Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2014
05/13/2014US8723307 Packaged integrated circuit devices with through-body conductive vias, and methods of making same
05/13/2014US8723306 Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing method
05/13/2014US8723305 Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
05/13/2014US8723304 Semiconductor package and methods of fabricating the same
05/13/2014US8723303 Multi-chip package semiconductor memory device
05/13/2014US8723302 Integrated circuit package system with input/output expansion
05/13/2014US8723300 Multi-chip module power clip
05/13/2014US8723299 Method and system for forming a thin semiconductor device
05/13/2014US8723298 Lead, wiring member, package component, metal component with resin, resin-encapsulated semiconductor device, and methods for producing the same
05/13/2014US8723291 Semiconductor integrated circuit
05/13/2014US8723290 Electrical fuse device
05/13/2014US8723264 Electrostatic discharge devices and method of making the same
05/13/2014US8723263 Electrostatic discharge protection device
05/13/2014US8723231 Semiconductor die micro electro-mechanical switch management system and method
05/13/2014US8723214 Submount and manufacturing method thereof
05/13/2014US8723057 Systems and methods for protecting a flight recorder
05/13/2014US8722530 Method of making a die with recessed aluminum die pads
05/13/2014US8722518 Methods for protecting patterned features during trench etch
05/13/2014US8722514 Semiconductor devices having insulating substrates and methods of formation thereof
05/13/2014US8722467 Method of using bonding ball array as height keeper and paste holder in semiconductor device package
05/13/2014US8722461 Leadframe based multi terminal IC package
05/13/2014US8722179 Substrate comprising a mark
05/13/2014CA2682594C Insulating and dissipating heat structure of an electronic part
05/13/2014CA2481637C Device package and methods for the fabrication and testing thereof
05/12/2014DE202013102008U1 Vorrichtung zur Herstellung eines Bauteils mit Leiterbahnen, die ganz oder teilweise in Kunststoff eingebettet sind Apparatus for producing a component with strip conductors which are wholly or partially embedded in plastic
05/08/2014WO2014070926A1 A conductive interconnect including an inorganic collar
05/08/2014WO2014070694A1 Underfill composition and semiconductor device and manufacturing method thereof
05/08/2014WO2014070586A1 Circuit board with integrated passive devices
05/08/2014WO2014070534A2 Integrated bondline spacers for wafer level packaged circuit devices
05/08/2014WO2014070017A1 Method for forming an electrically conductive via in a substrate
05/08/2014WO2014069662A1 Wiring structure
05/08/2014WO2014069610A1 Curable silicone composition, cured product thereof, and optical semiconductor device
05/08/2014WO2014069488A1 Polymetalloxane compound, method for producing same, and application thereof
05/08/2014WO2014069432A1 Element-housing package and mounting structure
05/08/2014WO2014069353A1 Semiconductor device
05/08/2014WO2014069340A1 Electronic control device
05/08/2014WO2014069213A1 Semiconductor device, and manufacturing method for same
05/08/2014WO2014069174A1 Semiconductor device
05/08/2014WO2014069126A1 Element-housing package and mounting structure body
05/08/2014WO2014069123A1 Container for storing electronic component and electronic device
05/08/2014WO2014068936A1 Semiconductor module
05/08/2014WO2014068935A1 Semiconductor module
05/08/2014WO2014068811A1 Semiconductor package and mounting structure thereof
05/08/2014WO2014068361A1 A tamper detection arrangement
05/08/2014WO2014067775A1 Heat conductor device and method of forming a heat conductor device
05/08/2014WO2014067286A1 Ultrathin miniature bridge rectifier
05/08/2014WO2013066455A3 Flattened substrate surface for substrate bonding
05/08/2014WO2013043957A3 Method and apparatus of minimizing extrinsic parasitic resistance in 60ghz power amplifier circuits
05/08/2014WO2013012634A3 Double-sided flip chip package
05/08/2014US20140127899 Microstructure modification in copper interconnect structures
05/08/2014US20140127863 Method of forming a plurality of bumps on a substrate and method of forming a chip package
05/08/2014US20140127861 Semiconductor Packages Utilizing Leadframe Panels with Grooves in Connecting Bars
