Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/05/2014DE102010000539B4 Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device
06/04/2014EP2738828A2 MIM-capacitor and method of manufacturing same
06/04/2014EP2738827A1 Mimcap structure in a semiconductor device package
06/04/2014EP2738809A2 Semiconductor device including gate drivers around a periphery thereof
06/04/2014EP2738808A1 Semiconductor device and method for producing a semiconductor device
06/04/2014EP2738807A2 An apparatus including a semiconductor device coupled to a decoupling device
06/04/2014EP2738806A2 Semiconductor device including a redistribution layer and metallic pillars coupled thereto
06/04/2014EP2738805A1 Aluminium bonding wire, connection structure, semiconductor device and manufacturing method of same
06/04/2014EP2738804A2 Flexible thermal transfer strips
06/04/2014EP2738803A2 Phase change heat sink for transient thermal management
06/04/2014EP2738802A1 Heat dissipating component for semiconductor element
06/04/2014EP2738801A1 Heat sink and method for manufacturing heat sink
06/04/2014EP2738800A2 System for tempering electronic or optoelectronic components or component groups
06/04/2014EP2738799A1 Multilayer sintered ceramic wiring board, and semiconductor package including wiring board
06/04/2014EP2738798A1 Package for accommodating semiconductor element, semiconductor device provided with same, and electronic device
06/04/2014EP2738796A2 Method for producing a flip-chip structure for assembling microelectronic devices comprising an insulating block for guiding a connecting element and corresponding device
06/04/2014EP2738795A2 Electronic device with a mounting substrate with a roughened mounting surface and method for producing the same
06/04/2014EP2737781A1 Method for assembling microelectronic-chip device in fabric, chip device, and fabric containing a crimped chip device
06/04/2014EP2737539A2 High voltage mosfet and method of making the same
06/04/2014EP2737527A2 Lead frameless hermetic circuit package
06/04/2014EP2737526A1 Heat sink assembly for electronic components
06/04/2014EP2737525A2 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
06/04/2014CN203633054U 基板直角斜齿型散热器 Board right angle helical radiator
06/04/2014CN203633053U 散热装置 Cooling devices
06/04/2014CN203631561U 一种高反压双极型功率晶体管 A high-power bipolar transistor backpressure
06/04/2014CN203631554U 影像传感器封装结构 Image sensor package structure
06/04/2014CN203631553U 影像传感器封装结构 Image sensor package structure
06/04/2014CN203631544U 静电去除装置 Electrostatic removal device
06/04/2014CN203631543U 可变电容元件模块 Variable capacitance element module
06/04/2014CN203631542U 通孔可靠性测试结构 Through-hole reliability test structures
06/04/2014CN203631541U 测试结构 Test structure
06/04/2014CN203631540U 测试结构 Test structure
06/04/2014CN203631539U 硅通孔测试结构 Silicon vias test structure
06/04/2014CN203631538U 熔丝结构、电阻及电路 Fuse structure and circuit resistance
06/04/2014CN203631537U 用于接线连接的新型芯片封装结构 The new chip package structure for Wired
06/04/2014CN203631536U 适用于实验室的简易自封装基板 Simple for laboratory since the package substrate
06/04/2014CN203631535U 13排引线框架 13 row leadframe
06/04/2014CN203631534U 用于功率器件之间的连接装置 Connecting means between the power devices used in
06/04/2014CN203631533U 可控硅整流屏冷却用风道 Thyristor panel cooling duct
06/04/2014CN203631532U 半导体整流桥 Semiconductor rectifier bridge
06/04/2014CN203631531U 四方形扁平无引脚封装的内封外露散热装置改良结构 Within four quad flat no-lead package sealing the exposed heat sink structure improvement
06/04/2014CN203631530U 大功率管的温度采样结构 Power tube temperature sampling structure
06/04/2014CN203631529U 一种热保护器封装结构 A thermal protector package
06/04/2014CN203631528U 用于倒装工艺封装的新型芯片封装结构 The new structure for flip chip packaging technology package
06/04/2014CN203631527U 一种平行缝焊封装外壳 Provided a parallel seam welding package housing
06/04/2014CN103843471A Multilayer wiring substrate and manufacturing method thereof
06/04/2014CN103843470A Resin substrate having built-in component
06/04/2014CN103843136A Packaging dram and soc in an IC package
06/04/2014CN103843135A Semiconductor device
06/04/2014CN103843134A Interposer for ESD, EMI, and EMC
06/04/2014CN103843133A Lead carrier with thermally fused package components
06/04/2014CN103843132A Semiconductor device and method for manufacturing same
