Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2014
05/28/2014CN203618225U 一种电动车控制器mos管安装结构 An electric vehicle controller mos tube mounting structure
05/28/2014CN203617885U 一种igbt功率单元 One kind igbt power unit
05/28/2014CN203617293U 用于整流电路的二极管模组组件 Diode rectifier circuit module assembly for
05/28/2014CN203617291U 一种太阳能旁路二极管的封装结构 A solar-pass diode package structure
05/28/2014CN203617290U 一种带麻点的引线框架 A lead frame with pitting
05/28/2014CN203617289U 一种引线框架 A lead frame for
05/28/2014CN203617288U 一种头部弯曲的引线框架 One kind of head bent lead frame
05/28/2014CN203617287U 一种带锯齿压痕的引线框架 A lead frame with serrated indentations
05/28/2014CN203617286U 一种头部开口的引线框架 A head opening of the lead frame
05/28/2014CN203617285U 一种快速散热的引线框架 A rapid cooling of the lead frame
05/28/2014CN203617284U 一种带u型槽的引线框架 A lead frame for u-groove band
05/28/2014CN203617283U 一种小功率的引线框架 A lead frame, a small-power
05/28/2014CN203617282U 一种用于小功率电器的引线框架 A low-power appliances for leadframe
05/28/2014CN203617281U 一种便于封装的引线框架 A leadframe package facilitates
05/28/2014CN203617280U 便于打丝的引线框架 Easy to play the lead frame wire
05/28/2014CN203617279U 平板引线框架 Flat lead frame
05/28/2014CN203617278U 塑封分体引线框架 Plastic split leadframe
05/28/2014CN203617277U 便于注塑的引线框架 Easy lead frame injection
05/28/2014CN203617276U 双载片的引线框架 Double slide the lead frame
05/28/2014CN203617275U 大功率器件用的引线框架 Lead frame with high-power devices
05/28/2014CN203617274U 小功率器件用的引线框架 Lead frame with small power devices
05/28/2014CN203617273U 便于定位安装的引线框架 Ease of installation of the lead frame positioning
05/28/2014CN203617272U 高温使用的引线框架 Lead frame used in high temperature
05/28/2014CN203617271U 大功率塑封引线框架 High-power plastic lead frame
05/28/2014CN203617270U 一种肖特基二极管的跳线 Jumper one kind of the Schottky diode
05/28/2014CN203617269U 一种散热片式功率器件散热器 A heat sink radiator chip power devices
05/28/2014CN203617268U 一种增强散热功能的aaqfn封裝件 An enhanced cooling function aaqfn package
05/28/2014CN203617267U 芯片封装结构 Chip package structure
05/28/2014CN203617266U 一种功率半导体模块 A power semiconductor module
05/28/2014CN203617265U 一种功率半导体模块 A power semiconductor module
05/28/2014CN103828490A 用于降低振荡倾向的线路结构 Propensity for reducing oscillation circuit structure
05/28/2014CN103828076A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/28/2014CN103828043A 模块的制造方法及模块 Manufacturing method and module module
05/28/2014CN103828041A 半导体装置 Semiconductor device
05/28/2014CN103828040A 散热结构体、功率模块、散热结构体的制造方法以及功率模块的制造方法 The method of manufacturing heat dissipation structure, the power module, the method for manufacturing a heat dissipation structure, and the power module
05/28/2014CN103828039A 散热板及散热板的制法 The radiator plate and the heat dissipating plate is prepared by
05/28/2014CN103828038A 布线基板、电子装置及电子模块 A wiring board, an electronic device and the electronic module
05/28/2014CN103827893A 制造具有微电路的数据载体的方法 The method of producing a data carrier having a microcircuit
05/28/2014CN103827353A 由承载膜和包括由至少一种金属粉末制成的可烧结的层和焊接层的层组件组成的复合层 By the carrier film and comprises a layer component layer and the solder layer can be a sintered metal powder prepared from at least one composite layer consisting of
05/28/2014CN103827248A 导热性树脂组合物 The thermally conductive resin composition
05/28/2014CN103827216A 可固化组合物 The curable composition
05/28/2014CN103827162A 环氧树脂组合物及电子部件装置 Epoxy resin composition and an electronic component device
05/28/2014CN103826419A 连接结构和逆变器 Connecting structure and inverters
05/28/2014CN103826412A 散热装置 Cooling devices
05/28/2014CN103826384A 高性能垂直互连 High-performance vertical interconnects
05/28/2014CN103824930A 一种抗静电的led The led an antistatic
05/28/2014CN103824859A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/28/2014CN103824856A 一种基于背栅晶体管的抗辐照技术及实现方法 An anti-radiation based on the back-gate transistor technology and implementation
05/28/2014CN103824853A 应用于开关型调节器的集成电路组件 Applied to the switching regulator IC components
05/28/2014CN103824846A 一种多场效晶体管集成模块 A multi-field effect transistor integrated module
05/28/2014CN103824843A 通过桥接块的多芯片模块连接 A multi-chip module are connected by bridging block
05/28/2014CN103824842A 集成电路、半导体管芯布置以及用于制造集成电路的方法 An integrated circuit, a semiconductor die and a method of manufacturing an integrated circuit arrangement for
05/28/2014CN103824841A 用连接片实现连接的半导体封装 Realization of a semiconductor package is connected with the connecting piece
05/28/2014CN103824840A 基于硅通孔的螺线管式差分电感 Based on the differential inductor solenoid type silicon vias
