| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/29/2011 | CN102110683A High-voltage vertical structure semiconductor light emitting diode |
| 06/29/2011 | CN102110682A Light-emitting device and method for producing the same |
| 06/29/2011 | CN102110681A Side emitting light emitting diode (LED) package structure |
| 06/29/2011 | CN102110680A Power module assembly with reduced inductance |
| 06/29/2011 | CN102110679A Power semiconductor module with a substrate having a three dimensional surface contour and method for producing same |
| 06/29/2011 | CN102110678A Semiconductor package and manufacturing method thereof |
| 06/29/2011 | CN102110677A Method for assembling wiring element with electronic chip |
| 06/29/2011 | CN102110676A Semiconductor device and dc-to-dc converter |
| 06/29/2011 | CN102110675A Packaging structure for buck type piezoelectric ceramic transformer |
| 06/29/2011 | CN102110674A Semiconductor package |
| 06/29/2011 | CN102110673A Wafer level MMCM (microwave multichip module) packaging structure using photosensitive BCB (benzocyclobutene) as dielectric layer and method |
| 06/29/2011 | CN102110672A Chip-stacked package structure and method for manufacturing the same |
| 06/29/2011 | CN101807530B Preparation method of high-voltage silicon stack based on non-equivalent voltage-sharing configuration |
| 06/29/2011 | CN101783340B LED backlight integration and encapsulation structure and encapsulation method |
| 06/29/2011 | CN101552299B Solar panel |
| 06/29/2011 | CN101546745B Chip interconnect swizzle mechanism |
| 06/29/2011 | CN101496170B Integrating light source module |
| 06/29/2011 | CN101393873B Device comprising stacked semiconductor chips and manufacture method thereof |
| 06/29/2011 | CN101388382B Staggered offset stacking encapsulation construction having omnibus bar of metal welding pad in conductive wire support |
| 06/29/2011 | CN101086985B Block water cooling power semiconductor part |
| 06/28/2011 | US7971172 IC that efficiently replicates a function to save logic and routing resources |
| 06/28/2011 | US7969239 Charge pump circuit and a novel capacitor for a memory integrated circuit |
| 06/28/2011 | US7969025 Electric power semiconductor device |
| 06/28/2011 | US7968988 Power semiconductor module having a thermally conductive base plate on which at least four substrates are arranged in at least one single row |
| 06/28/2011 | CA2346294C Solid-state photoelectric device |
| 06/27/2011 | DE202010016958U1 Leuchtmodul für eine Beleuchtungseinrichtung eines Kraftfahrzeugs mit auf einem Silizium-Substrat angeordneten Halbleiterlichtquellen Lighting module for a lighting device of a motor vehicle having disposed on a silicon substrate of semiconductor light sources |
| 06/23/2011 | WO2011075265A2 Apparatus and method for embedding components in small-form-factor, system-on-packages |
| 06/23/2011 | WO2011072435A1 Thiophene-containing organic photoelectric materials, their perparation methods and solar cell devices |
| 06/23/2011 | WO2011072432A1 Thyristor converter valve module |
| 06/23/2011 | US20110148516 Minute capacitance element and semiconductor device using the same |
| 06/23/2011 | US20110147910 Method for stacking die in thin, small-outline package |
| 06/23/2011 | US20110147907 Active plastic bridge chips |
| 06/23/2011 | US20110147906 Integrated circuit packaging system with embedded interconnect and method of manufacture thereof |
| 06/23/2011 | US20110147694 Resistive memory device and method for fabricating the same |
| 06/22/2011 | EP2337099A2 Light emitting device and light unit using the same |
| 06/22/2011 | EP2337077A1 LED Module |
| 06/22/2011 | EP2337073A1 Light transmissible display apparatus |
| 06/22/2011 | EP2337072A2 Light emitting device and light unit using the same |
| 06/22/2011 | EP2335282A1 Systems and methods for enabling esd protection on 3-d stacked devices |
| 06/22/2011 | EP2335116A1 Lighting device |
| 06/22/2011 | EP1663057B1 Toothbrush with severable electrical connections |
| 06/22/2011 | DE102010012423A1 Lumineszenzdiodenanordnung, Hinterleuchtungsvorrichtung und Anzeigevorrichtung Lumineszenzdiodenanordnung, backlighting and display device |
| 06/22/2011 | DE102010000694A1 Leistungshalbleitermodul The power semiconductor module |
| 06/22/2011 | DE102009054840A1 Leuchtmittel mit einer Mehrzahl von Leuchtdioden Bulb with a plurality of light emitting diodes |
| 06/22/2011 | DE10066445B4 Halbleitervorrichtung mit Abstrahlungs-Struktur A semiconductor device having radiating structure |
| 06/22/2011 | CN201877834U Thyristor valve block of static var compensator (SVC) |
| 06/22/2011 | CN201877428U LED encapsulation structure with changeable color |
| 06/22/2011 | CN201877427U Integrated high-power LED (light-emitting diode) |
