Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/18/2014EP2743978A1 Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module
06/18/2014EP2743973A2 Method for contacting a semiconductor element by welding a contact element to a sintered layer on the semiconductor element and semiconductor component with increased stability against thermomechanical influence
06/18/2014EP2743972A1 Method for bonding semiconductor substrates and devices obtained thereby
06/18/2014EP2743323A1 Anisotropic conductive adhesive film and electronic device.
06/18/2014EP2743283A1 Novel cyanic acid ester compound, method for producing same, curable resin composition containing novel cyanic acid ester compound, and cured product of curable resin composition
06/18/2014EP2742528A2 Lead carrier with multi-material print formed package components
06/18/2014DE202014001016U1 Kühlstruktur für Mobilgerät The cooling structure for a mobile device
06/18/2014DE202014000993U1 Eigenkühlungsstruktur Self-cooling structure
06/18/2014DE112011105612T5 Halbleitermodul Semiconductor module
06/18/2014DE102013216003A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof
06/18/2014DE102013114218A1 Verfahren zum herstellen einer halbleitervorrichtung und halbleiterwerkstück A method of manufacturing a semiconductor device and semiconductor workpiece
06/18/2014DE102013114059A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
06/18/2014DE102013113917A1 Verfahren zum Fertigen eines Schichtstapels A method of fabricating a layer stack
06/18/2014DE102013113767A1 Halbleitervorrichtung mit einer Identifikationskennzeichnung A semiconductor device with an identification marking
06/18/2014DE102013113751A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
06/18/2014DE102013102781A1 Antennenvorrichtung und verfahren Antenna device and method
06/18/2014DE102013019514A1 Chipgehäuse mit niedrigem profil und mit modifiziertem wärmeverteilungselement Chip package with a low profile and with modified heat distribution element
06/18/2014DE102012223287A1 Printed circuit board for accommodating electronic element i.e. LED, has electrically insulated layer comprising openings for guiding connection unit, where core and/or connection unit and/or conductors are partially made from copper
06/18/2014DE102012223159A1 Organische, optoelektronische bauelementevorrichtung und verfahren zum herstellen einer organischen, optoelektronischen bauelementevorrichtung Organic, optoelectronic devices apparatus and method for manufacturing an organic optoelectronic device components
06/18/2014DE102012222012A1 Power semiconductor device e.g. insulated gate bipolar transistor (IGBT) for use in power semiconductor module, has power semiconductor component whose lateral edges are arranged on conductor line, adjacent to non-conductive insulator
06/18/2014DE102012112389A1 Elektrische Baugruppe zur Montage auf einer Hutschiene Electrical assembly for mounting on a DIN rail
06/18/2014DE102012112307A1 Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements An optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component,
06/18/2014DE102012024459A1 Anordnung aus einem Kühlkörper und darauf aufgenommenen, Wärme erzeugenden elektronischen Bauteilen Assembly of a heat sink and recorded on heat-generating electronic components
06/18/2014DE102007034402B4 Halbleiterpackung und Herstellungsverfahren dafür A semiconductor package and fabrication method thereof
06/18/2014DE102004059505B4 Anordnung zum Test von eingebetteten Schaltungen mit Hilfe von Testinseln Arrangement for testing embedded circuits using test Islands
06/18/2014DE10164494B4 Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung An encapsulated device with a small overall height and methods for preparing
06/18/2014CN203661498U 大功率电气发热元件散热用水冷板 High-power electric heating element heat cold water
06/18/2014CN203661409U 电源模块用正极氧化膜印刷基板 The power module substrate of the positive electrode oxide film printing
06/18/2014CN203660870U 一种光电热管svc装置 A photovoltaic device heat pipe svc
06/18/2014CN203659869U 晶体管和半导体装置 A transistor and a semiconductor device
06/18/2014CN203659857U 一种耐高压光电耦合器 One kind of high voltage optocouplers
06/18/2014CN203659851U 一种超大功率晶闸管阀组 An ultra high-power thyristor valve
06/18/2014CN203659850U 一种压接式绝缘型电力半导体模块 One kind of insulated crimp-type power semiconductor module
06/18/2014CN203659849U 半导体装置 Semiconductor device
06/18/2014CN203659848U 修调电阻控制装置及使用该装置的晶圆测试系统 Trimming resistor control devices and the use of the device wafer testing system
06/18/2014CN203659847U 集成电路器件 Integrated circuit device
06/18/2014CN203659846U 一种引线框架及封装体 A lead frame and package
06/18/2014CN203659845U 一种带有限位结构的引线框架 A lead frame structure with the stopper
06/18/2014CN203659844U 一种半导体焊线时用金属导线 When a semiconductor with a metal wire bonding wire
06/18/2014CN203659843U 一种双台面可控硅器件封装结构 A dual thyristor device package mesa structure
