| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/06/2011 | CN201788969U Light-emitting module with high heat-conduction and light-guiding functions |
| 04/06/2011 | CN201788968U Rectifier with single-layer lead frame |
| 04/06/2011 | CN1957465B Semiconductor device and wiring board |
| 04/06/2011 | CN102005516A Led chip and manufacturing method thereof |
| 04/06/2011 | CN102005509A Light-emitting diode (LED) and manufacturing method thereof |
| 04/06/2011 | CN102005453A Three dimensional structure memory |
| 04/06/2011 | CN102005448A Light emitting device |
| 04/06/2011 | CN102005447A LED (Light Emitting Diode) integrated structure with cooler |
| 04/06/2011 | CN102005446A Light-emitting diode (LED) packaging structure and LED luminescent display module |
| 04/06/2011 | CN102005445A Encapsulation structure of light emitting diode (LED) light source module |
| 04/06/2011 | CN102005444A Light emitting device and LCD backlight using the same |
| 04/06/2011 | CN102005443A Light-emitting diode (LED) packaging structure and manufacturing method thereof |
| 04/06/2011 | CN102005442A Power conversion device |
| 04/06/2011 | CN102005441A Hybrid packaged gate controlled semiconductor switching device and preparing method |
| 04/06/2011 | CN102005440A 集成电路结构及其形成方法 Integrated circuit structure and method of forming |
| 04/06/2011 | CN102005439A High frequency device |
| 04/06/2011 | CN102005438A Semiconductor package and method of manufacturing the same |
| 04/06/2011 | CN102005430A Double-sided graphics chip flip-chip module packaging method adopting plating firstly and etching secondly |
| 04/06/2011 | CN102003645A Light emitting diode (LED) integrated module |
| 04/06/2011 | CN101604686B Integrated circuit stacking construction with shimming assembly |
| 04/06/2011 | CN101523599B A light module package |
| 04/06/2011 | CN101506975B Stack die packages |
| 04/06/2011 | CN101452926B Hybrid integrated circuit device |
| 04/06/2011 | CN101436584B Stacked semiconductor package |
| 04/06/2011 | CN101295710B 半导体器件 Semiconductor devices |
| 04/06/2011 | CN101097905B Semiconductor and manufacturing method thereof |
| 04/06/2011 | CN101064287B Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit |
| 04/06/2011 | CN101034700B Electronic component integrated module and method for fabricating the same |
| 04/05/2011 | US7920021 Method of applying wire voltage to semiconductor device |
| 04/05/2011 | US7919980 Configurable circuit and configuration method |
| 04/05/2011 | US7919979 Field programmable gate array including a non-volatile user memory and method for programming |
| 04/05/2011 | US7919977 Circuits and methods for testing FPGA routing switches |
| 04/05/2011 | US7919873 Structure of high performance combo chip and processing method |
| 03/31/2011 | WO2011038336A1 Semiconductor die-based packaging interconnect |
| 03/31/2011 | WO2011036819A1 Method for manufacturing semiconductor device |
| 03/31/2011 | WO2011036307A1 Circuit arrangement and manufacturing method thereof |
| 03/31/2011 | WO2011035645A1 Led light bulb with multiple layers of radiating structures |
| 03/31/2011 | WO2011007307A3 Color temperature variable light emitter |
| 03/31/2011 | US20110074046 Printed wiring board and manufacturing method thereof |
| 03/31/2011 | US20110074018 Semiconductor device and method of manufacturing the same |
| 03/31/2011 | US20110074002 Stacking devices at finished package level |
| 03/31/2011 | US20110073879 Light-emitting device having light-emitting elements |
| 03/31/2011 | DE102009047789A1 Mischlichtquelle Mixed light source |
| 03/31/2011 | DE102009042400A1 Arrangement for size-optimized housing shape, has base chip and another chip arranged on main side of base chip and is electrically conducting by contact element |
| 03/31/2011 | DE102009042205A1 Optoelektronisches Modul The optoelectronic module |
| 03/30/2011 | EP2302676A1 High power semiconductor device |
| 03/30/2011 | EP2302674A1 Electrical terminal, electronic circuit module with an electrical terminal and corresponding method of manufacturing thereof |
| 03/30/2011 | EP2302283A2 Light-emitting device and illumination device |
| 03/30/2011 | EP2301086A1 Light emitting device package, back-light unit, and liquid crystal display device using the same |
| 03/30/2011 | EP2301071A2 Light source with near field mixing |
| 03/30/2011 | EP2301054A1 Light emitting device |
| 03/30/2011 | EP1756876B1 High density led array |
| 03/30/2011 | EP1055193B1 Data carrier with chip and fully enclosed connection means |
