Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
01/2011
01/06/2011WO2011000687A1 Configuration of a multi-step converter of the electrical power supply
01/06/2011WO2011000659A1 Radiation‑emitting semiconductor component
01/06/2011WO2010116698A3 Method of manufacturing semiconductor chip
01/06/2011US20110002153 Manufacturing method for stacking memory circuits and for addressing a memory circuit, corresponding stacking and device
01/06/2011US20110001559 Semiconductor device and method for driving the same
01/06/2011US20110001509 Semiconductor integrated circuit device and method for testing the same
01/05/2011EP2270889A2 LED package comprising leadframe and two-part heatsink
01/05/2011EP2270883A2 Enhanced light extraction in LEDs through the use of internal and external optical elements
01/05/2011EP2270856A1 LED light source
01/05/2011EP2270855A1 An electrical module
01/05/2011EP2270846A2 Integrated circuits and methods for their fabrication
01/05/2011EP2270845A2 Integrated circuits and methods for their fabrication
01/05/2011EP2269218A1 Cooling arrangement comprising two semiconductor components disposed next to one another
01/05/2011EP2269207A2 Multiple-chip excitation systems for white light emitting diodes (leds)
01/05/2011EP1741138B1 An integrated circuit, a method for manufacturing the integrated circuit, and a mobile phone having the integrated circuit
01/05/2011DE102010030704A1 Spulen-Transducer Isolator-Baugruppe Coil transducer insulator assembly
01/05/2011DE102010025258A1 Eingebetteter Sandwich-Hybridschaltkreis Embedded sandwich hybrid circuit
01/05/2011DE102010017516A1 Verbundene Halbleiter-Moduleinheit und Motorvorrichtung mit integriertem elektronischen Schaltkreis mit derselben Related semiconductor module unit and motor apparatus with integrated electronic circuit with the same
01/05/2011DE102009042191A1 Wafer-Level-gekapselte integrierte MEMS-Schaltung Wafer-level MEMS encapsulated integrated circuit
01/05/2011DE102009024311A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
01/05/2011DE102009022659A1 Kontakteinrichtung für ein Leistungshalbleitermodul Contact device for a power semiconductor module
01/05/2011CN201699056U LED encapsulating module self-radiating structure
01/05/2011CN201699014U Photoelectric detecting component for wireless laser communication
01/05/2011CN201699013U Trench schottky barrier diode rectifying device
01/05/2011CN201699012U Packaging structure of multi-layer array type light-emitting diode
01/05/2011CN201699007U Water-cooling heat dissipating device of large-current diode
01/05/2011CN201696959U COB packaging structure for eliminating lighting dark space of LED lamp and LED lamp
01/05/2011CN1605790B LED light apparatus and method therefor
01/05/2011CN101939825A Film for semiconductor, method for manufacturing semiconductor device and semiconductor device
01/05/2011CN101937911A Light-emitting diode packaging structure and backlight module
01/05/2011CN101937910A LED light source, its manufacturing method, and LED-based photolithography apparatus and method
01/05/2011CN101937909A An electrical module
01/05/2011CN101937908A Heat pipe type high-power LED (Light Emitting Diode) module
01/05/2011CN101937907A Chip stacking package structure and manufacture method thereof
01/05/2011CN101937906A Circuit for calibrating impedance and semiconductor apparatus using the same
01/05/2011CN101937892A Semiconductor chip, method of fabricating the same, and stack module and memory card
01/05/2011CN101684900B LED package module
01/05/2011CN101684899B LED package module
01/05/2011CN101388381B Multi-chip stacking construction having metal spacer
01/04/2011US7864543 Printed circuit board
01/04/2011US7864542 Printed circuit board
01/04/2011US7864136 Tiled electronic display structure
01/04/2011US7863995 Methods of achieving linear capacitance in symmetrical and asymmetrical EMI filters with TVS
01/04/2011US7863930 Programmable device, control method of device and information processing system
01/04/2011US7863760 Roll-to-roll fabricated encapsulated semiconductor circuit devices
01/04/2011US7863756 Semiconductor device
01/04/2011US7863754 Semiconductor device and manufacturing method thereof
