Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/11/2014EP2741303A2 Through via inductor or transformer in a high-resistance substrate with programmability
06/11/2014EP2741240A1 A secure chip module and a method of making the same
06/11/2014EP2740765A1 Epoxy resin composition for cast molding and electrical device using same
06/11/2014EP2740159A1 Optoelectronic devices with thin barrier films with crystalline characteristics that are conformally coated onto complex surfaces to provide protection against moisture
06/11/2014EP2740153A1 Cooling device provided with a thermoelectric sensor
06/11/2014EP2740152A1 Device for localizing hot spots with heat flow meters
06/11/2014EP2739929A1 Dynamic thermal interface material
06/11/2014CN203645979U 一种功率管的散热装置 A power tube cooling devices
06/11/2014CN203645358U 一种水冷式车载充电器 One kind of water-cooled car charger
06/11/2014CN203644793U 一种抗温度冲击的二极管 An anti-diode temperature shock
06/11/2014CN203644777U 一种用于集成电路的铜保险丝 Copper fuse for integrated circuits
06/11/2014CN203644776U 一种低反压bed集成功率三极管 A low backpressure bed integrated power transistor
06/11/2014CN203644772U 一种容量为4G×40bit的立体封装NAND FLASH存储器 One kind of capacity for 4G × 40bit stereo package NAND FLASH memory
06/11/2014CN203644771U 一种容量为512K×40bit的立体封装SRAM存储器 Single capacity of 512K × 40bit stereo package SRAM memory
06/11/2014CN203644770U 容量为8G×8bit的立体封装NAND FLASH存储器 Capacity 8G × 8bit stereo package NAND FLASH memory
06/11/2014CN203644769U 一种容量为1M×8bit的立体封装EEPROM存储器 One kind of capacity for three-dimensional packaging 1M × 8bit EEPROM memory
06/11/2014CN203644768U 一种容量为8G×8bit的立体封装NAND FLASH存储器 Capacity 8G × 8bit one kind of three-dimensional packaging NAND FLASH memory
06/11/2014CN203644767U 一种容量为16G×8bit的立体封装NAND FLASH存储器 Capacity of 16G × 8bit one kind of three-dimensional packaging NAND FLASH memory
06/11/2014CN203644766U 一种容量为128K×40bit的立体封装EEPROM存储器 Single capacity of 128K × 40bit stereo package EEPROM memory
06/11/2014CN203644765U 一种容量为256K×32bit的立体封装EEPROM存储器 Single capacity of 256K × 32bit stereo package EEPROM memory
06/11/2014CN203644764U 一种容量为512K×8bit的立体封装EEPROM存储器 Capacity of 512K × 8bit one kind of three-dimensional package EEPROM memory
06/11/2014CN203644763U 一种容量为512M×8bit的立体封装NAND FLASH存储器 Capacity of 512M × 8bit one kind of three-dimensional packaging NAND FLASH memory
06/11/2014CN203644762U 一种容量为4G×8bit的立体封装NAND FLASH存储器 One kind of capacity for three-dimensional packaging 4G × 8bit NAND FLASH memory
06/11/2014CN203644761U 一种d系列、gbu系列整流桥 One kind of d series, gbu series rectifier bridge
06/11/2014CN203644760U 测试结构 Test structure
06/11/2014CN203644759U 测试结构 Test structure
06/11/2014CN203644758U 测试结构 Test structure
06/11/2014CN203644757U 阵列基板及显示装置 Array substrate and a display device
06/11/2014CN203644756U 半导体装置 Semiconductor device
06/11/2014CN203644755U 大功率方片可控硅封装结构 Square piece thyristor power package
06/11/2014CN203644754U 一种集成共模电感的封装结构 An integrated common mode inductance package
06/11/2014CN203644753U 一种sot-23封装结构 One kind sot-23 package
06/11/2014CN203644752U 一种二极管封装结构 To a diode package structure
06/11/2014CN103858529A Chassis and method for producing chassis
06/11/2014CN103858227A Wafer level applied RF shields
06/11/2014CN103858226A Diode cell modules
06/11/2014CN103858225A Method for producing a solder joint
06/11/2014CN103858224A Cooler for semiconductor module, and semiconductor module
06/11/2014CN103858223A Power conversion device
06/11/2014CN103858222A Wafer level applied thermal heat sink
06/11/2014CN103858217A Sealant composition for electronic device
06/11/2014CN103858216A Composition for electronic device
06/11/2014CN103857722A Epoxy resin mixture, epoxy resin composition, prepreg, and curing product of each
06/11/2014CN103857260A Substrate and cooling device with the substrate
06/11/2014CN103857210A Bearer circuit board, manufacturing method for the same and packaging structure thereof
06/11/2014CN103857173A High efficiency embedding technology
06/11/2014CN103855914A Power supply system, power module in power supply system and manufacturing method for power module
06/11/2014CN103855292A Semiconductor Construction, Semiconductor Unit, and Manufacturing Method Thereof
06/11/2014CN103855216A Semiconductor device including alternating source and drain regions, and respective source and drain metallic strips
06/11/2014CN103855175A Semiconductor device and manufacturing method of the same
