Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/19/2014US20140170851 Substrate Contact Opening
06/19/2014US20140170850 UBM Structures for Wafer Level Chip Scale Packaging
06/19/2014US20140170816 Copper Post Solder Bumps on Substrates
06/19/2014US20140170815 Embedded ball grid array substrate and manufacturing method thereof
06/19/2014US20140170813 Method for bonding semiconductor substrates and devices obtained thereof
06/19/2014US20140170811 Method of fabricating a 3d integrated electronic device structure including increased thermal dissipation capabilities
06/19/2014US20140170810 Method of manufacturing semiconductor device
06/19/2014US20140170777 Vertically Oriented Semiconductor Device and Shielding Structure Thereof
06/19/2014US20140168914 Semiconductor device
06/19/2014US20140168879 Apparatus and method to monitor die edge defects
06/19/2014US20140168592 Bonding pad of array substrate, method for producing the same, array substrate, and liquid crystal display apparatus
06/19/2014US20140167297 Alignment mark design for semiconductor device
06/19/2014US20140167296 Methods of forming configurable microchannels in package structures
06/19/2014US20140167294 Functional film, environmentally sensitive electronic device package, and manufacturing methods thereof
06/19/2014US20140167293 Integrated circuit with bump connection scheme
06/19/2014US20140167292 Semiconductor integrated circuit device
06/19/2014US20140167290 Methods of forming fine patterns in the fabrication of semiconductor devices
06/19/2014US20140167289 Semiconductor device having through electrode and method of fabricating the same
06/19/2014US20140167288 Semiconductor device including contact plug and method of manufacturing the same
06/19/2014US20140167287 Microelectronic package with terminals on dielectric mass
06/19/2014US20140167286 Semiconductor device
06/19/2014US20140167285 Interconnect structure and fabrication method
06/19/2014US20140167284 Interconnect structure and forming method thereof
06/19/2014US20140167283 Interconnect structure and fabrication method
06/19/2014US20140167282 Semiconductor device
06/19/2014US20140167281 Stack type semiconductor circuit with impedance calibration
06/19/2014US20140167280 Semiconductor device
06/19/2014US20140167279 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
06/19/2014US20140167278 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
06/19/2014US20140167277 Semiconductor wiring patterns
06/19/2014US20140167276 Substrate for semiconductor package, semiconductor package using the substrate, and method of manufacturing the semiconductor package
06/19/2014US20140167275 Embedded package and method of manufacturing the same
06/19/2014US20140167273 Low parasitic package substrate having embedded passive substrate discrete components and method for making same
06/19/2014US20140167272 Semiconductor Device Having an Identification Mark
06/19/2014US20140167271 Interconnect structure and forming method thereof
06/19/2014US20140167270 Method of Fabricating a Layer Stack
06/19/2014US20140167268 Graphene and metal interconnects
06/19/2014US20140167267 Method and structures for heat dissipating interposers
06/19/2014US20140167266 Semiconductor device having peripheral polymer structures
06/19/2014US20140167265 Methods of forming a bi-layer cap layer on copper-based conductive structures and devices with such a cap layer
06/19/2014US20140167263 Methods and Apparatus for Package with Interposers
06/19/2014US20140167262 Semiconductor package signal routing using conductive vias
06/19/2014US20140167261 Routing layer for mitigating stress in a semiconductor die
06/19/2014US20140167260 Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device
06/19/2014US20140167259 Pillar on pad interconnect structures, semiconductor devices including same and related methods
06/19/2014US20140167258 Semiconductor device
06/19/2014US20140167256 Flip chip package structure and fabrication process thereof
06/19/2014US20140167255 Package structure and package method
06/19/2014US20140167254 Bump structures for semiconductor package
06/19/2014US20140167253 Semiconductor Devices, Methods of Manufacture Thereof, and Packaged Semiconductor Devices
06/19/2014US20140167252 Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (wlp) packages
06/19/2014US20140167251 Semiconductor device, semiconductor module, and manufacturing method for semiconductor device
06/19/2014US20140167250 Semiconductor device
06/19/2014US20140167249 Interconnect structure and fabrication method
06/19/2014US20140167248 Power module package
06/19/2014US20140167247 Semiconductor device package having backside contact and method for manufacturing
06/19/2014US20140167246 Semiconductor device
06/19/2014US20140167245 Semiconductor package and display apparatus using the same
06/19/2014US20140167244 Chip thermal dissipation structure
06/19/2014US20140167243 Semiconductor packages using a chip constraint means
06/19/2014US20140167242 Power module package
06/19/2014US20140167241 Semiconductor device
06/19/2014US20140167240 Semiconductor device carrier and semiconductor package using the same
06/19/2014US20140167239 Power module package
06/19/2014US20140167238 Semiconductor die package and method for making the same
06/19/2014US20140167237 Power module package
06/19/2014US20140167236 Integrated circuit packaging system with transferable trace lead frame
06/19/2014US20140167235 Semiconductor module
06/19/2014US20140167234 Single Layer Coreless Substrate
06/19/2014US20140167233 Semiconductor light-emitting device
06/19/2014US20140167232 Segmented conductive ground plane for radio frequency isolation
06/19/2014US20140167231 Leadframe-type semiconductor package having emi shielding layer connected to ground
06/19/2014US20140167229 Protecting layer in a semiconductor structure
06/19/2014US20140167226 Wafer and a Method of Dicing a Wafer
06/19/2014US20140167225 Crack Stop Barrier and Method of Manufacturing Thereof
06/19/2014US20140167224 Semiconductor Device and Method of Producing the Same
06/19/2014US20140167223 Semiconductor Cooling Device
06/19/2014US20140167219 Thick On-Chip High-Performance Wiring Structures
06/19/2014US20140167218 Circuit configuration and manufacturing processes for vertical transient voltage suppressor (tvs) and emi filter
06/19/2014US20140167217 Package with dielectric or anisotropic conductive (acf) buildup layer
06/19/2014US20140167216 Low-profile chip package with modified heat spreader
06/19/2014US20140167215 Electronic circuit arrangement
06/19/2014US20140167214 Memory cell repair
06/19/2014US20140167199 System and method for die to die stress improvement
06/19/2014US20140167176 Local interconnects compatible with replacement gate structures
06/19/2014US20140167170 Electrostatic discharge protection device and semiconductor structure thereof
06/19/2014US20140167122 Semiconductor device and manufacturing method thereof
06/19/2014US20140167109 Continuous metal semiconductor alloy via for interconnects
06/19/2014US20140167083 Led package with integrated reflective shield on zener diode
06/19/2014US20140167044 Semiconductor Device and Method for Manufacturing a Semiconductor Device
06/19/2014US20140167043 Semiconductor device and method for manufacturing a semiconductor device
06/19/2014US20140167023 Oled device in contact with a conductor
06/19/2014US20140166194 Method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package
06/19/2014CA2836351A1 Power module package
06/18/2014EP2744311A1 Method for producing resonating patterns suitable for the performance of passive RF functions
06/18/2014EP2744310A1 Wiring substrate and method for manufacturing same and semiconductor device
06/18/2014EP2744003A2 Integrated circuits including integrated passive devices and methods of manufacture thereof
06/18/2014EP2744001A2 Light emitting device package
06/18/2014EP2743980A2 Lead structure
06/18/2014EP2743979A2 Chip thermal dissipation structure
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