Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/04/2014CN103839879A Semiconductor device and manufacturing method thereof
06/04/2014CN103839877A Semiconductor structure and forming method thereof
06/04/2014CN103839874A Metal interconnection structure and manufacturing method thereof
06/04/2014CN103839842A Method for fabricating an electronic component
06/04/2014CN103839840A Manufacturing method of inductor unit
06/04/2014CN103839837A Method for manufacturing ultra-thin uniform temperature plate and ultra-thin uniform temperature plate manufactured by same
06/04/2014CN103839779A Method for forming high-density capacitor structure and capacitor structure
06/04/2014CN103839778A Method for manufacturing polyresistor structure and polyresistor structure
06/04/2014CN103839776A Semiconductor structure and forming method thereof
06/04/2014CN103834832A Imitation gold bonding alloy wire and preparation method thereof
06/04/2014CN103834319A Anisotropic conductive film and semiconductor device
06/04/2014CN103834175A Curable composition
06/04/2014CN103832966A Forming method and detection method of semiconductor device
06/04/2014CN102543782B Switching and encapsulating structure and forming method thereof
06/04/2014CN102468276B Termination structure of power semiconductor device and manufacturing method thereof
06/04/2014CN102420194B Passivation layer of integrated circuit and manufacturing method of passivation layer
06/04/2014CN102394233B Wiring device and display
06/04/2014CN102280423B Integrated circuit device and manufacturing method thereof
06/04/2014CN102224590B Antenna integrated in a semiconductor chip
06/04/2014CN102201365B Method for producing semiconductor device
06/04/2014CN102187452B Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
06/04/2014CN102186907B Method for producing silicone moulded bodies from light-curable silicone mixtures
06/04/2014CN102165586B Leadframe substrate and method for manufacturing same
06/04/2014CN102148213B Lead frame of high-power chip package structure and manufacturing method thereof
06/04/2014CN101859753B High-performance semiconductor with connection device and internal auxiliary connection elements designed as contact springs
06/04/2014CN101728332B Method of forming patterns for semiconductor device
06/04/2014CN101673711B Semiconductor integrated circuit device and a method of manufacturing the same
06/04/2014CN101609810B Method of improving adhesive power of semiconductor device and method of processing semiconductor device
06/04/2014CN101542702B Bonding method of three dimensional wafer lamination based on silicon through holes
06/04/2014CN101404861B Electronic circuit device and method of making the same
06/03/2014US8744545 Analyte monitoring device and methods of use
06/03/2014US8744541 Superconducting multi-bit digital mixer
06/03/2014US8743583 Internal supply redundancy across memory devices configured for stacked arrangements
06/03/2014US8743548 Electric circuit device, electric circuit module, and power converter
06/03/2014US8743540 Electronic apparatus
06/03/2014US8742872 MEMS element, and manufacturing method of MEMS element
06/03/2014US8742839 Double through silicon via structure
06/03/2014US8742603 Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)
06/03/2014US8742602 Vertical electrical interconnect formed on support prior to die mount
06/03/2014US8742600 Dual-phase intermetallic interconnection structure and method of fabricating the same
06/03/2014US8742599 Identification mechanism for semiconductor device die
06/03/2014US8742598 Semiconductor structure and method for making same
06/03/2014US8742597 Package substrates with multiple dice
06/03/2014US8742596 Semiconductor device and method for manufacturing same
06/03/2014US8742595 MEMS devices and methods of forming same
06/03/2014US8742594 Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstop
06/03/2014US8742593 Electrical connection for multichip modules
06/03/2014US8742592 Semiconductor device including a plug and method for manufacturing the same
06/03/2014US8742591 Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief
06/03/2014US8742590 Method for forming isolation trenches
06/03/2014US8742589 Semiconductor embedded module and method for producing the same
06/03/2014US8742588 Method for making via interconnection
06/03/2014US8742587 Metal interconnection structure
06/03/2014US8742586 Stacked multilayer structure and manufacturing method thereof
06/03/2014US8742585 Semiconductor device having a plurality of pads of low diffusible material formed in a substrate
06/03/2014US8742584 Semiconductor device
06/03/2014US8742583 Seal ring in an integrated circuit die
06/03/2014US8742582 Solder interconnect on IC chip
06/03/2014US8742581 Enhanced diffusion barrier for interconnect structures
06/03/2014US8742580 Method of wire bonding over active area of a semiconductor circuit
06/03/2014US8742578 Solder volume compensation with C4 process
06/03/2014US8742577 Semiconductor package having an anti-contact layer
06/03/2014US8742576 Maintaining alignment in a multi-chip module using a compressible structure
06/03/2014US8742575 Semiconductor device and fabrication method thereof
06/03/2014US8742574 Semiconductor device having a through-substrate via
06/03/2014US8742573 Package structure and manufacturing method thereof
06/03/2014US8742572 Microelectronic devices and methods for manufacturing microelectronic devices
06/03/2014US8742571 Diode array and method for producing a diode array
06/03/2014US8742570 Backplate interconnect with integrated passives
06/03/2014US8742569 Semiconductor package configured to electrically couple to a printed circuit board and method of providing same
06/03/2014US8742568 Circuit board, semiconductor device, process for manufacturing circuit board and process for manufacturing semiconductor device
06/03/2014US8742567 Circuit board structure and packaging structure comprising the circuit board structure
06/03/2014US8742566 Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers
06/03/2014US8742565 Ball grid array with improved single-ended and differential signal performance
06/03/2014US8742564 Chip package and method for forming the same
06/03/2014US8742563 Component and method for producing a component
06/03/2014US8742561 Recessed and embedded die coreless package
06/03/2014US8742560 Anti-reflection structures for CMOS image sensors
06/03/2014US8742559 Manufacturing method of semiconductor device, and semiconductor device
06/03/2014US8742558 Component protection for advanced packaging applications
06/03/2014US8742557 Die mounting stress isolator
06/03/2014US8742556 Semiconductor module
06/03/2014US8742555 Lead frame having a flag with in-plane and out-of-plane mold locking features
06/03/2014US8742554 Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member
06/03/2014US8742553 Printed wiring board
06/03/2014US8742552 Semiconductor device
06/03/2014US8742551 Semiconductor package and method of manufacturing the same
06/03/2014US8742549 Shallow trench isolation structure
06/03/2014US8742548 Semiconductor device with one-side contact and fabrication method thereof
06/03/2014US8742547 Semiconductor wafer and its manufacture method, and semiconductor chip
06/03/2014US8742546 Semiconductor device with a plurality of dot patterns and a line pattern having a projection part
06/03/2014US8742535 Integration of shallow trench isolation and through-substrate vias into integrated circuit designs
06/03/2014US8742521 Semiconductor device and method of manufacturing the semiconductor device
06/03/2014US8742510 Semiconductor devices with replacement gate structures having conductive contacts positioned therebetween
06/03/2014US8742488 Three-dimensional semiconductor memory devices and methods of fabricating the same
06/03/2014US8742477 Elliptical through silicon vias for active interposers
06/03/2014US8742466 Three-dimensional semiconductor device including a mold structure providing gap regions and an interconnection structure including a plurality of interconnection patterns formed in the gap regions
06/03/2014US8742465 Semiconductor device
06/03/2014US8742457 Anti-fuses on semiconductor fins
06/03/2014US8742415 Test circuitry coupled to embedded circuit input/output unconnected to pads
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