06/18/2014CN203659842U 半槽半缝类结构bga产品 Semi-recessed joints bga product class structure
06/18/2014CN203659841U 一种肋线式散热器 One kind of rib-wire radiator
06/18/2014CN203659840U 一种带绝缘装置的换热器 Heat exchanger means with an insulated
06/18/2014CN203659839U Ic芯片散热固定结构 Ic chip cooling fixed structure
06/18/2014CN203659838U 一种用于PoP封装的散热结构 Cooling structure for a PoP package
06/18/2014CN203659837U 一种台面大功率半导体器件多层复合膜钝化结构 One kind of high-power semiconductor device mesa passivation film multilayer composite structure
06/18/2014CN203659836U 一种提高双台面可控硅器件封装结构 An enhanced dual thyristor device package mesa structure
06/18/2014CN203659835U 一种薄膜封装系统 A thin-film encapsulation system
06/18/2014CN103875071A Cooling device problem detection device and problem detection method
06/18/2014CN103875070A Electronic component package, sealing member for electronic component package, and method for manufacturing sealing member for electronic component package
06/18/2014CN103875068A Through-wafer via device and method of manufacturing the same
06/18/2014CN103875067A Method for providing a connection between metal moulded bodies and a power semi-conductor which is used to join thick wires or strips
06/18/2014CN103875065A Underfill composition
06/18/2014CN103875063A Semiconductor device, method for manufacturing same, and electronic component
06/18/2014CN103874398A Radiator
06/18/2014CN103872142A Pixel structure and manufacturing method therefor
06/18/2014CN103872123A N-channel radio frequency LDMOS (Lateral Double-diffused Metal Oxide Semiconductor field effect transistor) device and manufacturing method
06/18/2014CN103872104A TQ-126 triode
06/18/2014CN103872061A Array substrate and method of fabricating the same
06/18/2014CN103872047A Semiconductor device
06/18/2014CN103872043A Display device and manufacturing method thereof
06/18/2014CN103872039A Electrostatic discharge protection circuit and manufacturing method thereof
06/18/2014CN103872037A Systems and methods for integrating bootstrap circuit elements in power transistors and other devices
06/18/2014CN103872036A Semiconductor module and method of manufacturing the same
06/18/2014CN103872035A Satellite navigation three-dimensional chip and manufacture method thereof
06/18/2014CN103872028A Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
06/18/2014CN103872027A Stacked type power device module
06/18/2014CN103872026A Landside stiffening capacitors to enable ultrathin and other low-z products
06/18/2014CN103872025A Integrated circuit with bump connection scheme
06/18/2014CN103872024A High frequency anti-electromagnetic interference power module
06/18/2014CN103872023A Structure and method for testing performances of inter-layer dielectric layer
06/18/2014CN103872022A Alignment pattern and wafer
06/18/2014CN103872021A Semiconductor structure for WAT testing
06/18/2014CN103872020A Semiconductor Device Having an Identification Mark
06/18/2014CN103872019A Photoetching mark applied to epitaxial process and manufacturing method for photoetching mark
06/18/2014CN103872018A Test structure for integrity of MOS transistor array gate oxide layer
06/18/2014CN103872017A Test structure that can be used for PID (Plasma Induced Damage) and ILD (Inter Layer Dielectric) tests and wafer
06/18/2014CN103872016A Semiconductor testing structure, and testing method and manufacturing method thereof
06/18/2014CN103872015A Section test structure
06/18/2014CN103872014A Semiconductor devices
06/18/2014CN103872013A Power module package
06/18/2014CN103872012A Antenna Apparatus and Method
06/18/2014CN103872011A Electric programmable fuse structure
06/18/2014CN103872010A Inductor formed in substrate
06/18/2014CN103872009A Integrated circuits including integrated passive devices and methods of manufacture thereof
06/18/2014CN103872008A High frequency inductor structure having increased inductance density and quality factor
06/18/2014CN103872007A Capacitive element, capacitor array, and a/d converter
06/18/2014CN103872006A Cascode circuit
06/18/2014CN103872005A Semiconductor device and method of manufacturing the same
06/18/2014CN103872004A Chip structure and multi-chip stack package
06/18/2014CN103872003A Lug structure for improving reliability of products and preparation method thereof
06/18/2014CN103872002A Stretchable and foldable electronic devices
06/18/2014CN103872001A Active chip packaging mode
06/18/2014CN103872000A Bump structure for semiconductor package
06/18/2014CN103871999A Display device
06/18/2014CN103871998A Single Layer Coreless Substrate
06/18/2014CN103871997A Encapsulation substrate and electronic assembly body
06/18/2014CN103871996A Package structure and manufacturing method thereof
06/18/2014CN103871995A Double-base-island seven-pin structure of integrated circuit (IC) and rib cutting die
06/18/2014CN103871994A Semiconductor device and method of manufacturing the same
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