Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/12/2014WO2014088071A1 Semiconductor device
06/12/2014WO2014088044A1 Heat sink
06/12/2014WO2014088025A1 Substrate for power modules, substrate with heat sink for power modules, power module, method for producing substrate for power modules, paste for copper plate bonding, and method for producing bonded body
06/12/2014WO2014087948A1 Protective-membrane-forming film
06/12/2014WO2014087947A1 Protective-membrane-forming film
06/12/2014WO2014087925A1 Cleaning liquid for semiconductor elements and cleaning method using same
06/12/2014WO2014087882A1 Metal layer having resin layer attached thereto, laminated body, circuit board, and semiconductor device
06/12/2014WO2014087877A1 Interposer substrate and method for manufacturing same
06/12/2014WO2014087397A1 An integrated electronic device including an interposer structure and a method for fabricating the same
06/12/2014WO2014086950A1 Process for producing substrates for semiconductor components
06/12/2014WO2014086427A1 Semiconductor assembly
06/12/2014WO2014059974A3 Multifunction microelectronic component and method for producing such component
06/12/2014US20140162412 Methods of making an interposer structure with embedded capacitor structure
06/12/2014US20140162411 Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
06/12/2014US20140162409 Method for fabricating quad flat non-leaded semiconductor package
06/12/2014US20140162405 Interposer Having a Defined Through Via Pattern
06/12/2014US20140162404 Method for packaging low-k chip
06/12/2014US20140160684 Cooling for electronic components
06/12/2014US20140160677 Electronic device cooling with microjet impingement and method of assembly
06/12/2014US20140160673 Low profile heat spreader and methods
06/12/2014US20140159766 High-frequency module and method for inspecting high-frequency module
06/12/2014US20140159256 Anisotropic conductive films and semiconductor devices connected by the same
06/12/2014US20140159255 Contact pad structure
06/12/2014US20140159254 Dicing tape-integrated film for semiconductor back surface
06/12/2014US20140159253 Chip structure and multi-chip stack package
06/12/2014US20140159252 Semiconductor device
06/12/2014US20140159251 Semiconductor Device and Method of Forming Low Profile Fan-Out Package with Vertical Interconnection Units
06/12/2014US20140159250 Bbul top side substrate layer enabling dual sided silicon interconnect and stacking flexibility
06/12/2014US20140159249 Method and structures for via substrate repair and assembly
06/12/2014US20140159248 High performance package on package
06/12/2014US20140159246 Methods of manufacturing nand flash memory devices
06/12/2014US20140159245 Semiconductor device and a method of manufacturing the same
06/12/2014US20140159244 Process to Achieve Contact Protrusion for Single Damascene Via
06/12/2014US20140159243 Metal Conductor Chemical Mechanical Polish
06/12/2014US20140159241 Structures and Methods to Enhance Copper Metallization
06/12/2014US20140159240 Thermal Management Structure with Integrated Heat Sink
06/12/2014US20140159239 Methods of selectively removing a substrate material and related semiconductor structures
06/12/2014US20140159238 Package having thermal compression flip chip (tcfc) and chip with reflow bonding on lead
06/12/2014US20140159237 Semiconductor package and method for routing the package
06/12/2014US20140159236 Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating
06/12/2014US20140159235 Electronic component, electronic apparatus including the same, and manufacturing method of the electronic apparatus
06/12/2014US20140159234 Semiconductor manufacturing process and structure thereof
06/12/2014US20140159233 Package on package structure and method of manufacturing the same
06/12/2014US20140159232 Apparatus and Method for Three Dimensional Integrated Circuits
06/12/2014US20140159231 Semiconductor assembly
06/12/2014US20140159230 Semiconductor device
06/12/2014US20140159229 Semiconductor device connected by anisotropic conductive film
06/12/2014US20140159228 High density substrate routing in bbul package
06/12/2014US20140159227 Patterning transition metals in integrated circuits
06/12/2014US20140159226 Compact sensor module
06/12/2014US20140159225 Semiconductor module
06/12/2014US20140159224 Semiconductor device
06/12/2014US20140159223 Apparatus and Method for Package Reinforcement
06/12/2014US20140159222 Chip-embedded printed circuit board and semiconductor package using the pcb, and manufacturing method of the pcb
06/12/2014US20140159221 Lead frame, method for manufacturing lead frame and semiconductor device using same
06/12/2014US20140159220 Semiconductor Device and Method of Manufacture Thereof
06/12/2014US20140159219 Multi-component chip packaging structure
06/12/2014US20140159218 Chip packaging structure of a plurality of assemblies
06/12/2014US20140159217 Multichip package and fabrication method thereof
06/12/2014US20140159216 Semiconductor module, semiconductor device having semiconductor module, and method of manufacturing semiconductor module
