Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2014
05/22/2014US20140138845 Logic die and other components embedded in build-up layers
05/22/2014US20140138844 Patterned backside metal ground plane for improved metal adhesion
05/22/2014US20140138843 Method for Fabricating an Electronic Component
05/22/2014US20140138842 Continuous via for power grid
05/22/2014US20140138841 Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
05/22/2014US20140138840 Stair step formation using at least two masks
05/22/2014US20140138839 Power semiconductor module
05/22/2014US20140138838 Method of Semiconducotr integrated Circuit Fabrication
05/22/2014US20140138837 Sandwiched diffusion barrier and metal liner for an interconnect structure
05/22/2014US20140138836 Semiconductor device
05/22/2014US20140138835 Copper interconnect structure and method for manufacturing the same
05/22/2014US20140138834 Preventing shorting dendritic migration between electrodes
05/22/2014US20140138833 Semiconductor Device Assembly Including a Chip Carrier, Semiconductor Wafer and Method of Manufacturing a Semiconductor Device
05/22/2014US20140138832 Copper seed layer for an interconnect structure having a doping concentration level gradient
05/22/2014US20140138831 Surface finish on trace for a thermal compression flip chip (tcfc)
05/22/2014US20140138830 Metal interconnection structure
05/22/2014US20140138829 Interconnection structure and method for fabricating the same
05/22/2014US20140138828 Semiconductor device bonded by anisotropic conductive film
05/22/2014US20140138827 Enhanced flip chip package
05/22/2014US20140138826 High-Density Package-on-Package Structure
05/22/2014US20140138825 Molded insulator in package assembly
05/22/2014US20140138824 Offset integrated circuit packaging interconnects
05/22/2014US20140138823 Variable-size solder bump structures for integrated circuit packaging
05/22/2014US20140138822 Integrated circuit package and method of manufacture
05/22/2014US20140138821 Substrate for flip chip bonding and method of fabricating the same
05/22/2014US20140138820 Semiconductor device and semiconductor package containing the same
05/22/2014US20140138819 Semiconductor device including tsv and semiconductor package including the same
05/22/2014US20140138818 Organic thin film passivation of metal interconnections
05/22/2014US20140138817 Semiconductor device and manufacturing method thereof
05/22/2014US20140138816 Method for Forming Package-on-Package Structure
05/22/2014US20140138814 Method for Producing an Integrated Circuit Pointed Element, and Corresponding Integrated Circuit
05/22/2014US20140138813 Method for Manufacturing an Electronic Component
05/22/2014US20140138811 A semiconductor device including a heat-spreading lid
05/22/2014US20140138810 Semiconductor device
05/22/2014US20140138809 Package structure and manufacturing method thereof
05/22/2014US20140138808 Leadframe area array packaging technology
05/22/2014US20140138807 Power overlay structure with leadframe connections
05/22/2014US20140138806 Power overlay structure with leadframe connections
05/22/2014US20140138805 System for No-Lead Integrated Circuit Packages Without Tape Frame
05/22/2014US20140138804 High-frequency module and communication apparatus
05/22/2014US20140138803 Chip arrangements and methods for manufacturing a chip arrangement
05/22/2014US20140138799 Semiconductor package and method of manufacturing the same
05/22/2014US20140138798 Power voltage supply apparatus for three dimensional semiconductor
05/22/2014US20140138791 Semiconductor package and fabrication method thereof
05/22/2014US20140138732 Light-emitting module
05/22/2014US20140138720 Semiconductor element and display device using the same
05/22/2014US20140138710 Semiconductor device and method for producing the same
05/22/2014US20140138707 Power semiconductor module
05/22/2014US20140138706 Electronic circuit, production method thereof, and electronic component
05/22/2014US20140138683 Semiconductor device and method for manufacturing the same
05/22/2014US20140138426 Wire bonding apparatus and bonding method
05/22/2014US20140138425 Method for the cohesive connection of elements
05/22/2014DE112010004342B4 Verbesserung der Umverdrahtungsschicht zum Steigern der Funktionssicherheit von Wafer Level Packaging Improving the redistribution layer for increasing the reliability of wafer level packaging
05/22/2014DE102013223846A1 Logikchip und andere in Aufbauschichten eingebettete Komponenten Logic chip and embedded in pavement layers components
05/22/2014DE102013219356A1 Halbleiterbaueinheit und verfahren zu seiner herstellung Semiconductor package and method for its preparation
05/22/2014DE102013214730A1 Elektronische Schaltung, Herstellungsverfahren dafür und elektronisches Bauelement Electronic circuit, and electronic component manufacturing method thereof
05/22/2014DE102013112708A1 Verfahren zur Herstellung eines elektronischen Bauteils A method of manufacturing an electronic component
