Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/11/2014CN103849327A Adhesive material for electric connection, display device using the adhesive material and method of fabricating the display device
06/11/2014CN103848391A Embedded chip package, chip package, and method for manufacturing the embedded chip package
06/11/2014CN103210041B Thermosetting silicone resin composition, and silicone resin-containing structure and optical semiconductor element encapsulant obtained using same
06/11/2014CN102719096B Resin composition and preparation method thereof
06/11/2014CN102522386B Gate-oxidizing-layer interface-trap density-testing structure and testing method
06/11/2014CN102495524B Photomask, conducting wire manufacturing method of flat display panel and conducting wire structure of flat display panel
06/11/2014CN102487042B Array substrate, manufacturing method and detection method thereof and liquid crystal panel
06/11/2014CN102324262B Photosensitive conductive paste, manufacturing method of laminated electronic component using the photosensitive conductive paste and laminated electronic component
06/11/2014CN102263069B Circuit module
06/11/2014CN102205470B Filling composition, semiconductor device including the same, and method of fabricating the semiconductor device
06/11/2014CN102160105B Display device and manufacturing method of the same
06/11/2014CN102066254B Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material
06/11/2014CN101894816B Semiconductor device
06/11/2014CN101887906B Image display system
06/11/2014CN101447471B Substrate for semiconductor package and semiconductor package having the same
06/10/2014US8751992 Power supply wiring structure
06/10/2014US8750031 Test structures, methods of manufacturing thereof, test methods, and MRAM arrays
06/10/2014US8749977 Power semiconductor module and its attachment structure
06/10/2014US8749749 System for cooling an electronic image assembly with manifolds and ambient gas
06/10/2014US8749747 Method of manufacturing liquid crystal panel, glass substrate for liquid crystal panel, and liquid crystal panel including the same
06/10/2014US8749222 Method of sensing magnitude of current through semiconductor power device
06/10/2014US8749078 Semiconductor device
06/10/2014US8749076 Resin paste composition
06/10/2014US8749075 Integrated circuits and a method for manufacturing an integrated circuit
06/10/2014US8749074 Package including an interposer having at least one topological feature
06/10/2014US8749073 Wiring board, method of manufacturing the same, and semiconductor device
06/10/2014US8749072 Semiconductor package with integrated selectively conductive film interposer
06/10/2014US8749071 Semiconductor devices and the method of manufacturing the same
06/10/2014US8749070 Dielectric solder barrier for semiconductor devices
06/10/2014US8749069 Semiconductor device and method of fabricating the same
06/10/2014US8749068 Mounting method and mounting device
06/10/2014US8749067 Semiconductor device and method for forming the same
06/10/2014US8749066 Semiconductor constructions
06/10/2014US8749065 Semiconductor device comprising electromigration prevention film and manufacturing method thereof
06/10/2014US8749064 Semiconductor device with a line and method of fabrication thereof
06/10/2014US8749063 Semiconductor device and method for manufacturing the same
06/10/2014US8749062 Semiconductor device and process for producing the same
06/10/2014US8749061 Display device and manufacturing method thereof
06/10/2014US8749060 Method of semiconductor integrated circuit fabrication
06/10/2014US8749059 Semiconductor device having a copper plug
06/10/2014US8749057 Methods of forming structures with a focused ion beam for use in atomic force probing and structures for use in atomic force probing
06/10/2014US8749056 Module and method of manufacturing a module
06/10/2014US8749055 Semiconductor device with resin mold
06/10/2014US8749054 Semiconductor carrier with vertical power FET module
06/10/2014US8749052 Electronic device
06/10/2014US8749051 Semiconductor device
06/10/2014US8749050 Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements
06/10/2014US8749049 Chip package with a chip embedded in a wiring body
06/10/2014US8749048 Package structure
06/10/2014US8749047 Power module
