Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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01/06/2011 | WO2011000687A1 Configuration of a multi-step converter of the electrical power supply |
01/06/2011 | WO2011000659A1 Radiation‑emitting semiconductor component |
01/06/2011 | WO2010116698A3 Method of manufacturing semiconductor chip |
01/06/2011 | US20110002153 Manufacturing method for stacking memory circuits and for addressing a memory circuit, corresponding stacking and device |
01/06/2011 | US20110001559 Semiconductor device and method for driving the same |
01/06/2011 | US20110001509 Semiconductor integrated circuit device and method for testing the same |
01/05/2011 | EP2270889A2 LED package comprising leadframe and two-part heatsink |
01/05/2011 | EP2270883A2 Enhanced light extraction in LEDs through the use of internal and external optical elements |
01/05/2011 | EP2270856A1 LED light source |
01/05/2011 | EP2270855A1 An electrical module |
01/05/2011 | EP2270846A2 Integrated circuits and methods for their fabrication |
01/05/2011 | EP2270845A2 Integrated circuits and methods for their fabrication |
01/05/2011 | EP2269218A1 Cooling arrangement comprising two semiconductor components disposed next to one another |
01/05/2011 | EP2269207A2 Multiple-chip excitation systems for white light emitting diodes (leds) |
01/05/2011 | EP1741138B1 An integrated circuit, a method for manufacturing the integrated circuit, and a mobile phone having the integrated circuit |
01/05/2011 | DE102010030704A1 Spulen-Transducer Isolator-Baugruppe Coil transducer insulator assembly |
01/05/2011 | DE102010025258A1 Eingebetteter Sandwich-Hybridschaltkreis Embedded sandwich hybrid circuit |
01/05/2011 | DE102010017516A1 Verbundene Halbleiter-Moduleinheit und Motorvorrichtung mit integriertem elektronischen Schaltkreis mit derselben Related semiconductor module unit and motor apparatus with integrated electronic circuit with the same |
01/05/2011 | DE102009042191A1 Wafer-Level-gekapselte integrierte MEMS-Schaltung Wafer-level MEMS encapsulated integrated circuit |
01/05/2011 | DE102009024311A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
01/05/2011 | DE102009022659A1 Kontakteinrichtung für ein Leistungshalbleitermodul Contact device for a power semiconductor module |
01/05/2011 | CN201699056U LED encapsulating module self-radiating structure |
01/05/2011 | CN201699014U Photoelectric detecting component for wireless laser communication |
01/05/2011 | CN201699013U Trench schottky barrier diode rectifying device |
01/05/2011 | CN201699012U Packaging structure of multi-layer array type light-emitting diode |
01/05/2011 | CN201699007U Water-cooling heat dissipating device of large-current diode |
01/05/2011 | CN201696959U COB packaging structure for eliminating lighting dark space of LED lamp and LED lamp |
01/05/2011 | CN1605790B LED light apparatus and method therefor |
01/05/2011 | CN101939825A Film for semiconductor, method for manufacturing semiconductor device and semiconductor device |
01/05/2011 | CN101937911A Light-emitting diode packaging structure and backlight module |
01/05/2011 | CN101937910A LED light source, its manufacturing method, and LED-based photolithography apparatus and method |
01/05/2011 | CN101937909A An electrical module |
01/05/2011 | CN101937908A Heat pipe type high-power LED (Light Emitting Diode) module |
01/05/2011 | CN101937907A Chip stacking package structure and manufacture method thereof |
01/05/2011 | CN101937906A Circuit for calibrating impedance and semiconductor apparatus using the same |
01/05/2011 | CN101937892A Semiconductor chip, method of fabricating the same, and stack module and memory card |
01/05/2011 | CN101684900B LED package module |
01/05/2011 | CN101684899B LED package module |
01/05/2011 | CN101388381B Multi-chip stacking construction having metal spacer |
01/04/2011 | US7864543 Printed circuit board |
01/04/2011 | US7864542 Printed circuit board |
01/04/2011 | US7864136 Tiled electronic display structure |
01/04/2011 | US7863995 Methods of achieving linear capacitance in symmetrical and asymmetrical EMI filters with TVS |
01/04/2011 | US7863930 Programmable device, control method of device and information processing system |
01/04/2011 | US7863760 Roll-to-roll fabricated encapsulated semiconductor circuit devices |
01/04/2011 | US7863756 Semiconductor device |
01/04/2011 | US7863754 Semiconductor device and manufacturing method thereof |
