Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2015
03/05/2015WO2015031711A1 Molded lead frame package with embedded die
03/05/2015WO2015031280A1 Ultra fine pitch and spacing interconnects for substrate
03/05/2015WO2015031200A1 Metal oxide semiconductor (mos) capacitor with improved linearity
03/05/2015WO2015031030A1 ULTRA FINE PITCH PoP CORELESS PACKAGE
03/05/2015WO2015030699A2 Air cavity packages having high thermal conductivity base plates and methods of making
03/05/2015WO2015030670A1 Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device
03/05/2015WO2015030657A1 Thin capping for mems devices
03/05/2015WO2015030262A1 Curable silicone composition, cured product thereof, and optical semiconductor device
03/05/2015WO2015030259A1 One-part curable silicone composition and optical semiconductor device
03/05/2015WO2015030239A1 Thermal diode
03/05/2015WO2015030093A1 Package for housing elements and mounting structure
03/05/2015WO2015030089A1 Curable resin composition, curable resin composition for powder moulding, and optical semiconductor device
03/05/2015WO2015030034A1 Element housing package and mounting structure provided with same
03/05/2015WO2015029951A1 Mounting substrate wafer, multilayer ceramic substrate, mounting substrate, chip module, and mounting substrate wafer manufacturing method
03/05/2015WO2015029938A1 Array substrate, radiation detector, and wiring substrate
03/05/2015WO2015029907A1 Package for accommodating electronic component, and electronic device
03/05/2015WO2015029880A1 Package for housing elements and mounting structure
03/05/2015WO2015029871A1 Adhesive film and method for manufacturing seminconductor device
03/05/2015WO2015029813A1 Method for manufacturing assembly and method for manufacturing power-module substrate
03/05/2015WO2015029812A1 Assembly and power-module substrate
03/05/2015WO2015029811A1 Assembly and power-module substrate
03/05/2015WO2015029810A1 Assembly and power-module substrate
03/05/2015WO2015029783A1 Method for manufacturing component-integrated sheet, method for manufacturing resin multilayer substrate in which electronic component is incorporated, and resin multilayer substrate
03/05/2015WO2015029664A1 Method for producing sealed semiconductor element and method for manufacturing semiconductor device
03/05/2015WO2015029642A1 Resin sheet for sealing electronic device and method for manufacturing electronic device package
03/05/2015WO2015029638A1 Semiconductor device for power generation, method for manufacturing same, and solder therefor
03/05/2015WO2015029630A1 Electronic control device
03/05/2015WO2015029629A1 Vehicular electronic control device
03/05/2015WO2015029511A1 Semiconductor device and production method therefor
03/05/2015WO2015029478A1 Method for manufacturing ceramic circuit board
03/05/2015WO2015029446A1 Stacked cooler
03/05/2015WO2015029411A1 Cooler
03/05/2015WO2015029407A1 Insulating heat-conductive sheet
03/05/2015WO2015029386A1 Semiconductor device
03/05/2015WO2015029186A1 Semiconductor module, semiconductor device, and automobile
03/05/2015WO2015029111A1 Semiconductor device and manufacturing method for same
03/05/2015WO2015029092A1 Etching method, manufacturing method for lsi device, and 3d-integrated lsi device manufacturing method
03/05/2015WO2015028213A1 Die with a crack detecting structure and manufacturing method thereof
03/05/2015WO2015027995A1 Cooling arrangement
03/05/2015WO2015027619A1 Array substrate, display apparatus, and method for manufacturing array substrate
03/05/2015WO2015027578A1 Substrate having electrostatic self-protection capability and manufacturing method therefor
03/05/2015US20150064899 Method of fabricating semiconductor devices having through-silicon via (tsv) structures
03/05/2015US20150064851 Pre-applied underfill
03/05/2015US20150064850 Method for fabricating semiconductor structure
03/05/2015US20150064849 Lead Frame Strips with Electrical Isolation of Die Paddles
03/05/2015US20150064848 Semiconductor device having a diamond substrate heat spreader
03/05/2015US20150064847 Method for manufacturing semiconductor device and adhesive for mounting flip chip
03/05/2015US20150064845 Method of forming an integrated circuit package
03/05/2015US20150064843 Stacked semiconductor package and method for manufacturing the same
03/05/2015US20150064834 Image sensor integrated circuit package with reduced thickness
