Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2014
05/27/2014US8736083 Bonding inspection structure
05/27/2014US8736082 Key structure and expansion enhanced alignment of self-assembled microstructures
05/27/2014US8736081 Wafer level hermetic bond using metal alloy with keeper layer
05/27/2014US8736080 Sensor array package
05/27/2014US8736079 Pad structure, circuit carrier and integrated circuit chip
05/27/2014US8736078 Chip package and method for assembling chip package
05/27/2014US8736077 Semiconductor package substrate
05/27/2014US8736076 Multi-chip stacking of integrated circuit devices using partial device overlap
05/27/2014US8736075 Semiconductor chip module, semiconductor package having the same and package module
05/27/2014US8736074 Multi chip semiconductor device
05/27/2014US8736073 Semiconductor device
05/27/2014US8736071 Semiconductor device with vias on a bridge connecting two buses
05/27/2014US8736070 Semiconductor component comprising copper metallizations
05/27/2014US8736069 Multi-level vertical plug formation with stop layers of increasing thicknesses
05/27/2014US8736067 Semiconductor device having a pad
05/27/2014US8736066 Stacked microelectronic assemby with TSVS formed in stages and carrier above chip
05/27/2014US8736065 Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same
05/27/2014US8736064 Structure and method of making interconnect element having metal traces embedded in surface of dielectric
05/27/2014US8736063 Semiconductor device and manufacturing method thereof
05/27/2014US8736062 Pad sidewall spacers and method of making pad sidewall spacers
05/27/2014US8736061 Integrated circuits having a continuous active area and methods for fabricating same
05/27/2014US8736060 Packaging structure
05/27/2014US8736059 Interconnecting mechanism for 3D integrated circuit
05/27/2014US8736058 Low-resistance conductive pattern structures and methods of fabricating the same
05/27/2014US8736057 Substrate and manufacturing method therefor
05/27/2014US8736055 Methods and layers for metallization
05/27/2014US8736054 Multilayer metallization with stress-reducing interlayer
05/27/2014US8736053 Semiconductor device
05/27/2014US8736051 Semiconductor device and manufacturing method thereof
05/27/2014US8736050 Front side copper post joint structure for temporary bond in TSV application
05/27/2014US8736049 Micro-plasma generation using micro-springs
05/27/2014US8736048 Flexible heat sink with lateral compliance
05/27/2014US8736047 Semiconductor device and manufacturing method thereof
05/27/2014US8736046 Dual interlock heatsink assembly for enhanced cavity PBGA packages, and method of manufacture
05/27/2014US8736045 Integrated bondline spacers for wafer level packaged circuit devices
05/27/2014US8736044 Lid for an electrical hardware component
05/27/2014US8736043 Power device having a specific range of distances between collector and emitter electrodes
05/27/2014US8736042 Delamination resistant device package having raised bond surface and mold locking aperture
05/27/2014US8736041 Power converter
05/27/2014US8736040 Power module with current routing
05/27/2014US8736039 Stacked structures and methods of forming stacked structures
05/27/2014US8736038 Lead frame having increased stability due to reinforced die pads and packaging method using such lead frame
05/27/2014US8736037 Leadless integrated circuit package having standoff contacts and die attach pad
05/27/2014US8736036 Laminating encapsulant film containing phosphor over LEDs
05/27/2014US8736035 Semiconductor package and method of forming the same
05/27/2014US8736034 Lead-frame circuit package
05/27/2014US8736033 Embedded electronic device package structure
05/27/2014US8736032 Semiconductor device, semiconductor package, and electronic device
05/27/2014US8736031 Semiconductor package
05/27/2014US8736030 Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same
05/27/2014US8736026 Method of generating a hole or recess or well in a substrate
05/27/2014US8736021 Semiconductor device comprising a metal system including a separate inductor metal layer
05/27/2014US8736020 Electronic anti-fuse
05/27/2014US8736002 Sensor mounted in flip-chip technology at a substrate edge
05/27/2014US8735955 Grounding system and apparatus
05/27/2014US8735934 Semiconductor light-emitting apparatus and method of fabricating the same
05/27/2014US8735907 Ohmic electrode for use in a semiconductor diamond device
05/27/2014US8735885 Antifuse memory device
05/27/2014US8735858 Ionic devices with interacting species
05/27/2014US8735729 Double-sided substrate, semiconductor device and method for the same
05/27/2014US8735277 Methods for producing an ultrathin semiconductor circuit
05/27/2014US8735275 Semiconductor device and method of manufacturing the same
05/27/2014US8735225 Method and system for packaging MEMS devices with glass seal
05/27/2014US8735218 Method and apparatus for manufacturing an electronic assembly, electronic assembly manufactured with the method or in the apparatus
05/27/2014US8734348 Analyte monitoring device and methods of use
05/27/2014US8734346 Analyte monitoring device and methods of use
05/22/2014WO2014078246A1 Z-connection using electroless plating
05/22/2014WO2014078223A1 Structures for radiative cooling
05/22/2014WO2014078138A1 Thermocompression for semiconductor chip assembly
05/22/2014WO2014078133A1 Wafer molding for chip-on-wafer assembly
05/22/2014WO2014077980A1 Three-dimensional flash memory system
05/22/2014WO2014077278A1 Piezoelectric vibration device
05/22/2014WO2014077239A1 Acoustic wave device
05/22/2014WO2014077209A1 Semiconductor device and method for manufacturing same
05/22/2014WO2014077165A1 Magnesium hydroxide particle and resin composition containing same
05/22/2014WO2014077154A1 Semiconductor device
05/22/2014WO2014077081A1 Heat pipe, smartphone, tablet terminal or personal digital assistant
05/22/2014WO2014076856A1 Semiconductor device
05/22/2014WO2014076406A1 Graphene interposer and method of manufacturing such an interposer
05/22/2014WO2014076363A1 A shield for capacitive touch sensors
05/22/2014WO2014075869A1 Method for manufacturing an anti-electrostatic charge electronic chip module
05/22/2014WO2014075429A1 Radiator with pluggable heat source
05/22/2014WO2014051511A3 Electroless metal through silicon via
05/22/2014US20140141570 Resin film forming sheet for chip, and method for manufacturing semiconductor chip
05/22/2014US20140141566 Multi-chip package with pillar connection
05/22/2014US20140141544 Packaged microelectronic components
05/22/2014US20140140027 Interconnect arrangement for hexagonal attachment configurations
05/22/2014US20140140009 Fixing bracket and electronic device using the same
05/22/2014US20140139590 Semiconductor device, liquid discharge head, liquid discharge cartridge, and liquid discharge apparatus
05/22/2014US20140139246 Wafer Temperature Sensing Methods and Related Semiconductor Wafer
05/22/2014US20140138857 Encapsulant equipped with supporting substrate, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus
05/22/2014US20140138856 Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus
05/22/2014US20140138855 Protection of a wafer-level chip scale package (wlcsp)
05/22/2014US20140138854 Thermal interface material for integrated circuit package assembly and associated techniques and configurations
05/22/2014US20140138852 Semiconductor device and method for producing the same
05/22/2014US20140138851 Semiconductor memory chips and stack-type semiconductor packages including the same
05/22/2014US20140138850 Semiconductor power module, production method of semiconductor power module and circuit board
05/22/2014US20140138849 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
05/22/2014US20140138848 Semiconductor device and manufacturing method thereof
05/22/2014US20140138846 Conductive ink for filling vias
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