01/04/2011 | US7863739 Low fabrication cost, fine pitch and high reliability solder bump |
01/04/2011 | US7863723 Adhesive on wire stacked semiconductor package |
01/04/2011 | US7863720 Method and system for stacking integrated circuits |
01/04/2011 | US7863641 Method and apparatus for using light emitting diodes for the treatment of biological tissue |
01/04/2011 | US7862211 Configuration of multiple LED modules |
01/04/2011 | CA2540125C Toothbrush with severable electrical connections |
12/30/2010 | US20100328915 Printed circuit board and method of manufacturing printed circuit board |
12/30/2010 | US20100327966 Semiconductor device having circuit blocks with mutually the same circuit configuration |
12/30/2010 | US20100327463 Stacked structures and methods of fabricating stacked structures |
12/30/2010 | US20100327462 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods |
12/30/2010 | US20100327461 Electrical interconnect for die stacked in zig-zag configuration |
12/30/2010 | US20100327460 Capactive connectors with enhanced capacitive coupling |
12/30/2010 | US20100327436 Apparatus and method for stacking integrated circuits |
12/30/2010 | US20100327419 Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same |
12/30/2010 | DE202010008705U1 Arrayartiges Multi-Chip-Gehäuse für LEDs Array-like multi-chip package for LEDs |
12/30/2010 | DE202010008639U1 Lampenvorrichtung Lamp device |
12/30/2010 | DE102010017515A1 Motorvorrichtung mit integriertem elektronischen Schaltkreis und Halbleitermodul Motor device with an integrated electronic circuit and semiconductor module |
12/30/2010 | DE102009020540A1 Method of producing electronic module, involves moving carrier to downstream processing point while aligning position of electronic component with respect to structure on liquid meniscus |
12/29/2010 | WO2010151340A1 Thin film solar module fabrication |
12/29/2010 | WO2010150471A1 Semiconductor device |
12/29/2010 | WO2009148483A8 Solid state lighting component |
12/29/2010 | EP2267798A1 Optoelectronic device |
12/29/2010 | EP2267773A2 LED package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same |
12/29/2010 | EP2267354A2 LED package structure with standby bonding pads for increasing wire-bonding yield and method for manufacturing the same |
12/29/2010 | EP2266138A1 Microwave assembly |
12/29/2010 | EP2266137A1 A voltage source converter |
12/29/2010 | CN201689913U LED encapsulation structure with simple structure |
12/29/2010 | CN201689911U Encapsulation structure of light-emitting diode |
12/29/2010 | CN201689889U Cascade circuit for physical layer of Ethernet |
12/29/2010 | CN201689888U Multifunctional LED packing base board |
12/29/2010 | CN201689887U Large-area light-emitting diode module |
12/29/2010 | CN201689886U Base plate for lighting lamp with LED light source |
12/29/2010 | CN201689885U Ultrathin chip rectifier bridge |
12/29/2010 | CN201689884U Integrated circuit block |
12/29/2010 | CN201689883U Led device |
12/29/2010 | CN1947254B Micro-optics on optoelectronics |
12/29/2010 | CN101933139A Semiconductor device and method for fabricating the same |
12/29/2010 | CN101932870A Semiconductor package with incorporated light or temperature sensors and time multiplexing |
12/29/2010 | CN101931040A Packaging of LED area light source |
12/29/2010 | CN101930972A Light-emitting diode apparatus |
12/29/2010 | CN101930971A Multi-chip package and method for forming same |
12/29/2010 | CN101930970A Image display system |
12/29/2010 | CN101930962A Capsulation module for electronic components |
12/29/2010 | CN101930960A Ic chip package and forming method |
12/29/2010 | CN101930957A Power semiconductor device package and fabrication method |
12/29/2010 | CN101930937A Packaging method of photoelectric component and packaging carrier structure thereof |
12/29/2010 | CN101930934A Method for manufacturing light emitting apparatus, light emitting apparatus, and mounting base thereof |
12/29/2010 | CN101651135B 66kV optically-controlled water-cooling thyristor valve box |
12/29/2010 | CN101483159B Chip construction and process thereof, chip stacking construction and process thereof |
12/29/2010 | CN101351882B Electronic module, and method for producing one |
12/28/2010 | US7859855 Module and mounted structure using the same |
12/28/2010 | US7859329 Configurable clock network for programmable logic device |
12/28/2010 | US7859328 Substrate stress measuring technique |