05/08/2014US20140127860 Method of manufacturing semiconductor device
05/08/2014US20140127859 Method for fabricating a semiconductor and semiconductor package
05/08/2014US20140127856 Electronic Assembly with Three Dimensional Inkjet Printed Traces
05/08/2014US20140127518 Water vapor barrier film, method for producing the same, and electronic equipment using the same
05/08/2014US20140126155 Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module
05/08/2014US20140125421 Semiconductor device and manufacturing method thereof
05/08/2014US20140124963 Semiconductor wafers recrystallized in a partially surrounding thin film capsule
05/08/2014US20140124962 Integrated circuit package including wire bond and electrically conductive adhesive electrical connections
05/08/2014US20140124960 Packaged semiconductor assemblies and methods for manufacturing such assemblies
05/08/2014US20140124959 Memory device, laminated semiconductor substrate and method of manufacturing the same
05/08/2014US20140124958 Sensor packaging method and sensor packages
05/08/2014US20140124957 Expanded semiconductor chip and semiconductor device
05/08/2014US20140124956 Semiconductor package having unified semiconductor chips
05/08/2014US20140124955 Package-on-package structure including a thermal isolation material and method of forming the same
05/08/2014US20140124954 Method and structure of forming backside through silicon via connections
05/08/2014US20140124953 Multi-chip semiconductor apparatus
05/08/2014US20140124951 Integrated Circuit Devices Including Through-Silicon Via (TSV) Contact Pads Electronically Insulated from a Substrate
05/08/2014US20140124950 Semiconductor substrate and fabrication method thereof
05/08/2014US20140124949 Semiconductor device and method of manufacturing semiconductor device
05/08/2014US20140124948 Wafer-to-Wafer Process for Manufacturing a Stacked Structure
05/08/2014US20140124947 Methods and Apparatus for Flip Chip Substrate with Guard Rings Outside of a Die Attach Region
05/08/2014US20140124946 Enhanced capture pads for through semiconductor vias
05/08/2014US20140124945 Semiconductor structure and manufacturing method of the same
05/08/2014US20140124944 Substrate build up layer to achieve both finer design rule and better package coplanarity
05/08/2014US20140124943 Integrated decoupling capacitor utilizing through-silicon via
05/08/2014US20140124942 Reducing Loadline Impedance in a System
05/08/2014US20140124941 Semiconductor device
05/08/2014US20140124940 Flexible routing for chip on board applications
05/08/2014US20140124939 Discrete device mounted on substrate
05/08/2014US20140124938 Stress relief for plastic encapsulated devices
05/08/2014US20140124937 Contoured Package-on-Package Joint
05/08/2014US20140124936 Power semiconductor module and method of manufacturing same
05/08/2014US20140124935 Sputter and surface modification etch processing for metal patterning in integrated circuits
05/08/2014US20140124934 Interconnect with titanium-oxide diffusion barrier
05/08/2014US20140124933 Copper interconnect structures and methods of making same
05/08/2014US20140124932 Integrated circuit device having a copper interconnect
05/08/2014US20140124931 Semiconductor device connected by anisotropic conductive film
05/08/2014US20140124930 Low-noise flip-chip packages and flip chips thereof
05/08/2014US20140124929 Semiconductor device and fabrication method
05/08/2014US20140124928 Semiconductor packaging structure and method for forming the same
05/08/2014US20140124927 Semiconductor ic packaging methods and structures
05/08/2014US20140124926 Method And System For A Chaser Pellet In A Semiconductor Package Mold Process
05/08/2014US20140124925 Multi-solder techniques and configurations for integrated circuit package assembly
05/08/2014US20140124924 Integrated circuit device including a copper pillar capped by barrier layer and method of forming the same
05/08/2014US20140124923 Semiconductor devices having a staggered pad wiring structure
05/08/2014US20140124922 Bump structures in semiconductor packages and methods of fabricating the same
05/08/2014US20140124921 Semiconductor package
05/08/2014US20140124920 Stud bump structure and method for manufacturing the same
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