Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/03/2014US8741774 Method for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough
06/03/2014US8741770 Semiconductor device and method for patterning vertical contacts and metal lines in a common etch process
06/03/2014US8741767 Method of forming semiconductor device
06/03/2014US8741766 Semiconductor device and method of confining conductive bump material during reflow with solder mask patch
06/03/2014US8741763 Layout designs with via routing structures
06/03/2014US8741695 Semiconductor device and method of manufacturing the same
06/03/2014US8740475 High-frequency transmission module and optical connector having stacked chips connected via wire bonding
06/03/2014CA2709547C Modified reaction resin
05/2014
05/30/2014WO2014081984A1 Integrated circuit device and method for making same
05/30/2014WO2014081983A1 Hybrid transformer structure on semiconductor devices
05/30/2014WO2014081982A1 Capacitor using middle of line (mol) conductive layers
05/30/2014WO2014081476A1 Logic die and other components embedded in build-up layers
05/30/2014WO2014080933A1 Electrode used in display device or input device, and sputtering target for use in electrode formation
05/30/2014WO2014080931A1 Heat dissipation structure
05/30/2014WO2014080746A1 Substrate for mounting semiconductor element and method for manufacturing said substrate
05/30/2014WO2014080745A1 Substrate for mounting semiconductor element and method for manufacturing said substrate
05/30/2014WO2014080536A1 Metal-ceramic bonded substrate and method for producing same
05/30/2014WO2014080482A1 Structure, electronic element module, heat exchanger, fuel rod, and fuel assembly
05/30/2014WO2014080476A1 Semiconductor device and method for producing same
05/30/2014WO2014080449A1 Semiconductor device
05/30/2014WO2014079836A2 Synthetic diamond heat spreaders
05/30/2014WO2014079560A2 Wafer level package with getter
05/29/2014US20140148557 Thermoset polymides for microelectronic applications
05/29/2014US20140147984 Semiconductor device and method of fabricating through silicon via structure
05/29/2014US20140147974 Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package
05/29/2014US20140147973 Method of packaging power devices at wafer level
05/29/2014US20140147971 Method of manufacturing a semiconductor device using markings on both lead frame and sealing body
05/29/2014US20140147684 Gas barrier film and method of preparing the same
05/29/2014US20140146480 Devices for cooling and power
05/29/2014US20140145354 Fabrication Method For Semiconductor Device And Semiconductor Device
05/29/2014US20140145353 Tamper-resistant coating for an integrated circuit
05/29/2014US20140145351 Configurable interposer
05/29/2014US20140145350 Integrated circuit device and method for manufacturing same
05/29/2014US20140145349 Semiconductor element comprising a supporting structure and production method
05/29/2014US20140145348 Rf (radio frequency) module and method of maufacturing the same
05/29/2014US20140145347 Clock distribution network for 3d integrated circuit
05/29/2014US20140145346 Semiconductor Devices and Methods of Manufacture Thereof
05/29/2014US20140145345 Method of forming a semiconductor structure, and a semiconductor structure
05/29/2014US20140145344 Semiconductor Constructions and Methods of Forming Semiconductor Constructions
05/29/2014US20140145343 Semiconductor device and method for manufacturing the same
05/29/2014US20140145342 Metal density distribution for double pattern lithography
05/29/2014US20140145341 Semiconductor device
05/29/2014US20140145340 Flip Chip Interconnection Structure
05/29/2014US20140145339 Encapsulant for a semiconductor device
05/29/2014US20140145338 Semiconductor device
05/29/2014US20140145337 Memory Device Interconnects and Method of Manufacture
05/29/2014US20140145336 Semiconductor device including two groove-shaped patterns
05/29/2014US20140145335 Semiconductor device including two groove-shaped patterns
05/29/2014US20140145334 Methods and apparatuses for three dimensional integrated circuits
05/29/2014US20140145333 Device Comprising a Ductile Layer and Method of Making the Same
05/29/2014US20140145332 Methods of forming graphene liners and/or cap layers on copper-based conductive structures
05/29/2014US20140145331 Multi-chip package and manufacturing method thereof
05/29/2014US20140145330 Bond pad configurations for controlling semiconductor chip package interactions
