| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/08/2011 | US7902865 Compression and decompression of configuration data using repeated data frames |
| 03/08/2011 | US7902668 Flip chip semiconductor device including an unconnected neutralizing electrode |
| 03/08/2011 | US7902656 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 03/08/2011 | US7902651 Apparatus and method for stacking integrated circuits |
| 03/08/2011 | US7902648 Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods |
| 03/08/2011 | US7902627 Capacitive isolation circuitry with improved common mode detector |
| 03/03/2011 | WO2011025894A1 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers |
| 03/03/2011 | WO2011025679A1 3d memory devices decoding and routing systems and methods |
| 03/03/2011 | WO2011024851A1 Semiconductor integrated circuit device |
| 03/03/2011 | WO2011024819A1 Semiconductor device and method for designing wire bonding structure for semiconductor device |
| 03/03/2011 | US20110050335 Low-capacitance electrostatic discharge protection diodes |
| 03/03/2011 | US20110050334 Integrated Voltage Regulator with Embedded Passive Device(s) |
| 03/03/2011 | US20110050284 Sense amplifier circuit and related configuration and operation methods |
| 03/03/2011 | US20110049696 Off-chip vias in stacked chips |
| 03/03/2011 | US20110049365 Low energy portable low-light camera with wavelength cutoff |
| 03/03/2011 | DE102010033789A1 Multichipmodul und Verfahren zum Herstellen desselben Of the same multi-chip module and method of producing |
| 03/03/2011 | DE102009032984B3 Biegbare Leuchtmodule und Verfahren zum Herstellen von biegbaren Leuchtmodulen Bendable lighting modules and method for the manufacture of flexible lighting modules |
| 03/03/2011 | DE10011843B4 Kraftfahrzeugleuchte und Verfahren zum Einstellen verschiedener Signalisierungen A motor vehicle lamp and method for setting various signallings |
| 03/02/2011 | EP2290690A2 Light emitting device |
| 03/02/2011 | EP2290689A2 Light emitting device and light emitting device package having the same |
| 03/02/2011 | EP2290688A2 Arrangement comprising at least one semiconductor component, in particular a power semiconductor component for the power control of high currents |
| 03/02/2011 | EP2290682A2 Package with a chip embedded between two substrates and method of manufacturing the same |
| 03/02/2011 | EP2290279A2 Light-mixing LED package structure for increasing color render index and brightness |
| 03/02/2011 | EP1553641B1 Light-emitting device having light-emitting diodes |
| 03/02/2011 | CN101983429A Electronic component used for wiring and method for manufacturing the same |
| 03/02/2011 | CN101983428A Method for producing a plurality of optoelectronic components |
| 03/02/2011 | CN101982877A Semiconductor device |
| 03/02/2011 | CN101207116B Semiconductor package on package having plug-socket type wire connection between packages |
| 03/01/2011 | US7898275 Known good die using existing process infrastructure |
| 03/01/2011 | US7897982 Light emitting device having common N-electrode |
| 02/24/2011 | WO2011021364A1 Semiconductor device and manufacturing method therefor |
| 02/24/2011 | WO2011020825A1 Artificial photosynthesis |
| 02/24/2011 | WO2011020341A1 Electronic module and packaging method thereof |
| 02/24/2011 | US20110045635 Vertically stacked pre-packaged integrated circuit chips |
| 02/24/2011 | US20110044862 Method for bonding plastic micro chip |
| 02/24/2011 | US20110044009 Semiconductor device |
| 02/24/2011 | US20110042825 Semiconductor device |
| 02/24/2011 | DE102010039148A1 Elektronische Vorrichtung und Verfahren zu deren Fertigung An electronic device and method for its manufacturing |
| 02/24/2011 | DE102010036915A1 Eingebettetes lamininiertes Bauelement Embedded lamininiertes component |
| 02/24/2011 | DE102010036812A1 Mehrchipmodul und Verfahren zu seiner Herstellung A multi-chip module and method for its preparation |
| 02/24/2011 | DE102010036678A1 Multichip-Modul und Verfahren zu seiner Herstellung Multi-chip module and method for its preparation |
| 02/24/2011 | DE102010036402A1 Lufthohlraum-Baustein mit Kupferkühlkörper und keramischem Fensterrahmen Air cavity block with copper heat sink and ceramic window frame |
| 02/24/2011 | DE102009054535A1 Light emitting diode is provided with housing, where light emitting diode chip is provided with electrostatic discharge protection diode |
| 02/24/2011 | DE102009037919A1 LED-Modul, Verfahren zu dessen Herstellung und LED-Beleuchtungsvorrichtung LED module, process for its preparation and LED lighting device |
| 02/23/2011 | EP2287925A2 Expansion compensated optoelectronic semiconductor device, in particular UV emitting diode and process for manufacturing the same |
| 02/23/2011 | EP2287922A1 Organic photosensitive optoelectronic device |