03/05/2015US20150064496 Single crystal copper, manufacturing method thereof and substrate comprising the same
03/05/2015US20150062852 Semiconductor packages having passive components and methods for fabricating the same
03/05/2015US20150062843 Semiconductor device and electronic apparatus
03/05/2015US20150062837 Lead frame for a premold sensor housing
03/05/2015US20150062825 Overmolded substrate-chip arrangement with heat sink
03/05/2015US20150062820 Heat transfer for electronic equipment
03/05/2015US20150062819 Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat
03/05/2015US20150062437 Semiconductor device
03/05/2015US20150062248 Method for bonding a chip to a substrate
03/05/2015US20150061782 Structures and methods for ring oscillator fabrication
03/05/2015US20150061723 Driver ic, display device, and inspection system
03/05/2015US20150061162 Semiconductor structure and manufacturing method thereof
03/05/2015US20150061161 Wire structure and semiconductor device having the same, and method of manufacturing the wire structure
03/05/2015US20150061160 Semiconductor device and method of manufacturing the semiconductor device
03/05/2015US20150061159 Semiconductor Device
03/05/2015US20150061158 Joining a chip to a substrate with two or more different solder alloys
03/05/2015US20150061157 High yield semiconductor device
03/05/2015US20150061156 Pad solutions for reliable bonds
03/05/2015US20150061155 Semiconductor Devices and Methods of Fabricating the Same
03/05/2015US20150061154 Semiconductor devices including insulating extension patterns between adjacent landing pads and methods of fabricating the same
03/05/2015US20150061153 Semiconductor device and method for manufacturing the same
03/05/2015US20150061152 Package module with offset stack device
03/05/2015US20150061151 Package structure having silicon through vias connected to ground potential
03/05/2015US20150061150 Stacked semiconductor chip device with phase change material
03/05/2015US20150061149 Packages, Packaging Methods, and Packaged Semiconductor Devices
03/05/2015US20150061148 3d ic with serial gate mos device, and method of making the 3d ic
03/05/2015US20150061147 Device with Through-Substrate Via Structure and Method for Forming the Same
03/05/2015US20150061146 Esd protection device
03/05/2015US20150061145 Semiconductor device
03/05/2015US20150061144 Semiconductor Arrangement, Method for Producing a Semiconductor Module, Method for Producing a Semiconductor Arrangement and Method for Operating a Semiconductor Arrangement
03/05/2015US20150061143 Ultra fine pitch and spacing interconnects for substrate
03/05/2015US20150061142 ULTRA FINE PITCH PoP CORELESS PACKAGE
03/05/2015US20150061141 Interconnect structures and methods of forming same
03/05/2015US20150061140 Molded Semiconductor Package with Pluggable Lead
03/05/2015US20150061139 Microelectronic packages containing opposing devices and methods for the fabrication thereof
03/05/2015US20150061138 Method of forming a memory device
03/05/2015US20150061137 Package and method for integration of heterogeneous integrated circuits
03/05/2015US20150061136 Semiconductor devices having metal silicide layers and methods of manufacturing such semiconductor devices
03/05/2015US20150061135 Copper interconnect with cvd liner and metallic cap
03/05/2015US20150061134 Semiconductor devices including air gap spacers and methods of manufacturing the same
03/05/2015US20150061133 Semiconductor device and manufacturing method of the same
03/05/2015US20150061132 Conductive line structures and methods of forming the same
03/05/2015US20150061131 Semiconductor device and method of manufacturing the same
03/05/2015US20150061130 Chip arrangement and a method for manufacturing a chip arrangement
03/05/2015US20150061129 Bump Electrode, Board Which Has Bump Electrodes, and Method for Manufacturing the Board
03/05/2015US20150061128 Ball arrangement for integrated circuit package devices
03/05/2015US20150061127 Semiconductor Devices and Methods of Manufacture Thereof
03/05/2015US20150061126 Manufacture including substrate and package structure of optical chip
03/05/2015US20150061125 Integrated circuit package including in-situ formed cavity
03/05/2015US20150061124 Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
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