05/28/2014CN103824839A 集成电路中可靠性分析的测试结构及其测试方法 IC test structures and test methods in reliability analysis
05/28/2014CN103824838A 集成电路组件 IC components
05/28/2014CN103824837A 半导体器件结构及其制作方法 The semiconductor device structure and manufacturing method thereof
05/28/2014CN103824836A 半导体承载元件及半导体封装件 Carrying a semiconductor element and semiconductor package
05/28/2014CN103824835A 用于半导体集成器件的表面装配封装、相关组件和制造工艺 Package for surface mounting of the semiconductor integrated device, the associated components and manufacturing processes
05/28/2014CN103824834A 一种具有改进型封装结构的半导体器件及其制造方法 A semiconductor device and a manufacturing method of a package structure having improved
05/28/2014CN103824833A 半导体封装用的铜合金线 Copper alloy wire for semiconductor encapsulation of the
05/28/2014CN103824832A 一种多mosfet集成六桥臂封装模块 A multi-mosfet integrated six-arm package module
05/28/2014CN103824831A 一种封装基板及其制备方法 A package board and its preparation method
05/28/2014CN103824830A 芯片布置和用于制造芯片布置的方法 Chip arrangement and method for manufacturing the chip layout
05/28/2014CN103824829A 非焊接掩膜限定的铜焊盘和嵌入式铜焊盘 Non-solder mask defined pads and embedded copper copper pads
05/28/2014CN103824828A 封装载板及其制造方法 Package substrate and a manufacturing method
05/28/2014CN103824827A 封装模块、封装终端及其制造方法 Encapsulation module, and a manufacturing method of the package terminals
05/28/2014CN103824826A 一种微流道散热方法 A micro channel cooling methods
05/28/2014CN103824825A 微槽道相变换热装置 Micro-channel phase change heat transfer device
05/28/2014CN103824824A 一种集成散热结构及其制造方法 An integrated heat sink structure and manufacturing method
05/28/2014CN103824823A 内源及其加源流体换热系统 Endogenous and add the source fluid heat transfer system
05/28/2014CN103824822A 散热器以及散热风扇 Radiator and cooling fan
05/28/2014CN103824821A 一种塑料密闭封装的开关电源模块及其制备方法 Switching power supply module and method for preparing plastic hermetic package
05/28/2014CN103824820A 引线框区域阵列封装技术 Leadframe area array packaging technology
05/28/2014CN103824819A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/28/2014CN103824818A 射频微机电器件板级互连封装结构及其封装方法 RF MEMS devices board-level interconnect package and packaging method
05/28/2014CN103824817A 传感器的真空陶瓷封装结构 Vacuum ceramic package structure of the sensor
05/28/2014CN103824816A 一种耐过载的t/r组件一体化气密性封装结构 One kind of resistance to overload t / r components integrated hermetic package structure
05/28/2014CN103824783A 包封晶片级芯片规模（wlcsp）基座封装 Encapsulated wafer level chip scale (wlcsp) base package
05/28/2014CN103824755A 高q电感及制备方法 High q inductance and preparation methods
05/28/2014CN103824614A 具有金属-有机层的多层复合体 A metal - organic layer is a multilayer composite body
05/28/2014CN103823917A 半导体封装的设计系统与方法、制造装置、和半导体封装 The semiconductor package design system and method, manufacturing apparatus, and a semiconductor package
05/28/2014CN103820784A 刻蚀剂组合物、金属图案的形成方法和阵列基板的制法 Method etchant composition, method of forming a metal pattern and an array substrate
05/28/2014CN102569032B 多层金属化薄膜叠加制作电感元件的方法 Superimposing the multilayer metal film made of the method of the inductance element
05/28/2014CN102468263B 具有分布式电源的集成电路系统 IC system with distributed power
05/28/2014CN102280425B 具备键合引线的半导体器件及其制造方法 The method of manufacturing a semiconductor device and bonding wires
05/28/2014CN102132402B 薄箔半导体封装 Thin foil semiconductor package
05/28/2014CN102124559B 用于金属互连的共形粘附促进衬垫 For metal interconnects conformal adhesion promoter liner
05/28/2014CN102033370B 液晶显示基板及其制造方法 The liquid crystal display substrate and a method of manufacturing
05/28/2014CN102013578B 导体引出结构以及功率模块 Conductor leads to structures and power module
05/28/2014CN101930960B 集成电路芯片封装和形成方法 And a method of forming an integrated circuit chip package
05/28/2014CN101843181B 内置元件电路板 Built-element circuit board
05/28/2014CN101689543B 集成电路、电子器件及其esd保护 Integrated circuits, electronic devices and esd protection
05/27/2014US8738167 3D integrated circuit device fabrication with precisely controllable substrate removal
05/27/2014US8738109 Analyte monitoring device and methods of use
05/27/2014US8738105 Systems and methods for superconducting integrated circuts
05/27/2014US8737440 Optical module with enhanced robustness of temperature controlling device
05/27/2014US8737089 Lead frames for capacitors
05/27/2014US8736343 Signal isolators using micro-transformers
05/27/2014US8736084 Structure and method for E-beam in-chip overlay mark
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