Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2010
12/28/2010US7859304 Multiple data rate interface architecture
12/28/2010US7859119 Stacked flip chip die assembly
12/28/2010US7859095 Method of manufacturing semiconductor device
12/28/2010US7859079 Power semiconductor device
12/28/2010US7858873 Photovoltaic cell and photovoltaic module employing the same
12/23/2010WO2010147202A1 Power converter
12/23/2010WO2010147201A1 Power conversion device
12/23/2010WO2010147199A1 Wiring board and power conversion device
12/23/2010WO2010147000A1 Laminated wiring board
12/23/2010WO2010145694A1 Cooling of electrical components
12/23/2010US20100323475 Integrated circuit device
12/23/2010US20100320597 Wafer level stack structure for system-in-package and method thereof
12/23/2010US20100320585 Packaged integrated circuit devices with through-body conductive vias, and methods of making same
12/23/2010US20100320584 Semiconductor chip laminated body
12/23/2010DE102007044684B4 Kompakte Hochintensitäts LED basierte Lichtquelle und Verfahren zum Herstellen derselben Compact, high-intensity LED based light source and method of making same
12/23/2010DE102006027481B4 Leistungshalbleitermodul mit gegeneinander elektrisch isolierten Anschlusselementen Power semiconductor module with mutually electrically insulated connecting elements
12/22/2010EP2265101A1 Printed circuit board and method of manufacturing printed circuit board
12/22/2010EP2264894A1 Power module with additional transient current path and power module system
12/22/2010EP2264787A2 High efficiency multi-junction solar cells
12/22/2010EP2264762A2 Illumination device with at least one LED as the light source
12/22/2010EP2264761A2 Method for producing a high power semiconductor module and high power semiconductor module with a connection device
12/22/2010EP2264760A2 Control connection contact device for a high power semiconductor device
12/22/2010EP2263601A1 Toothbrush with severable electrical connections
12/22/2010EP2263266A2 Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product
12/22/2010CN201681967U Light-emitting diode packaging structure for improving luminous efficiency
12/22/2010CN201681966U LED luminous source, LED light source module and light source module
12/22/2010CN201681961U LED package of coarsening surface
12/22/2010CN201681938U Non-paddle multiturn pin passive device packaging structure
12/22/2010CN201681937U Packaging structure of passive component of electrostatic release ring with no basic island
12/22/2010CN201681936U Passive component packaging structure without substrate
12/22/2010CN201681935U Non-paddle multiturn pin static release ring passive device packaging structure
12/22/2010CN201681934U Encapsulating structure for passive device with base island and multi-ring pins
12/22/2010CN201681933U Pin-type packaging structure with direct placement of chip and reactive device
12/22/2010CN201681932U Encapsulation structure of multi-chip inversion and passive device
12/22/2010CN201681931U Chip reverse arrangement and passive device encapsulation structure
12/22/2010CN201681930U Encapsulation structure for passive device with multiple base-island embedded multi-turn pins
12/22/2010CN201681929U Chip module encapsulation structure
12/22/2010CN201681928U Carrier chip with metal ball bonding pad
12/22/2010CN201681927U High-power LED chip integrated encapsulating structure
12/22/2010CN201681926U High-color-rendering light source module
12/22/2010CN201681925U High-efficient array type LED packaging structure
12/22/2010CN201681924U Exposing type passive-component packaging structure of base island
12/22/2010CN201681923U System-level package structure for invert arrangement of chip and bonding of passive component on carrier chip
12/22/2010CN201681830U Semiconductor encapsulation element connected through silver plated bonding copper wire
12/22/2010CN201681829U Semiconductor packaging member connected by nickel-plated bonding copper wire
12/22/2010CN201680214U Light-emitting device using alternating current
12/22/2010CN201680207U LED (light-emitting diode) light source module
12/22/2010CN1881579B Light emitting apparatus
