| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/10/2011 | WO2011016242A1 Semiconductor device and method for manufacturing same |
| 02/10/2011 | WO2011016157A1 Semiconductor device and electronic device |
| 02/10/2011 | US20110033022 Digital logic circuit, shift register and active matrix device |
| 02/10/2011 | US20110032029 Configurable embedded processor |
| 02/10/2011 | US20110031600 Semiconductor package |
| 02/10/2011 | US20110031599 Stacked semiconductor package |
| 02/10/2011 | US20110031598 Semiconductor device and fabricating method thereof |
| 02/10/2011 | US20110031553 Semiconductor device having transistors each having gate electrode of different metal ratio and production process thereof |
| 02/10/2011 | DE202006020926U1 Leuchte Light |
| 02/10/2011 | DE102009042106B3 Solar panel system, has solar cell modules comprising solar cells that are connected in series, where one of solar cell modules is provided in one of regions in which shadow impact is not allowed |
| 02/10/2011 | DE102009036621A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements und optoelektronisches Halbleiterbauelement A method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component |
| 02/09/2011 | EP2282340A2 Light emitting module |
| 02/09/2011 | EP2282339A1 Power semiconductor module with a load connection terminal having a symmetrical current distribution |
| 02/09/2011 | EP2282334A1 Substrate for power module, power module, and method for producing substrate for power module |
| 02/09/2011 | EP2281305A1 Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking |
| 02/09/2011 | CN201741717U Optical module for increasing light receiving efficiency |
| 02/09/2011 | CN201741695U LED surface sticking device with black appearance |
| 02/09/2011 | CN201741694U Ceramic radiator |
| 02/09/2011 | CN201741693U Material strip of LED lead rack |
| 02/09/2011 | CN201741692U Lead type bridging rectifying device |
| 02/09/2011 | CN201741691U Darlington transistor capable of clamping |
| 02/09/2011 | CN1921109B Power semiconductor module with mounting device |
| 02/09/2011 | CN101971486A Semiconductor device, and communication apparatus and electronic apparatus provided with semiconductor device |
| 02/09/2011 | CN101971380A Optoelectronic component |
| 02/09/2011 | CN101971377A Led light engine kernel and method of making the kernel |
| 02/09/2011 | CN101971335A Illumination means |
| 02/09/2011 | CN101971334A Stackable communications system |
| 02/09/2011 | CN101971312A Resin varnish for semiconductor element bonding film formation, semiconductor element bonding film, and semiconductor device |
| 02/09/2011 | CN101971265A Methods for manufacturing a stack of memory circuits and for addressing a memory circuit, corresponding stack and device |
| 02/09/2011 | CN101970929A Led lamp and method for its design |
| 02/09/2011 | CN101969058A Planar LED structure |
| 02/09/2011 | CN101968204A LED lighting device capable of preventing LED chips falling off LED module |
| 02/09/2011 | CN101552263B Wafer-level packaging of chip and packaging method thereof |
| 02/09/2011 | CN101504965B Light emitting dipolar body and back light module unit |
| 02/09/2011 | CN101138089B Stacked type semiconductor device and method for fabricating the same |
| 02/08/2011 | US7886240 Modifying layout of IC based on function of interconnect and related circuit and design structure |
| 02/08/2011 | US7884459 Semiconductor device suitable for a stacked structure |
| 02/08/2011 | US7884007 Super high density module with integrated wafer level packages |
| 02/08/2011 | US7883993 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same |
| 02/08/2011 | US7883985 Chip and multi-chip semiconductor device using the chip, and method for manufacturing same |
| 02/03/2011 | WO2011014409A1 System-in packages |
| 02/03/2011 | WO2011012083A1 Light-emitting diode with high light efficiency and encapsulation method thereof |
| 02/03/2011 | WO2011011902A1 Led illuminating device and chip of led array |
| 02/03/2011 | WO2010144843A3 Intra-die routing using through-silicon via and back side redistribution layer and associated method |
| 02/03/2011 | US20110024917 Multi-die package |
| 02/03/2011 | US20110024889 Package architecture |
| 02/03/2011 | US20110024841 Mosfet with asymmetrical extension implant |
| 02/03/2011 | DE102009032886A1 Leuchtdiodenbauteil, Leuchtdiodenmodul und Anzeigevorrichtung Light-emitting device, light emitting module and display device |
| 02/03/2011 | DE102008039388B4 Gestapelte Halbleiterchips und Herstellungsverfahren Stacked semiconductor chips and manufacturing processes |
| 02/03/2011 | DE102006023168B4 Herstellungsverfahren für eine elektronische Schaltung Manufacturing method for an electronic circuit |
| 02/02/2011 | EP2279516A1 Multi-junction silicon thin film solar cell using plasma inside vapor deposition |
| 02/02/2011 | EP2097202B1 Wire and solder bond forming methods |