06/10/2014US8749046 Wiring substrate and method of manufacturing the same
06/10/2014US8749045 Metal ring techniques and configurations
06/10/2014US8749044 Semiconductor memory modules and methods of fabricating the same
06/10/2014US8749043 Package on package structure
06/10/2014US8749042 Process for making a semiconductor system
06/10/2014US8749041 Thee-dimensional integrated semiconductor device and method for manufacturing same
06/10/2014US8749040 Integrated circuit packaging system with package-on-package and method of manufacture thereof
06/10/2014US8749039 Semiconductor device having chip mounted on an interposer
06/10/2014US8749038 Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereof
06/10/2014US8749037 Multi-access memory system and a method to manufacture the system
06/10/2014US8749036 Microchip with blocking apparatus and method of fabricating microchip
06/10/2014US8749035 Lead carrier with multi-material print formed package components
06/10/2014US8749034 High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistor
06/10/2014US8749033 Semiconductor device and method of manufacturing semiconductor device
06/10/2014US8749032 Integrated circuit with improved transmission line structure and electromagnetic shielding between radio frequency circuit paths
06/10/2014US8749031 Semiconductor device, method for manufacturing same, and semiconductor apparatus
06/10/2014US8749028 Semiconductor device with silicon through electrode and moisture barrier
06/10/2014US8749027 Robust TSV structure
06/10/2014US8749021 Voltage regulator integrated with semiconductor chip
06/10/2014US8748987 Semiconductor device
06/10/2014US8748949 Chip package with heavily doped region and fabrication method thereof
06/10/2014US8748944 Electric circuit with vertical contacts
06/10/2014US8748909 Display system
06/10/2014US8748900 Re-silicide gate electrode for III-N device on Si substrate
06/10/2014US8748888 Semiconductor integrated circuit
06/10/2014US8748860 Phase change memory device having self-aligned bottom electrode and fabrication method thereof
06/10/2014US8748756 Electric device and production method therefor
06/10/2014US8748755 Electronic component, electronic device, and method for manufacturing the electronic component
06/10/2014US8748311 Microelectronic devices and methods for filing vias in microelectronic devices
06/10/2014US8748306 Cleaning residual molding compound on solder bumps
06/10/2014US8748305 Pad structure for semiconductor devices
06/10/2014US8748295 Pads with different width in a scribe line region and method for manufacturing these pads
06/10/2014US8748288 Bonded structure with enhanced adhesion strength
06/10/2014US8748234 Method for making circuit board
06/10/2014US8748227 Method of fabricating chip package
06/10/2014US8746308 Manufacturing method of package carrier
06/10/2014US8745863 Method of manufacturing multi-layer printed circuit board
06/10/2014US8745841 Aluminum bonding member and method for producing same
06/10/2014CA2587431C Method for collectively producing a superimposed element microstructure
06/05/2014WO2014085209A1 Stackable high-density metal-oxide-metal capacitor with minimum top plate parasitic capacitance
06/05/2014WO2014084357A1 Sheet provided with curable resin film-forming layer and method for manufacturing semiconductor device using sheet
06/05/2014WO2014084318A1 Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, resin-equipped film, laminated plate, multilayer printed circuit board, and semiconductor package
06/05/2014WO2014084310A1 Amino-modified siloxane compound, modified imide resin, thermosetting resin composition, prepreg, resin-equipped film, laminated plate, multilayer printed circuit board, and semiconductor package
06/05/2014WO2014084304A1 Manufacturing method and manufacturing device for semiconductor device
06/05/2014WO2014084175A1 Thermosetting resin sheet and electronic component packaging fabrication method
06/05/2014WO2014083992A1 Electronic component housing package and electronic device
06/05/2014WO2014083974A1 Semiconductor-device manufacturing method
06/05/2014WO2014083924A1 Semiconductor device and method for manufacturing same
06/05/2014WO2014083908A1 High frequency module
06/05/2014WO2014083875A1 Electroconductive film and electronic component package
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