| 03/30/2011 | CN201780997U Heat radiating structure used in LED chip |
| 03/30/2011 | CN201780993U Light emitting diode element with encircled wall on baseplate |
| 03/30/2011 | CN201780970U Thyristor press mounting mechanism for direct-current power transmission converter valve |
| 03/30/2011 | CN101999169A Broadband light emitting device lamps for providing white light output |
| 03/30/2011 | CN101999168A Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking |
| 03/30/2011 | CN101997079A Light-emitting device |
| 03/30/2011 | CN101997077A Light emitting module |
| 03/30/2011 | CN101997073A Light emitting device and method for manufacturing same, lighting fixture, and lighting system |
| 03/30/2011 | CN101997067A Light emitting diode bracket structure |
| 03/30/2011 | CN101997064A Light-emitting diode (LED) |
| 03/30/2011 | CN101997063A Surface-mount light-emitting diode (LED) component, LED module and manufacturing methods thereof |
| 03/30/2011 | CN101997048A Solar battery module |
| 03/30/2011 | CN101996987A Light emitting module |
| 03/30/2011 | CN101996986A White light-emitting diode packages with tunable colour temperature |
| 03/30/2011 | CN101996985A Light-emitting diode (LED) encapsulation structure capable of positioning heat-conducting adhesive material and manufacturing method thereof |
| 03/30/2011 | CN101996984A Light-emitting diode packing structure of forming filling type convex lens and manufacturing method thereof |
| 03/30/2011 | CN101996983A Light-emitting diode encapsulation structure and bracket structure |
| 03/30/2011 | CN101996982A Electronic device and method of manufacturing the same |
| 03/30/2011 | CN101996981A Module comprising semiconductor devices and module manufacturing method |
| 03/30/2011 | CN101996980A Power semiconductor module and method for assembling the same |
| 03/30/2011 | CN101996979A Interposer, module and electronic device including the same |
| 03/30/2011 | CN101996978A Chip package body and forming method thereof |
| 03/30/2011 | CN101996960A Chip encapsulating structure realizing electrical connection without routing and manufacturing method thereof |
| 03/30/2011 | CN101996959A Chip encapsulation structure capable of realizing electrical connection without routing and manufacture method thereof |
| 03/30/2011 | CN101996894A Semiconductor device and method of forming dam material around periphery of die to reduce warpage |
| 03/30/2011 | CN101996893A Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die |
| 03/30/2011 | CN101996892A System level photoelectric structure and manufacturing method thereof |
| 03/30/2011 | CN101994926A Illumination equipment employing light-emitting diode elements |
| 03/30/2011 | CN101994921A Light-emitting diode (LED) plane light source |
| 03/30/2011 | CN101994913A Improvement on 3528RGB three-in-one LED packaging structure for LED electronic display |
| 03/30/2011 | CN101719492B Encapsulating structure of light-emitting diode (LED) and encapsulating method thereof |
| 03/30/2011 | CN101681906B 功率模块 Power Modules |
| 03/30/2011 | CN101660678B Method for packaging white LED light source module |
| 03/30/2011 | CN101645442B Light-emitting diode devices |
| 03/30/2011 | CN101621109B Semiconductor structure and light-emitting diode |
| 03/30/2011 | CN101567365B Light-emitting chip packaging structure with high-efficiency radiating substrate and method for packaging light-emitting chip |
| 03/30/2011 | CN101540305B Semiconductor package and manufacturing methods thereof |
| 03/30/2011 | CN101499466B Thermoelectric module |
| 03/30/2011 | CN101447474B Image sensing wafer package structure and imaging module used by same |
| 03/30/2011 | CN101257015B Organic electroluminescent device and fabrication method thereof |
| 03/30/2011 | CN101232013B Organic illuminated display element and manufacturing method thereof |
| 03/29/2011 | US7915926 Semiconductor chip and semiconductor device including the same |
| 03/29/2011 | US7915699 Integrated circuit chip that supports through-chip electromagnetic communication |
| 03/29/2011 | US7915575 Laser scanning microscope having an IR partial transmission filter for realizing oblique illumination |
| 03/29/2011 | US7915518 Solar battery module manufacturing method |
| 03/29/2011 | US7915084 Method for making a stacked package semiconductor module having packages stacked in a cavity in the module substrate |
| 03/24/2011 | WO2011034054A1 Electronic control device for vehicle |