| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/26/2011 | CN101958315A Lighting device, display, and method for manufacturing the same |
| 01/26/2011 | CN101958314A Manufacture method and usage of folded system-in-package |
| 01/26/2011 | CN101958313A 半导体模块 Semiconductor Modules |
| 01/26/2011 | CN101958312A Electronic control unit |
| 01/26/2011 | CN101958307A Power semiconductor module and method of manufacturing the same |
| 01/26/2011 | CN101958302A Double-side graph chip inverse single package structure and package method thereof |
| 01/26/2011 | CN101958300A Double-sided graphic chip inversion module packaging structure and packaging method thereof |
| 01/26/2011 | CN101958291A Electronic control unit |
| 01/26/2011 | CN101958290A Semiconductor device and method for manufacturing same |
| 01/26/2011 | CN101958261A Stackable semiconductor device packages |
| 01/26/2011 | CN101958255A Method for Ultra thin wafer handling and processing |
| 01/26/2011 | CN101621052B LED encapsulating array, structure and method |
| 01/26/2011 | CN101567364B Multichip package structure capable of arranging chips on pins |
| 01/26/2011 | CN101527301B Battery protection ic chip module |
| 01/26/2011 | CN101452861B Multi-chip stacking structure and preparation thereof |
| 01/26/2011 | CN101349389B Light source for vehicle headlight and vehicle headlight |
| 01/26/2011 | CN101308839B Multi-port cam cell and making method thereof |
| 01/26/2011 | CN101165894B Chip package for image sensor and method of manufacturing the same |
| 01/25/2011 | US7877719 Fast dual-Vdd buffer insertion and buffered tree construction for power minimization |
| 01/25/2011 | US7876126 Permutable switching network with enhanced interconnectivity for multicasting signals |
| 01/25/2011 | US7875975 Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag |
| 01/25/2011 | US7874066 Method of manufacturing a device-incorporated substrate |
| 01/20/2011 | WO2011006835A1 Light-emitting diode component, light-emitting diode module and display device |
| 01/20/2011 | WO2010138480A3 Stacked semiconductor device assembly |
| 01/20/2011 | US20110012673 Integrated circuit including a large number of identical elementary circuits powered in parallel |
| 01/20/2011 | US20110012670 Providing in package power supplies for integrated circuits |
| 01/20/2011 | US20110012253 Semiconductor Package Having Discrete Components And System Containing The Package |
| 01/20/2011 | DE102010030336A1 Leuchtdiodenvorrichtung Light emitting diode device |
| 01/20/2011 | DE102009032906A1 Modul mit mehreren thermoelektrischen Elementen Module having a plurality of thermoelectric elements |
| 01/20/2011 | DE102009024384A1 Electronic power semiconductor module for use in power-electronic unit to start electrical engine, has partial bodies stacked on each other such that bodies are fixed to each other and semiconductor elements are supplied with pressure |
| 01/20/2011 | DE102008020158A1 Abgeschrägter LED-Chip mit transparentem Substrat Beveled LED chip with a transparent substrate |
| 01/19/2011 | EP2276035A2 Multi-layer memory chip with interlayer connections |
| 01/19/2011 | EP2274774A1 Radiation-emitting semiconductor chip |
| 01/19/2011 | EP2274773A2 Die stacking with an annular via having a recessed socket |
| 01/19/2011 | CN201717287U Monochromatic source packaging structure with phosphor powder excitation chamber and projection optical engine |
| 01/19/2011 | CN201717263U Bridge type drive circuit chip |
| 01/19/2011 | CN201717262U Large-capacity thyristor power unit |
| 01/19/2011 | CN201717261U Light source plate with uniform heating |
| 01/19/2011 | CN201717260U Alternating current vertical structure semiconductor light emitting diode |
| 01/19/2011 | CN201717259U Low-power IGBT parallel radiator structure |
| 01/19/2011 | CN101952977A Reflective secondary optics and semiconductor assembly and method for the production thereof |
| 01/19/2011 | CN101950745A Semiconductor packaging structure and producing method thereof |
| 01/19/2011 | CN101950724A Thyristor pressing mechanism for direct current power transmission converter valve |
| 01/19/2011 | CN101667568B Preparation method of refrigeration structure for three-dimensional encapsulation of micro-electronics |
| 01/19/2011 | CN101488494B Conductive wire type semiconductor device and conductive wire rack thereof |
| 01/19/2011 | CN101459161B Integrate circuit |
| 01/19/2011 | CN101156237B Electronic device provided with wiring board, method for manufacturing such electronic device and wiring board used for such electronic device |
| 01/19/2011 | CN101090108B Composite semiconductor device and method of manufacturing the same |
| 01/18/2011 | USRE42035 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements |
| 01/18/2011 | US7873245 Optoelectric composite substrate and method of manufacturing the same |
| 01/18/2011 | US7872521 CCD device and method of driving same |
| 01/18/2011 | US7872339 Vertically stacked pre-packaged integrated circuit chips |
| 01/18/2011 | US7872280 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same |
| 01/18/2011 | US7872193 Solar panel and production method therefor |