| 02/02/2011 | CN201732809U Encapsulating structure of LED lighting source |
| 02/02/2011 | CN201732786U Solar panel with integrated bypass chip |
| 02/02/2011 | CN201732785U LED module and LED lighting fixture |
| 02/02/2011 | CN201732784U Led点阵模块 Led dot matrix module |
| 02/02/2011 | CN101964383A Method for preventing interference among chips and multi-chip LED encapsulation module |
| 02/02/2011 | CN101964341A Light-emitting structure with a plurality of backup welding pads for improving lead welding success rate and manufacture method thereof |
| 02/02/2011 | CN101964340A Power amplifier packaging device and base station equipment |
| 02/02/2011 | CN101964331A Power semiconductor module with a sandwich with a power semiconductor component |
| 02/02/2011 | CN101963296A Manufacture method of LED integrated structure |
| 02/02/2011 | CN101963295A LED (Light Emitting Diode) integrated structure, manufacturing method, lamp, display screen, backlight device, projecting device and injection mould of forming plastic part |
| 02/02/2011 | CN101963289A LED packaging structure with outside cutting bevel edges and manufacture method thereof |
| 02/02/2011 | CN101963288A Light-emitting structure capable of improving light-emitting efficiency and controlling emergent angle and manufacture method thereof |
| 02/02/2011 | CN101692447B Multi-CCD super field of view image mosaic photoelectric system |
| 02/02/2011 | CN101582434B Image sensor packaging structure, manufacturing method thereof and camera module |
| 02/02/2011 | CN101465344B Encapsulation structure of image die set |
| 02/01/2011 | US7881069 Printed circuit board |
| 02/01/2011 | US7880277 Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly |
| 02/01/2011 | US7880190 Combined semiconductor device, LED print head, and image forming apparatus |
| 02/01/2011 | US7880185 Semiconductor light emitting device with a substrate having a cross sectional trapezoidal shape and an oblique surface |
| 02/01/2011 | US7880184 Image display unit |
| 02/01/2011 | US7880179 Process for making contact with and housing integrated circuits |
| 02/01/2011 | US7880088 Power electronic switching device with laminated bus |
| 02/01/2011 | US7880080 Junction box for output wiring from solar module and method of installing same |
| 02/01/2011 | US7879647 Semiconductor device and a method of manufacturing the same |
| 01/27/2011 | WO2011011212A1 A high-bandwidth ramp-stack chip package |
| 01/27/2011 | WO2011009821A1 Method for manufacturing a light source and light source |
| 01/27/2011 | US20110021002 Process for Making Contact with and Housing Integrated Circuits |
| 01/27/2011 | US20110019377 Modular Integrated Circuit Chip Carrier |
| 01/27/2011 | US20110018623 Integrated circuit package |
| 01/27/2011 | US20110018115 Pop precursor with interposer for top package bond pad pitch compensation |
| 01/27/2011 | DE102010030085A1 Fahrzeug-Leistungselektronik mit Leistungstransistoren mit breiter Bandlücke A vehicle power electronics with power transistors wide bandgap |
| 01/27/2011 | DE102009034138A1 Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleitermodul Power semiconductor module having a sandwich with a power semiconductor module |
| 01/27/2011 | DE102009033915A1 Verfahren zur Herstellung eines Leuchtmittels und Leuchtmittel Process for the preparation of a lamp and light source |
| 01/27/2011 | DE102006038479B4 Leistungshalbleitermodul mit zwei Mehrfach-Leistungshalbleiterbauelementen Power semiconductor module with two multiple-power semiconductor components |
| 01/26/2011 | EP2278614A1 Electrical via with lateral extensions |
| 01/26/2011 | EP2278613A1 Ring-shaped electrical via made of a plurality of elementary conductive vias |
| 01/26/2011 | EP2277198A1 Led arrangement |
| 01/26/2011 | EP2277197A1 Interposers, electronic modules, and methods for forming the same |
| 01/26/2011 | EP1631988B1 Power semiconductor module |
| 01/26/2011 | EP1568076B1 LED package comprising leadframe and two-part heatsink and method of manufacturing the same |
| 01/26/2011 | CN201725809U LED device |
| 01/26/2011 | CN201725793U Automobile rectifier bridge |
| 01/26/2011 | CN201725791U Lead frame of small outline integrated circuit package structure and package device |
| 01/26/2011 | CN101960593A High current control circuit including metal-insulator transition device, and system including the high current control circuit |
| 01/26/2011 | CN101960592A Circuit for preventing self-heating of metal-insulator-transition (mit) device and method of fabricating integrated-device for the same circuit |
| 01/26/2011 | CN101960591A Semiconductor device, semiconductor device manufacturing method, printed circuit board and electronic device |
| 01/26/2011 | CN101960585A Assembly including a wire member and a microelectronic chip with a notch, including at least one stud for holding the wire member |
| 01/26/2011 | CN101958316A LED integrated packaging power source module |