06/04/2014CN103843131A Heat sink assembly for electronic components
06/04/2014CN103842442A Curable resin composition, tablet of curable resin composition, molded body, semiconductor package, semiconductor component and light emitting diode
06/04/2014CN103841750A Package carrier
06/04/2014CN103840002A Semiconductor device having supporter and method of forming the same
06/04/2014CN103839967A Organic light emitting diode display apparatus and method of manufacturing the same
06/04/2014CN103839938A Server processing module
06/04/2014CN103839932A Logic die and other components embedded in build-up layers
06/04/2014CN103839931A Double-faced packaging structure of double chips
06/04/2014CN103839930A Lamination packaging structure of double chips
06/04/2014CN103839929A Rf (radio frequency) module and method of maufacturing the same
06/04/2014CN103839928A High-voltage-withstanding, low-electric-leakage and high-polarization strength bismuth ferrite thin film and preparation method thereof
06/04/2014CN103839927A Protective device of single IGBT and power module provided with single IGBT
06/04/2014CN103839926A Three-dimension integrated circuit package
06/04/2014CN103839925A Semiconductor device
06/04/2014CN103839924A MOSFET mismatch testing structure and method
06/04/2014CN103839923A Alignment mark manufacturing method and substrate
06/04/2014CN103839922A Semiconductor test structure and test method thereof
06/04/2014CN103839921A Through si via radio frequency test structure and parasitic extracting method thereof
06/04/2014CN103839920A Copper seed layer for an interconnect structure having a doping concentration level gradient
06/04/2014CN103839919A Manufacturing method for electrode, fuse device and manufacturing method thereof
06/04/2014CN103839918A Semicondutor packages and methods of fabrication thereof
06/04/2014CN103839917A Mim capacitor and forming method thereof
06/04/2014CN103839916A Mom capacitor
06/04/2014CN103839915A Thin film transistor array substrate and manufacturing method thereof
06/04/2014CN103839914A PCB carriers and carrier tape used for minisize molded package card
06/04/2014CN103839913A Semiconductor Packages and Methods of Formation Thereof
06/04/2014CN103839912A Frameworks and framework tape used for minisize molded package card
06/04/2014CN103839911A Offset integrated circuit packaging interconnects
06/04/2014CN103839910A Semiconductor device assembly including a chip carrier, semiconductor wafer and method of manufacturing a semiconductor device
06/04/2014CN103839909A Variable-size solder bump structures for integrated circuit packaging
06/04/2014CN103839908A Welding pad structure and manufacture method thereof
06/04/2014CN103839907A Active component array substrate and circuit stack structure thereof
06/04/2014CN103839906A Contact pin and power module package having the same
06/04/2014CN103839905A Silicon substrate micro-channel heat exchanger with electric fluid power micro-pump and manufacturing method thereof
06/04/2014CN103839904A Electric power converter
06/04/2014CN103839903A Three-dimensional stacked chip with cooling function and manufacturing method thereof
06/04/2014CN103839902A A semiconductor device including a heat-spreading lid
06/04/2014CN103839901A Simplified algorithm about junction-to-case thermal resistance of IGBT stack structure
06/04/2014CN103839900A Flexible display apparatus and manufacturing method thereof
06/04/2014CN103839899A Semiconductor package and fabrication method thereof
06/04/2014CN103839898A Package structure and manufacturing method thereof
06/04/2014CN103839897A Integrated circuit package and method of manufacture
06/04/2014CN103839896A Spiral substrate and three-dimensional packaging element having the same
06/04/2014CN103839895A Image sensor module and image capturing module
06/04/2014CN103839888A Array substrate, manufacturing method thereof and displaying device
06/04/2014CN103839884A Semiconductor device structure and forming method thereof
06/04/2014CN103839883A Methods of forming graphene liners and/or cap layers on copper-based conductive structures
06/04/2014CN103839882A Sandwiched diffusion barrier and metal liner for an interconnect structure
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