06/11/2014CN103855158A Semiconductor device including a redistribution layer and metallic pillars coupled thereto
06/11/2014CN103855157A MIM-capacitor and method of manufacturing same
06/11/2014CN103855139A Sheet-type difference composite tube
06/11/2014CN103855138A Semiconductor package and method for manufacturing the same
06/11/2014CN103855137A Semiconductor device
06/11/2014CN103855136A Semiconductor apparatus and electronic apparatus
06/11/2014CN103855135A Three dimensional through-silicon via construction
06/11/2014CN103855134A Apparatus including a semiconductor device coupled to a decoupling device
06/11/2014CN103855133A Semiconductor device with fuse pattern
06/11/2014CN103855132A Apparatus and method for three dimensional integrated circuits
06/11/2014CN103855131A Self-forming barrier structure and semiconductor device having the same
06/11/2014CN103855130A Array substrate, manufacturing method of array substrate and display device
06/11/2014CN103855129A Semiconductor device and method for manufacturing same
06/11/2014CN103855128A Semiconductor apparatus
06/11/2014CN103855127A Programmable polycrystalline silicon diode fuse wire device structure and manufacturing method
06/11/2014CN103855126A Semiconductor Devices and Methods of Manufacture Thereof
06/11/2014CN103855125A High-heat-conductive patterned circuit baseplate
06/11/2014CN103855124A Semiconductor device and method for manufacturing the same
06/11/2014CN103855123A Substrate for encapsulating integrated circuit
06/11/2014CN103855122A Packaged vertical power device comprising compressive stress and manufacturing method thereof
06/11/2014CN103855121A Packaged semiconductor device with tensile stress and manufacturing method thereof
06/11/2014CN103855120A Multichip package and fabrication method thereof
06/11/2014CN103855119A Semiconductor module, semiconductor device and manufacturing method of semiconductor module
06/11/2014CN103855118A Bump-equipped electronic component and method for manufacturing bump-equipped electronic component
06/11/2014CN103855117A Semiconductor device including a redistribution layer and metallic pillars coupled thereof
06/11/2014CN103855116A Electronic component, electronic apparatus including the same, and manufacturing method of the electronic apparatus
06/11/2014CN103855115A Substrate pad structure
06/11/2014CN103855114A Methods and apparatus for package with interposers
06/11/2014CN103855113A Contact pad structure
06/11/2014CN103855112A DIE HAVING THROUGH-SUBSTRATE VIAS WITH DEFORMATION PROTECTED TIPS and method for manufacturing same.
06/11/2014CN103855111A Heat pipe radiator pedestal, manufacturing method thereof, and rolling machine tool
06/11/2014CN103855110A Image sensors for performing thermal reset, methods thereof, and devices including the same
06/11/2014CN103855109A Chip Module, Insulation Material and Method for Fabricating Chip Module
06/11/2014CN103855108A Copper-based composite heat conduction material and manufacturing method thereof
06/11/2014CN103855107A Power module and converter
06/11/2014CN103855106A Power conversion device
06/11/2014CN103855105A Environmental sensitive electronic device package and manufacturing method thereof
06/11/2014CN103855104A Moisture-tight semiconductor module and method for producing moisture-tight semiconductor module
06/11/2014CN103855103A Semiconductor device and manufacturing method thereof
06/11/2014CN103855102A Semiconductor Packages, Systems, and Methods of Formation Thereof
06/11/2014CN103855101A Stress relief structure
06/11/2014CN103855100A Seal Ring Structure with Metal-Insulator-Metal Capacitor
06/11/2014CN103855099A Substrate structure with component arrangement area and manufacturing technology thereof
06/11/2014CN103855097A Contact Plugs in SRAM Cells and Method of Forming the Same
06/11/2014CN103855081A Integrated circuit and fabricating method thereof
06/11/2014CN103855079A Buried word line structure and method of forming the same
06/11/2014CN103855077A Semiconductor structure with contact plugs and forming method thereof
06/11/2014CN103855076A Electrically programmable fuse structure and manufacturing method thereof
06/11/2014CN103855037A Electronic part mounting substrate and method for producing same
06/11/2014CN103852376A Testing method for mechanical property of through-silicon-via interconnected metal
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