12/22/2010CN1702863B Circuit device
12/22/2010CN101926002A Lighting unit with temperature compensation
12/22/2010CN101924188A Organic luminous fiber and luminous device thereof
12/22/2010CN101924157A Receiver for photovoltaic concentrator system comprising III-V semiconductor solar cells
12/22/2010CN101924100A Photoelectric device with variable resistor structure
12/22/2010CN101924099A Light-emitting diode device
12/22/2010CN101924098A Light-emitting diode module
12/22/2010CN101924091A Circuit apparatus
12/22/2010CN101924080A Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module
12/22/2010CN101924047A Semiconductor device and method of manufacturing the same
12/22/2010CN101924043A Method for producing a current converter system with cooling device and a current converter system
12/22/2010CN101924040A Chip repairing method and chip stack structure
12/22/2010CN101922624A High-power LED surface light source
12/22/2010CN101256966B Semiconductor component and method of manufacture
12/22/2010CN101071810B 半导体器件 Semiconductor devices
12/22/2010CN101064299B Power semiconductor module in pressure contact layout
12/21/2010US7855894 Printed circuit board
12/21/2010US7855579 Semiconductor integrated circuit and design method thereof
12/21/2010US7855451 Device having a contacting structure
12/21/2010US7855429 Electronic circuit device having silicon substrate
12/21/2010US7854062 Method for manufacturing circuit device
12/16/2010WO2010144843A2 Intra-die routing using back side redistribution layer and associated method
12/16/2010WO2010144637A1 Integrated solar photovoltaic ac module
12/16/2010WO2010144467A1 Through silicon via with embedded decoupling capacitor
12/16/2010WO2010143379A1 Method of producing electronic component mounting structure, and electronic component mounting structure
12/16/2010WO2010143369A1 Semiconductor device and fabricating method therefor
12/16/2010WO2010143273A1 Semiconductor device
12/16/2010WO2010116694A3 Method of manufacturing semiconductor device
12/16/2010WO2010062946A3 Antenna integrated in a semiconductor chip
12/16/2010US20100315828 Light source and vehicle lamp
12/16/2010US20100315159 High voltage power integrated circuit
12/16/2010US20100314740 Semiconductor package, stack module, card, and electronic system
12/16/2010US20100314739 Package-on-package technology for fan-out wafer-level packaging
12/16/2010US20100314738 Integrated circuit packaging system with a stack package and method of manufacture thereof
12/16/2010US20100314735 Processes and structures for IC fabrication
12/16/2010US20100314729 Stacked Chip Package Structure with Leadframe Having Inner Leads with Transfer Pad
12/16/2010DE202009018077U1 Leistungselektronikanordnung Power electronics assembly
12/16/2010DE10341560B4 Leistungs-Halbleitervorrichtung Power semiconductor device
12/16/2010DE102009024371A1 Verfahren zur Herstellung einer Stromrichteranordnung mit Kühleinrichtung und Stromrichteranordnung Process for the preparation of a converter arrangement with cooling device and power converter arrangement
12/16/2010DE102009024369A1 Leistungselektronisches System Power Electronic System
12/15/2010EP2261974A1 Electronic component used for wiring and method for manufacturing the same
12/15/2010EP2261973A2 High power electronics system
12/15/2010EP2260683A1 Method for the production of an electronic assembly
12/15/2010EP2260513A1 Stackable communications system
12/15/2010EP1794809B1 Light source, manufacturing method of light source, lighting apparatus, and display apparatus
12/15/2010CN201673924U Light emitting diode packaging structure
12/15/2010CN201673908U Embedded passive device wafer-level chip size packaging structure
12/15/2010CN201673907U Integrated structure of photosensitive chip and processing chip
12/15/2010CN201673906U COB encapsulated bi-face storage module and storage device of a bi-face interface
12/15/2010CN201673905U Power type light emitting diode
12/15/2010CN201673904U Solar photovoltaic assembly, and junction box and diode structure adopted by the same
12/15/2010CN201673903U 整流器 Rectifier
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