| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/20/2011 | CN102024712A Packaging structure and method for manufacturing the same |
| 04/20/2011 | CN102024710A Method for manufacturing photoelectric element, encapsulation structure and encapsulation device thereof |
| 04/20/2011 | CN102022625A Led packaging structure |
| 04/20/2011 | CN101574022B Electronic circuit device, process for manufacturing the same and display apparatus |
| 04/20/2011 | CN101572260B Multi-chip stacking type packaging body |
| 04/20/2011 | CN101552264B Power module and its manufacture method |
| 04/20/2011 | CN101510543B Integrated semiconductor device |
| 04/20/2011 | CN101459164B 功率半导体模块及其组合方法 Power semiconductor module and a combination method |
| 04/20/2011 | CN101452862B Encapsulation method with grains reconfigured |
| 04/20/2011 | CN101449377B 半导体器件 Semiconductor devices |
| 04/20/2011 | CN101438408B Composite LED modules |
| 04/20/2011 | CN101438406B Light-emitting device with inorganic housing |
| 04/20/2011 | CN101432896B Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
| 04/20/2011 | CN101334679B Temperature sensing device for powered electronic apparatus |
| 04/20/2011 | CN101281903B Multiple encapsulation structure |
| 04/20/2011 | CN101271884B Luminous source encapsulation body |
| 04/20/2011 | CN101261987B Electronic-component-mounting board |
| 04/20/2011 | CN101232776B Printed circuit board |
| 04/20/2011 | CN101221947B Semiconductor component including a semiconductor chip and a passive component and its manufacture method |
| 04/20/2011 | CN101188226B Chip package structure and fabricating process thereof |
| 04/19/2011 | US7930658 Semiconductor integrated circuit device and fabrication method thereof |
| 04/19/2011 | US7928764 Programmable interconnect network for logic array |
| 04/19/2011 | US7928589 Semiconductor device |
| 04/14/2011 | WO2011044390A1 Apparatus and method for through silicon via impedance matching |
| 04/14/2011 | WO2011043493A1 Semiconductor device |
| 04/14/2011 | WO2011042667A1 Power module for an automobile |
| 04/14/2011 | WO2011042256A1 Chip package with a chip embedded in a wiring body |
| 04/14/2011 | US20110084758 Semiconductor device |
| 04/14/2011 | US20110084380 Semiconductor packages having passive elements mounted thereonto |
| 04/14/2011 | DE112009001315T5 Vollbrückenmodul mit vier MOSFETs Full-bridge module with four MOSFETs |
| 04/14/2011 | DE102010021214A1 Wechselstrombetriebene Leuchtdioden-Lichtvorrichtung, und dessen wechselstrombetriebens Leuchtdioden-Packungselement AC powered LED light device and its AC betriebens light-emitting element pack |
| 04/14/2011 | DE102010008485A1 Leistungshalbleitergerät Power semiconductor device |
| 04/14/2011 | DE102009048988A1 Thermoelectric partial unit for thermoelectric unit of thermoelectric element, has partial element made of metallic material, thermoelectric pellet made of thermoelectric material and connecting layer |
| 04/13/2011 | EP2309535A1 Chip package with a chip embedded in a wiring body |
| 04/13/2011 | EP2308108A1 Warm white light emitting apparatus and back light module comprising the same |
| 04/13/2011 | EP2308101A2 Semiconductor light converting construction |
| 04/13/2011 | EP2308087A1 Stacking of wafer-level chip scale packages having edge contacts |
| 04/13/2011 | CN201796891U Radiating device for integrated LED |
| 04/13/2011 | CN201796890U LED substrate structure |
| 04/13/2011 | CN201796889U Novel monochromatic LED |
| 04/13/2011 | CN201796888U LED module |
| 04/13/2011 | CN201796887U Backlight LED |
| 04/13/2011 | CN201796886U Metallized plane rectifier |
| 04/13/2011 | CN201796885U Simple ceramic piezoelectric voltage transformation conversion module |
| 04/13/2011 | CN201796884U Embedded chip type resistance LED |
| 04/13/2011 | CN201796880U Semi-conductor package |
| 04/13/2011 | CN201795340U LED chip light source module manufactured by display chips |
| 04/13/2011 | CN1830083B Semiconductor device and manufacturing method thereof |
| 04/13/2011 | CN1763584B Method and apparatus for mixing light emitted by a plurality of solid-state light emitters |
| 04/13/2011 | CN102017143A Radiation-emitting semiconductor chip |
| 04/13/2011 | CN102017142A Three-dimensionally integrated semiconductor device and method for manufacturing the same |
| 04/13/2011 | CN102017141A Surface-mounted LED module and method for producing a surface-mounted LED module |
