chip and method thereof |
| 03/23/2011 | CN101599485B Horizontal type high-power thyristor valve string voltage-sharing transition device |
| 03/23/2011 | CN101556951B Photo-thyristor valve body radiating with heat pipe |
| 03/23/2011 | CN101552214B Multi-chip stacking method for halving routing procedure and structure thereof |
| 03/23/2011 | CN101510546B Led-array with temperature sensor |
| 03/23/2011 | CN101364593B Staggered offset stacking encapsulation construction having multistage omnibus bar in conductive wire support |
| 03/23/2011 | CN101194373B Method of removing the growth substrate of a semiconductor light-emitting device |
| 03/23/2011 | CN101165892B Method for power block |
| 03/23/2011 | CN101110414B Chip stack with a higher power chip on the outside of the stack |
| 03/22/2011 | US7911265 Interfacing at low temperature using CMOS technology |
| 03/22/2011 | US7911231 Semiconductor integrated circuit device |
| 03/22/2011 | US7911015 Infrared detector and infrared solid-state imaging device |
| 03/22/2011 | US7911012 Flexible and elastic dielectric integrated circuit |
| 03/22/2011 | US7910405 Semiconductor device having adhesion increasing film to prevent peeling |
| 03/17/2011 | WO2011031635A1 Solid state lighting devices including light mixtures |
| 03/17/2011 | WO2011030753A1 Method for manufacturing a semiconductor device |
| 03/17/2011 | WO2011030516A1 Semiconductor device |
| 03/17/2011 | WO2011030467A1 Semiconductor device |
| 03/17/2011 | US20110063023 Structure and method for coupling signals to and/or from stacked semiconductor dies |
| 03/17/2011 | US20110063012 Circuit arrangement |
| 03/17/2011 | US20110062992 Logic circuit, light emitting device, semiconductor device, and electronic device |
| 03/17/2011 | US20110062598 Stacked-die package including substrate-ground coupling |
| 03/17/2011 | US20110062597 Package structures |
| 03/17/2011 | US20110062581 Semiconductor package |
| 03/17/2011 | US20110062333 Electromagnetic based thermal sensing and imaging incorporating multi-pixel imaging arrays |
| 03/16/2011 | EP2296179A2 Illumination device |
| 03/16/2011 | EP2296178A2 Impedance optimized chip system |
| 03/16/2011 | EP2295238A1 Organic photosensitive optoelectronic device |
| 03/16/2011 | EP2294616A2 Electronic device comprising a plurality of electronic components laid down on a substrate and associated infrared sensor |
| 03/16/2011 | EP2294614A2 Method for producing a plurality of optoelectronic components |
| 03/16/2011 | EP2294612A1 Stacked electronic device and process for fabricating such an electronic device |
| 03/16/2011 | CN201766098U Zero thermal resistance structure of high-power LED (light-emitting diode) and radiator and LED lamp |
| 03/16/2011 | CN201766077U Packaging structure with paddle for passive device |
| 03/16/2011 | CN201766076U Surface mount rectifier with double crystal grains |
| 03/16/2011 | CN101986429A Chip package and manufacturing method thereof |
| 03/16/2011 | CN101452920B Light emitting unit |
| 03/16/2011 | CN101452919B Multi-wafer intersecting stacking encapsulation construction |
| 03/16/2011 | CN101452915B Multi-system module having functional carrier plate |
| 03/16/2011 | CN101442040B Encapsulation structure for LED and method of manufacturing the same |
| 03/16/2011 | CN101399263B Circuit device |
| 03/16/2011 | CN101373759B Semiconductor-packaged stacking combination and used stacked semiconductor packaging piece thereof |
| 03/16/2011 | CN101276807B Semiconductor device and method of manufacturing the same |
| 03/16/2011 | CN101237012B LED assembly method |
| 03/15/2011 | US7907434 Semiconductor apparatus having a large-size bus connection |
| 03/15/2011 | US7906990 Semiconductor integrated circuit device |
| 03/10/2011 | WO2011028806A1 Integrated voltage regulator with embedded passive device(s) |
| 03/10/2011 | WO2011027186A1 Package structure |
| 03/10/2011 | WO2011026768A1 Potted optoelectronic module having a plurality of semiconductor components and method for producing an optoelectronic module |
| 03/10/2011 | WO2011026456A1 Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof |
| 03/10/2011 | US20110057819 Semiconductor device having plural semiconductor chips laminated to each other |
| 03/10/2011 | US20110057685 Semiconductor device, method of fabricating semiconductor device, and semiconductor device layout method |
| 03/10/2011 | US20110057328 Semiconductor device and semiconductor package having the same |
| 03/10/2011 | DE102009039982A1 Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements An optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component, |
| 03/10/2011 | DE102009039891A1 Optoelektronisches Modul aufweisend zumindest einen ersten Halbleiterkörper mit einer Strahlungsaustrittsseite und einer Isolationsschicht und Verfahren zu dessen Herstellung An optoelectronic module comprising at least a first semiconductor body having a radiation exit side and an insulating layer and process for its preparation |
| 03/10/2011 | DE102009038523A1 Leuchtmittel sowie Leuchte Lamp and Light |
| 03/09/2011 | EP2291860A1 Solid state lighting component |
| 03/09/2011 | EP2291857A2 Wire on wire stitch bonding in a semiconductor device |
| 03/09/2011 | CN201758140U Novel LED light source module packaging structure |
| 03/09/2011 | CN201758124U Aluminum-based packaging fast-recovery single-phase bridge |
| 03/09/2011 | CN101621057B Active assembly array base plate |
| 03/09/2011 | CN101114641B Assembly with a power semiconductor element and a contact device |
| 03/08/2011 | US7902880 Transitioning digital integrated circuit from standby mode to active mode via backgate charge transfer |
| 03/08/2011 | US7902879 Field programmable gate array utilizing dedicated memory stacks in a vertical layer format |
| 03/08/2011 | US7902869 Extensible three dimensional circuit |
| 03/08/2011 | US7902867 Memristor crossbar neural interface |