| 02/23/2011 | EP2287916A2 Method of contacting and housing integrated circuits |
| 02/23/2011 | EP2287905A2 High frequency circuit having multi-chip module structure |
| 02/23/2011 | EP2287904A1 Method for assembling two electronic components |
| 02/23/2011 | EP2286452A1 3-d integrated circuit lateral heat dissipation |
| 02/23/2011 | EP2286409A1 Proximity optical memory module |
| 02/23/2011 | CN201752014U Super-high voltage semiconductor rectifier |
| 02/23/2011 | CN201752013U Packaging structure capable of directly placing multi-ring pin by chip and passive device |
| 02/23/2011 | CN101981693A Light emitting device package |
| 02/22/2011 | US7894203 Multilayer printed wiring board |
| 02/22/2011 | US7894192 Integrated circuit package support system |
| 02/22/2011 | US7893757 Multi-chip package semiconductor device |
| 02/22/2011 | CA2498133C A scalable computer system having surface-mounted capacitive couplers for intercommunication |
| 02/17/2011 | WO2011018973A1 Mems sensor package |
| 02/17/2011 | WO2011017994A1 High frequency fast recovery diode |
| 02/17/2011 | US20110038127 Multiple chip module and package stacking method for storage devices |
| 02/17/2011 | US20110037498 Vlsi layouts of fully connected generalized networks |
| 02/17/2011 | US20110037449 Semiconductor device |
| 02/17/2011 | US20110037158 Ball-grid-array package, electronic system and method of manufacture |
| 02/17/2011 | DE202010016257U1 LED-Modul mit Gehäuseverbinder LED module with housing connector |
| 02/17/2011 | DE102009037415A1 Halbleiterlichtquelle Semiconductor light source |
| 02/17/2011 | DE102009037259A1 Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul Arrangement with a cooling device and a power semiconductor module |
| 02/17/2011 | DE102009037257A1 Leistungshalbleitermodul mit Schaltungsträger und Lastanschlusselement sowie Herstellungsverfahren hierzu Power semiconductor module with circuit carriers and load connection element and manufacturing method therefor |
| 02/17/2011 | DE102009037186A1 Strahlungsemittierendes Halbleiterbauteil Radiation-emitting semiconductor component |
| 02/16/2011 | EP2284915A2 Light emitting diode |
| 02/16/2011 | EP2284914A1 LED package comprising leadframe and two-part heatsink |
| 02/16/2011 | EP2284893A2 Photovoltaic module with an electronic device |
| 02/16/2011 | EP2284889A1 High performance semiconductor module with switch holder and load connection element and corresponding production method |
| 02/16/2011 | EP2284887A2 Module comprising semiconductor devices and module manufacturing method |
| 02/16/2011 | EP2284881A1 High frequency storing case and high frequency module |
| 02/16/2011 | EP2284880A1 Package structure and package process |
| 02/16/2011 | EP2284439A2 Front headlamp with a LED module for partial high beam |
| 02/16/2011 | EP2283275A1 Led lighting array |
| 02/16/2011 | EP2282944A1 Device for packing or unpacking or sorting stackable objects, in particular wafers |
| 02/16/2011 | EP1719178B1 Micro-optics on optoelectronics |
| 02/16/2011 | EP1317769B1 Connection for conducting high frequency signal between a circuit and a discrete electrical component |
| 02/16/2011 | CN201749867U Monochrome LED encapsulation structure with high light transmittance and projection optical engine employing same |
| 02/16/2011 | CN201749865U LED heat dissipation structure |
| 02/16/2011 | CN201749850U Light-emitting diode encapsulation module |
| 02/16/2011 | CN201749849U Planar light-emitting diode (LED) structure |
| 02/16/2011 | CN101978494A 电压源转换器 Voltage Source Converter |
| 02/16/2011 | CN101978493A Semiconductor assembly having reduced thermal spreading resistance and methods of making same |
| 02/16/2011 | CN101978492A Method for manufacturing electronic component module |
| 02/16/2011 | CN101521253B Solid luminous element and light source module |
| 02/16/2011 | CN101290918B Chip packaging structure |
| 02/16/2011 | CN101226925B Wiring structure of long line series infrared detector dewar assembly and connecting method thereof |
| 02/15/2011 | US7888805 Semiconductor device package of stacked semiconductor chips with spacers provided therein |
| 02/15/2011 | US7888690 Image display unit with light emitting devices having a resin surrounding the light emitting devices |
| 02/15/2011 | US7888591 Silicon-based photovoltaic cell and its red light conversion layer |
| 02/15/2011 | US7888588 Tracking solar collector assembly |
| 02/15/2011 | US7888587 Modular shade system with solar tracking panels |
| 02/15/2011 | CA2666081C High temperature, high voltage sic void-less electronic package |
| 02/10/2011 | WO2011016907A1 Lighting device having first, second and third groups of solid state light emitters, and lighting arrangement |
| 02/10/2011 | WO2011016555A1 Semiconductor device and method for manufacturing same |
| 02/10/2011 | WO2011016360A1 Power converter |