| 06/22/2011 | CN201877426U Heat conducting and reflecting structure with encapsulated LEDs |
| 06/22/2011 | CN201877425U High-voltage silicon stack |
| 06/22/2011 | CN201877424U Chip on board (COB) of U disk |
| 06/22/2011 | CN1663120B Electronic component comprising a multilayer substrate |
| 06/22/2011 | CN102106194A Ceramic package substrate with recessed device |
| 06/22/2011 | CN102105983A 半导体装置 Semiconductor device |
| 06/22/2011 | CN102105979A Corrosion control of stacked integrated circuits |
| 06/22/2011 | CN102104037A Luminous device with integrated circuit and manufacturing method thereof |
| 06/22/2011 | CN102104036A LED light emitting apparatus and vehicle headlamp using the same |
| 06/22/2011 | CN102104035A Stacked semiconductor packages, methods of fabricating the same, and systems employing the same |
| 06/22/2011 | CN102104034A Three-dimensional semiconductor device |
| 06/22/2011 | CN102104033A Three-dimensional mixed signal chip stacking package body and preparation method thereof |
| 06/22/2011 | CN102104032A Surface-mount LED with specific bracket and production process thereof |
| 06/22/2011 | CN102104031A Single pad-exposed lead frame with double-pad structure |
| 06/22/2011 | CN102104012A Manufacturing method of light-emitting diode |
| 06/22/2011 | CN102104010A Module structural member capable of improving isolation voltage VISO and reducing crusting thermal resistance Rthjc |
| 06/22/2011 | CN102102862A Method for packing micro-volume multi-LED (Light-Emitting Diode) integrated unit and method for packing electrodes thereof |
| 06/22/2011 | CN101661926B Chip package |
| 06/22/2011 | CN101645659B Rectifier components and secondary rectifier transformer |
| 06/22/2011 | CN101499432B Stacked semiconductor device and method |
| 06/22/2011 | CN101490829B Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device |
| 06/22/2011 | CN101371353B Electronic device package, module and electronic device |
| 06/22/2011 | CN101268548B Microelectronic packages and methods therefor |
| 06/22/2011 | CN101183670B Semiconductor device, stacked semiconductor device and interposer substrate |
| 06/21/2011 | US7965531 Memory module and memory device |
| 06/21/2011 | US7965107 Base cell for engineering change order (ECO) implementation |
| 06/21/2011 | US7965102 Formation of columnar application specific circuitry using a columnar programmable device |
| 06/21/2011 | US7964952 Stacked semiconductor package assembly having hollowed substrate |
| 06/21/2011 | US7964950 Electronic parts packaging structure and method of manufacturing the same |
| 06/16/2011 | WO2011072225A1 Printed circuit board having embedded dies and method of forming same |
| 06/16/2011 | WO2011070087A1 Packaging an electronic device |
| 06/16/2011 | WO2011069307A1 Method and system for detecting led's life |
| 06/16/2011 | US20110141789 Memory module and memory system |
| 06/16/2011 | US20110140259 Integrated circuit packaging system with stacking interconnect and method of manufacture thereof |
| 06/16/2011 | US20110140258 Integrated circuit packaging system with package stacking and method of manufacture thereof |
| 06/16/2011 | US20110140257 Printed Circuit Board having Embedded Dies and Method of Forming Same |
| 06/16/2011 | US20110140247 Integrated circuit packaging system with shielded package and method of manufacture thereof |
| 06/16/2011 | DE102009054474A1 Leuchtmodul und Leuchtkette Light module and luminous chain |
| 06/16/2011 | DE102006058694B4 Leistungshalbleitermodul mit Kontaktfedern Power semiconductor module with contact springs |
| 06/16/2011 | DE10019888B4 Transparente elektronische Bauelementanordnung und Verfahren zu ihrer Herstellung Transparent electronic component assembly and process for their preparation |
| 06/15/2011 | EP2334159A1 Coupling modules of an electronic device |
| 06/15/2011 | EP2333832A2 Light emitting device and projector |
| 06/15/2011 | EP2333831A1 Packaging an electronic device |
| 06/15/2011 | EP2333830A1 a package comprising a first and a second die coupled by a multiplexed bus |
| 06/15/2011 | EP1645023B1 Printed circuit board for a three-phase power device having embedded directional impedance control channels |
| 06/15/2011 | EP1352432B1 Light-emitting diode and method for the production thereof |
| 06/15/2011 | CN201868472U Chip and powder separated light-emitting module for manufacture of high-power LEDs |
| 06/15/2011 | CN201868468U Light-emitting diode (LED) module |
| 06/15/2011 | CN201868467U LED lead frame |
| 06/15/2011 | CN201868430U Photovoltaic cell assembly with LED (Light-Emitting Diode) combined pattern |
| 06/15/2011 | CN201868429U Embedded-type encapsulating structure of luminous diode |
| 06/15/2011 | CN201868428U Luminous semiconductor curved surface encapsulated structure and luminous semiconductor light source device thereof |