| 01/18/2011 | US7872191 Electrolyte composition, photoelectric conversion element using the same, and dye-sensitized photovoltaic cell |
| 01/18/2011 | US7871502 forming onto Mo electrode layer a precursor including an In metal layer and a Cu Ga alloy layer by sputterining, coating by dipping an alkali layer containing sodium sulfide, or sodium tetraborate, or sodium aluminum sulfate on alloy layer, heat-treating the substrate by flowing H2Se gas to form CuGaSe |
| 01/18/2011 | CA2380356C Bulk-shaped lens, light-emitting unit, lighting equipment and optical information system |
| 01/13/2011 | WO2011004081A1 Power electronic module |
| 01/13/2011 | WO2011004019A1 Lighting apparatus |
| 01/13/2011 | WO2010104610A3 Stacked microelectronic assembly with microelectronic elements having vias extending through bond pads |
| 01/13/2011 | WO2008100324A3 Method for achieving very high bandwidth between the levels of a cache hierarchy in 3-dimensional structures, and a 3- dimensional structure resulting therefrom |
| 01/13/2011 | US20110006840 Fixing Full-Chip Violations Using Flip-Flops |
| 01/13/2011 | US20110006413 Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor package |
| 01/13/2011 | US20110006412 Semiconductor chip package and method for manufacturing thereof and stack package using the same |
| 01/13/2011 | US20110006391 Semiconductor device |
| 01/13/2011 | DE112006003049B4 Integriertes Schaltungspackage und Package-Substrat unter Verwendung eines Array-Kondensatorkerns und Verfahren zur Herstellung An integrated circuit package and the package substrate using an array capacitor core and process for preparing |
| 01/13/2011 | DE102010017711A1 Dreidimensionales LED-Trägerelement mit thermischer Leitfähigkeit Three-dimensional LED support element with thermal conductivity |
| 01/13/2011 | DE102010017710A1 Trägerelement für LED-Modul Support for LED light module |
| 01/13/2011 | DE102009032606A1 Optoelektronisches Bauteil und Flachlichtquelle The optoelectronic device and flat light source |
| 01/13/2011 | DE102009032424A1 Leuchtvorrichtung mit einer flexiblen Leiterplatte Light-emitting device with a flexible printed circuit board |
| 01/13/2011 | DE102006023123B4 Abstandserfassungsradar für Fahrzeuge mit einem Halbleitermodul mit Komponenten für Höchstfrequenztechnik in Kunststoffgehäuse und Verfahren zur Herstellung eines Halbleitermoduls mit Komponenten für ein Abstandserfassungsradar für Fahrzeuge in einem Kunststoffgehäuse Distance detection radar for vehicles with a semiconductor module with components for high frequency technology in plastic housing and method of manufacturing a semiconductor module with components for a distance detection radar for vehicles in a plastic housing |
| 01/12/2011 | EP2273545A1 Method for insertion bonding and device thus obtained |
| 01/12/2011 | EP2272215A1 Method and apparatus for repeating illumination information on a daisy chain bus structure |
| 01/12/2011 | EP2272091A1 Method for making microstructures by converting porous silicon into porous metal or ceramics |
| 01/12/2011 | EP2272090A2 Substrate-mounted circuit module comprising components in a plurality of contact planes |
| 01/12/2011 | EP2272084A2 A method of assembling wafers by molecular bonding |
| 01/12/2011 | CN201708731U LED solar battery assembly |
| 01/12/2011 | CN201708189U Mini-type high-power SMD light-emitting diode |
| 01/12/2011 | CN201708188U Ceramic high-power light emitting diode |
| 01/12/2011 | CN201708153U Laminated encapsulation structure of LED module |
| 01/12/2011 | CN201708152U Embedded S i P computer module |
| 01/12/2011 | CN201708151U Chip-type light-emitting diode (LED) encapsulation structure |
| 01/12/2011 | CN201706289U Light-emitting diode light source module |
| 01/12/2011 | CN101946337A Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product |
| 01/12/2011 | CN101946318A Semiconductor element module and method for manufacturing the same |
| 01/12/2011 | CN101944522A Lead frame, and electronic part using the same |
| 01/12/2011 | CN101944514A Semiconductor packaging structure and package manufacturing technology |
| 01/12/2011 | CN101944490A Forming structure of fluorescent powder colloid of light-emitting module and manufacture method thereof |
| 01/11/2011 | US7869221 Apparatus for non-conductively interconnecting integrated circuits |
| 01/11/2011 | US7868470 Semiconductor chip package and multichip package |
| 01/11/2011 | US7868283 Physical quantity detection device with pixel array column-aligned terminals and method of driving same |
| 01/11/2011 | US7868248 Chain link metal interconnect structure |
| 01/11/2011 | US7868246 Solar cell module and method of encapsulating same |
| 01/11/2011 | US7868245 Solar panel and production method therefor |
| 01/11/2011 | US7868244 Solar CPV cell module and method of safely assembling, installing, and/or maintaining the same |
| 01/11/2011 | CA2493650C Positioning system for portable solar panels |
| 01/06/2011 | WO2011002555A1 Multicolor light emitting diodes |
| 01/06/2011 | WO2011001789A1 Semiconductor device |
| 01/06/2011 | WO2011001520A1 Semiconductor device and method for manufacturing same |
| 01/06/2011 | WO2011001500A1 Dc-dc converter, module, power supply device and electronic apparatus |