05/22/2014DE102013112636A1 Integrierte schaltung, halbleiternacktchipanordnung und verfahren zum herstellen einer integrierten schaltung Integrated circuit, semiconductor chip assembly naked and process for the manufacture of an integrated circuit
05/22/2014DE102013112592A1 Chipanordnungen und Verfahren zum Herstellen einer Chipanordnung Chip assemblies and methods for producing a chip arrangement
05/22/2014DE102013112283A1 Sperrschichtisolierte Sperrspannungsvorrichtungen mit integrierten Schutzstrukturen und Verfahren zu deren Bildung Isolated reverse voltage blocking layer devices with built-in protection structures and methods for their formation
05/22/2014DE102013106988A1 Kompaktes Gehäusesystem für ICs Compact housing system for ICs
05/22/2014DE102013104236A1 Versetzungssprung-Design in integrierten Schaltungen Displacement jump design in integrated circuits
05/22/2014DE102013019280A1 Lothökerstrukturen mit variabler Grösse für das Einbringen einer integrierten Schaltung in ein Gehäuse Lothökerstrukturen variable size for the introduction of an integrated circuit in a housing
05/22/2014DE102013019277A1 Versetzte Zwischenverbindungen einer integrierten Schaltung mit Gehäuse Offset interconnections of an integrated circuit with housing
05/22/2014DE102013018914A1 Server-Verarbeitungsmodul Server processing module
05/22/2014DE102013015661A1 Eine Halbleitereinrichtung mit einer Wärme verteilenden Abdeckung A semiconductor device having a heat-distributing cover
05/22/2014DE102012221191A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Optoelectronic component and process for producing an optoelectronic component
05/22/2014DE102012111245A1 Verfahren zur Herstellung eines Anschlussbereichs eines optoelektronischen Halbleiterchips A method for producing a connection region of an optoelectronic semiconductor chip
05/22/2014DE102010040062B4 Eine Substratzerteilungstechnik für das Separieren von Halbleiterchips mit geringerem Flächenverbrauch A Substratzerteilungstechnik for the separation of semiconductor chips with a lower surface of consumption
05/22/2014DE102009033597B4 Modemeinheit und mobile Kommunikationseinheit Modem unit and mobile communication unit
05/22/2014DE102007017733B4 Kühlmechanismus für Stapelchip-Packung und Verfahren zur Herstellung einer Stapelchip-Packung, die diesen enthält Cooling mechanism for stacking chip package and method of manufacturing a stack chip package that includes that
05/22/2014DE102005063516B4 Production of silicon semiconductor wafers for fabrication of electronic components comprises controlling ratio of pulling rate to axial temperature gradient to produce agglomerated vacancy defects above critical size in single crystal
05/22/2014DE102004055929B4 Nichtflüchtige Speicherzellen-Anordnung Non-volatile memory cell arrangement
05/22/2014DE102004041346B4 Verfahren zum Herstellen einer Halbleitereinrichtung A method of manufacturing a semiconductor device
05/21/2014EP2734020A1 Cooling arrangement with a two-phase thermosyphon for cooling a multiplicity of electric devices
05/21/2014EP2733742A1 Amplifier circuit
05/21/2014EP2733741A2 A packaged integrated circuit having large solder pads and method for forming
05/21/2014EP2733740A2 Switch mode power converters using magnetically coupled galvanically isolated lead frame communication
05/21/2014EP2733739A2 Magnetically coupled galvanically isolated communication using lead frame
05/21/2014EP2733738A2 Noise cancellation for a magnetically coupled communication link utilizing a lead frame
05/21/2014EP2733737A2 Heat dissipating device
05/21/2014EP2733736A2 Method for electrically connecting wafers using butting contact struture and semiconductor device fabricated through the same
05/21/2014EP2733729A2 Semiconductor device and method for producing the same
05/21/2014EP2733728A1 Method for manufacturing electronic component and adhesive sheet used in method for manufacturing electronic component
05/21/2014EP2733727A1 Quad flat non-leaded package and packaging method thereof
05/21/2014EP2733569A2 Fluid heat exchange apparatus
05/21/2014EP2733528A1 Display device
05/21/2014EP2733496A1 Current sensor substrate and current sensor
05/21/2014EP2733159A1 Curable resin composition and process for producing cured products using same
05/21/2014EP2732469A1 Method for generating power within an integrated three-dimensional structure, and corresponding connection device
05/21/2014EP2732465A2 Memory module in a package
05/21/2014EP2732464A1 Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package
05/21/2014EP2732463A2 Memory module in a package
05/21/2014EP2732462A1 Growth of bulk group-iii nitride crystals
05/21/2014CN203607458U Led灯珠 Led lamp beads
05/21/2014CN203607410U 集成led激光源装置 Integration led laser source means
05/21/2014CN203607397U 一种功率单管集成封装模块 A power single-tube integrated package module
05/21/2014CN203607396U 一种可拆卸、可组装的SiP封装结构 One kind of removable, assembled SiP package structure
05/21/2014CN203607395U 一种可拆卸、可组装的SiP封装结构的连接器初始件 A disengageable, the connector can be assembled package SiP initial member
05/21/2014CN203607394U 功率集成模块 Power Integration Module
1 ... 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 ... 2262