| 04/13/2011 | CN102017140A Semiconductor device |
| 04/13/2011 | CN102017139A 3-D integrated circuit lateral heat dissipation |
| 04/13/2011 | CN102017138A Die stacking system and method |
| 04/13/2011 | CN102017135A Substrate-mounted circuit module comprising components in a plurality of contact planes |
| 04/13/2011 | CN102017074A A method of assembling wafers by molecular bonding |
| 04/13/2011 | CN102016409A Waterproof LED beacon light |
| 04/13/2011 | CN102013422A Insulated gate bipolar translator power tube module |
| 04/13/2011 | CN102013416A Semiconductor power device packaging adopting two-sided evaporation, cooling and press welding |
| 04/13/2011 | CN101661942B Terahertz wave generating device and apparatus using the same |
| 04/13/2011 | CN101604688B High-power LED oscillation package structure |
| 04/13/2011 | CN101599468B 电子部件 Electronic components |
| 04/13/2011 | CN101587869B Reversible leadless package and methods of making and using same |
| 04/13/2011 | CN101582415B Semiconductor device |
| 04/13/2011 | CN101582401B 芯片封装单元 Chip packaging unit |
| 04/13/2011 | CN101521256B Light emitting diode package having multiple molding resins |
| 04/13/2011 | CN101510545B Light-emitting device |
| 04/13/2011 | CN101494173B Packaging structure and packaging method for LED chip with crassitude luminous surface |
| 04/13/2011 | CN101473436B Method for achieving very high bandwidth between the levels of a cache hierarchy in 3-dimensional structures, and a 3-dimensional structure resulting therefrom |
| 04/13/2011 | CN101465346B Semiconductor device and method for manufacturing the device |
| 04/13/2011 | CN101401206B Circuit module, wireless communication apparatus and circuit module manufacturing method |
| 04/13/2011 | CN101388387B Electronic device and its manufacture method |
| 04/13/2011 | CN101278383B Electronic circuit device and method for manufacturing same |
| 04/13/2011 | CN101257013B Semiconductor device and semiconductor module using the same |
| 04/13/2011 | CN101026152B Light-emitting device |
| 04/12/2011 | US7924845 Message-based low latency circuit emulation signal transfer |
| 04/12/2011 | US7924053 Clustered field programmable gate array architecture |
| 04/12/2011 | US7924052 Field programmable gate array architecture having Clos network-based input interconnect |
| 04/07/2011 | WO2011040153A1 Semiconductor device, power semiconductor module, and power conversion device equipped with power semiconductor module |
| 04/07/2011 | WO2011040054A1 Insulation circuit board, and power semiconductor device or inverter module using the same |
| 04/07/2011 | WO2011039023A1 Optoelectronic component |
| 04/07/2011 | WO2011038948A1 Mixed light source |
| 04/07/2011 | WO2011038708A1 Optoelectronic semiconductor chip and method for adapting a contact structure for electrically contacting an optoelectronic semiconductor chip |
| 04/07/2011 | WO2011038552A1 Power saving lamp with better heat radiating function |
| 04/07/2011 | US20110080212 Semiconductor device, display device, and electronic device |
| 04/07/2011 | US20110079890 Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure |
| 04/07/2011 | US20110079714 Imager for constructing color and depth images |
| 04/07/2011 | DE102010035459A1 Antriebsvorrichtung für einen fahrzeugmontierten Elektromotor Driving apparatus for a vehicle-mounted electric motor |
| 04/07/2011 | DE102006025960B4 Verfahren zur Herstellung einer integrierten Halbleitereinrichtung A method of manufacturing an integrated semiconductor device |
| 04/06/2011 | EP2304817A2 Solid state lighting component |
| 04/06/2011 | EP2304792A1 Active thermal control for stacked ic devices |
| 04/06/2011 | CN201788998U Luminous module with high thermal conductivity and light guiding functions and application device thereof |
| 04/06/2011 | CN201788997U Light emitting diode support structure |
| 04/06/2011 | CN201788995U Light-emitting diode |
| 04/06/2011 | CN201788974U High-power light emitting diode component |
| 04/06/2011 | CN201788973U Package carrier structure of photoelectric component |
| 04/06/2011 | CN201788972U Light-emitting diode assembly |
| 04/06/2011 | CN201788971U Light-emitting module group with high heat-conduction and light-guiding function and application device |
| 04/06/2011 | CN201788970U Light-emitting module with high heat conducting and light guiding functions and application device |