01/04/2011US7863739 Low fabrication cost, fine pitch and high reliability solder bump
01/04/2011US7863723 Adhesive on wire stacked semiconductor package
01/04/2011US7863720 Method and system for stacking integrated circuits
01/04/2011US7863641 Method and apparatus for using light emitting diodes for the treatment of biological tissue
01/04/2011US7862211 Configuration of multiple LED modules
01/04/2011CA2540125C Toothbrush with severable electrical connections
12/2010
12/30/2010US20100328915 Printed circuit board and method of manufacturing printed circuit board
12/30/2010US20100327966 Semiconductor device having circuit blocks with mutually the same circuit configuration
12/30/2010US20100327463 Stacked structures and methods of fabricating stacked structures
12/30/2010US20100327462 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
12/30/2010US20100327461 Electrical interconnect for die stacked in zig-zag configuration
12/30/2010US20100327460 Capactive connectors with enhanced capacitive coupling
12/30/2010US20100327436 Apparatus and method for stacking integrated circuits
12/30/2010US20100327419 Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
12/30/2010DE202010008705U1 Arrayartiges Multi-Chip-Gehäuse für LEDs Array-like multi-chip package for LEDs
12/30/2010DE202010008639U1 Lampenvorrichtung Lamp device
12/30/2010DE102010017515A1 Motorvorrichtung mit integriertem elektronischen Schaltkreis und Halbleitermodul Motor device with an integrated electronic circuit and semiconductor module
12/30/2010DE102009020540A1 Method of producing electronic module, involves moving carrier to downstream processing point while aligning position of electronic component with respect to structure on liquid meniscus
12/29/2010WO2010151340A1 Thin film solar module fabrication
12/29/2010WO2010150471A1 Semiconductor device
12/29/2010WO2009148483A8 Solid state lighting component
12/29/2010EP2267798A1 Optoelectronic device
12/29/2010EP2267773A2 LED package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
12/29/2010EP2267354A2 LED package structure with standby bonding pads for increasing wire-bonding yield and method for manufacturing the same
12/29/2010EP2266138A1 Microwave assembly
12/29/2010EP2266137A1 A voltage source converter
12/29/2010CN201689913U LED encapsulation structure with simple structure
12/29/2010CN201689911U Encapsulation structure of light-emitting diode
12/29/2010CN201689889U Cascade circuit for physical layer of Ethernet
12/29/2010CN201689888U Multifunctional LED packing base board
12/29/2010CN201689887U Large-area light-emitting diode module
12/29/2010CN201689886U Base plate for lighting lamp with LED light source
12/29/2010CN201689885U Ultrathin chip rectifier bridge
12/29/2010CN201689884U Integrated circuit block
12/29/2010CN201689883U Led device
12/29/2010CN1947254B Micro-optics on optoelectronics
12/29/2010CN101933139A Semiconductor device and method for fabricating the same
12/29/2010CN101932870A Semiconductor package with incorporated light or temperature sensors and time multiplexing
12/29/2010CN101931040A Packaging of LED area light source
12/29/2010CN101930972A Light-emitting diode apparatus
12/29/2010CN101930971A Multi-chip package and method for forming same
12/29/2010CN101930970A Image display system
12/29/2010CN101930962A Capsulation module for electronic components
12/29/2010CN101930960A Ic chip package and forming method
12/29/2010CN101930957A Power semiconductor device package and fabrication method
12/29/2010CN101930937A Packaging method of photoelectric component and packaging carrier structure thereof
12/29/2010CN101930934A Method for manufacturing light emitting apparatus, light emitting apparatus, and mounting base thereof
12/29/2010CN101651135B 66kV optically-controlled water-cooling thyristor valve box
12/29/2010CN101483159B Chip construction and process thereof, chip stacking construction and process thereof
12/29/2010CN101351882B Electronic module, and method for producing one
12/28/2010US7859855 Module and mounted structure using the same
12/28/2010US7859329 Configurable clock network for programmable logic device
12/28/2010US7859328 Substrate stress measuring technique