05/29/2014US20140145329 Fine pitch microcontacts and method for forming thereof
05/29/2014US20140145328 Interconnect assemblies and methods of making and using same
05/29/2014US20140145327 Semiconductor device and method for fabricating the same
05/29/2014US20140145326 Substrate with integrated passive devices and method of manufacturing the same
05/29/2014US20140145325 Electronic devices with embedded die interconnect structures, and methods of manufacture thereof
05/29/2014US20140145324 Method and system for controlling chip warpage during bonding
05/29/2014US20140145323 Lamination layer type semiconductor package
05/29/2014US20140145322 Electronic component package and method of manufacturing the same
05/29/2014US20140145321 Power Semiconductor Housing With Contact Mechanism
05/29/2014US20140145320 Die package
05/29/2014US20140145319 Semicondutor Packages and Methods of Fabrication Thereof
05/29/2014US20140145318 Semiconductor Packages and Methods of Formation Thereof
05/29/2014US20140145317 Electronic component device
05/29/2014US20140145316 Wireless module
05/29/2014US20140145315 Semiconductor device and method of fabricating the same
05/29/2014US20140145311 Methods of forming features in semiconductor device structures
05/29/2014US20140145298 Electrode manufacturing method, fuse device and manufacturing method therefor
05/29/2014US20140145293 Integrated circuit having improved radiation immunity
05/29/2014US20140145280 Semiconductor device and production method therefor
05/29/2014US20140145272 Novel semiconductor device and structure
05/29/2014US20140145266 Semiconductor integrated circuit with tsv bumps
05/29/2014US20140145236 Functionalization of a Substrate
05/29/2014US20140145194 Semiconductor Device Components and Methods
05/29/2014US20140145193 Lead frame and power module
05/29/2014US20140144971 In System Reflow of Low Temperature Eutectic Bond Balls
05/29/2014US20140144608 Evaporation-assisted heat dissipation apparatus
05/29/2014US20140144593 Wafer debonding using long-wavelength infrared radiation ablation
05/28/2014EP2736315A1 Installation structure for coolant pipe
05/28/2014EP2736308A1 Heat sink assembly
05/28/2014EP2736071A1 Wafer level package with getter
05/28/2014EP2735834A1 Cooling apparatus, electronic apparatus provided with same, and electric vehicle
05/28/2014EP2735590A2 Curable composition
05/28/2014EP2735391A1 Composite material for heat dissipating substrate, and method for manufacturing composite material for heat dissipating substrate
05/28/2014EP2735022A2 Interconnect pillars with directed compliance geometry
05/28/2014EP2735021A1 Resilient mounting assembly for photovoltaic modules
05/28/2014DE112006002488B4 Halbleiter-Baueinheit Semiconductor package
05/28/2014DE102013223500A1 Hochfrequenzvorrichtung The high frequency apparatus
05/28/2014DE102013219267A1 System und Verfahren für eine intergrierte Schaltung, die Transistorsegmente aufweist Comprises a system and method for an intergrated circuit, the transistor segments
05/28/2014DE102013113103A1 Halbleiterbausteine und Verfahren für deren Ausbildung Semiconductor devices and methods for their training
05/28/2014DE102013113061A1 Halbleiterbausteine und Verfahren für deren Herstellung Semiconductor devices and methods for their preparation
05/28/2014DE102013006624B3 Hochfrequenzleiter mit verbesserter Leitfähigkeit und Verfahren seiner Herstellung RF conductor with improved conductivity and its method of manufacture
05/28/2014DE102012111489A1 Device for cooling power electronic for use in motor vehicle e.g. hybrid vehicle, has separating elements that are fluidly connected to each other, and electronic components that are arranged in respective cooling chambers
05/28/2014DE102012111458A1 Halbleitervorrichtung Semiconductor device
05/28/2014DE102012106244A1 Metall-Keramik-Substrat A metal-ceramic substrate
05/28/2014DE102011013228B4 Verfahren zur Herstellung eines Halbleiterbauelements für 3D-Integration A process for producing a semiconductor device for 3D integration
05/28/2014DE102009030325B4 Halbleiterchipbaugruppe Semiconductor chip assembly
05/28/2014DE102004025420B4 Schaltungselement zum Sichern einer Lastschaltung und Chip mit einem derartigen Schaltungselement Circuit element for securing a load circuit and chip having such a circuit element
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