06/12/2014US20140159215 Semiconductor device and method of manufacturing the same
06/12/2014US20140159214 Low cost repackaging of thinned integrated devices
06/12/2014US20140159213 Electrical interconnect for an integrated circuit package and method of making same
06/12/2014US20140159203 Substrate Pad Structure
06/12/2014US20140159202 Method for forming a three-dimensional structure of metal-insulator-metal type
06/12/2014US20140159151 Power MOS Device Structure
06/12/2014US20140159127 Semiconductor device and method of manufacturing the same
06/12/2014US20140159098 Semiconductor lead frame package and led package
06/12/2014US20140159092 Light-emitting apparatus
06/12/2014US20140159061 Protection element and light emitting device using same
06/12/2014US20140159054 Power module semiconductor device
06/12/2014US20140159040 Authentication using graphene based devices as physical unclonable functions
06/12/2014US20140158749 Method and apparatus for applying solder to a work piece
06/12/2014US20140158421 Tie Bar Resonance Suppression
06/12/2014DE202014100619U1 Keramischer Schaltkreis und LED-Packungsmodul, bei dem dieser eingesetzt wird Ceramic circuit and LED package module in which it is inserted
06/12/2014DE102013224970A1 Kühlvorrichtung Cooler
06/12/2014DE102013224477A1 Halbleiterbauelement und Substratvorspannungsverfahren dafür Semiconductor device and Substratvorspannungsverfahren for
06/12/2014DE102013221157A1 Leistungsfähige vertikale Durchverbindung Powerful vertical Average Connection
06/12/2014DE102013221155A1 Passive Komponente als Wärmekapazität und Wärmesenke Passive component as heat capacity and heat sink
06/12/2014DE102013221153A1 Embedding-technologie mit hohem wirkungsgrad Embedding technology with high efficiency
06/12/2014DE102013220045A1 Vorrichtung mit organischer lichtemittierender Anzeige und Verfahren zur Herstellung derselben Device having organic light-emitting display and method of manufacturing the same
06/12/2014DE102013113740A1 ESD-Schutzstruktur, integrierte Schaltung und Halbleiterbauelement ESD protection structure, integrated circuit and semiconductor device
06/12/2014DE102013107244A1 Gestapelter Fan-Out-Halbleiterchip Stacked fan-out semiconductor chip
06/12/2014DE102013019723A1 Luminous element installed in e.g. capacitive switch for describing switching state, has transparent light-conducting cladding layer that is coated on supporting portion, and configured to scatter and reflect light
06/12/2014DE102012222791A1 Verfahren zur Kontaktierung eines Halbleiters und Halbleiterbauelement mit erhöhter Stabilität gegenüber thermomechanischen Einflüssen A method for contacting a semiconductor and semiconductor device having increased stability against thermo-mechanical influences
06/12/2014DE102012222679A1 Verfahren zur Herstellung eines Schaltmoduls und eines zugehörigen Gittermoduls sowie ein zugehöriges Gittermodul und korrespondierende elektronische Baugruppe A process for producing a switching module and an associated grating module and an associated grating module and corresponding electronic assembly
06/12/2014DE102012222491A1 Elektronisches Bauteil mit einem gespritzten Bauteilgehäuse Electronic component with a molded component housing
06/12/2014DE102012222481A1 Method for determining junction temperature of power semiconductor in motor car, involves measuring power dissipation of power semiconductor, and determining recorded warming curve of impedance based on operation of power semiconductor
06/12/2014DE102012222459A1 Circuit device for producing renewable energy, has metal reservoir that is adapted in circuit device portion, if any overflow of circuit elements occurs to cool in order to delay formation of arc
06/12/2014DE102012024063A1 Verfahren zur Herstellung von Substraten für Leistungshalbleiterbauelemente Process for the preparation of substrates for power semiconductor components
06/12/2014DE102010021765B4 Herstellungsverfahren zur Anordnung zweier Verbindungspartner mittels einer Niedertemperatur Drucksinterverbindung Manufacturing process for the arrangement of two link partners by means of a low-temperature pressure sintering connection
06/11/2014EP2741426A1 High-frequency module
06/11/2014EP2741341A1 Semiconductor device and fabrication method for same
06/11/2014EP2741327A1 Power converter package including top-drain configured power FET
06/11/2014EP2741326A2 Shielding silicon from external RF interference
06/11/2014EP2741325A1 Bond wire arrangement for efficient signal transmission
06/11/2014EP2741324A1 III nitride transistor with source connected heat-spreading plate
06/11/2014EP2741323A1 Electronic component and method for manufacturing said electronic component
06/11/2014EP2741322A1 Semiconductor device with integrated hot plate and recessed substrate and method of production
06/11/2014EP2741321A2 Semiconductor device and method of manufacturing the same
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