Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2014
05/21/2014CN203607393U 一种全压接式功率器件 A fully crimp power devices
05/21/2014CN203607392U 器件安装结构和集成电路模块 Device mounting structure and the integrated circuit module
05/21/2014CN203607391U 一种并联型igbt的散热结构 Thermal structure of a parallel-type igbt
05/21/2014CN203607390U 模块化封装结构 The modular package
05/21/2014CN203607389U 一种加固型芯片传导散热器 One reinforcing type chip conduction heat sink
05/21/2014CN203607388U 功率模块的散热机构 Thermal power module mechanism
05/21/2014CN203607387U 双面散热的功率模块 Double-sided cooling power module
05/21/2014CN203607386U 一种新型指纹传感器注胶封装结构 A new fingerprint sensor dispensing package structure
05/21/2014CN103814444A 高电压mosfet及其制造方法 A high voltage and a manufacturing method mosfet
05/21/2014CN103814443A 用于吸收式制冷器的倾斜监测器及压力控制器 Tilt the monitor for the absorption chiller and the pressure controller
05/21/2014CN103814442A 用于具有单金属层基底的半导体封装中的高速信号完整性的结构 Structure for a semiconductor package having a single metal layer on a substrate in the high-speed signal integrity
05/21/2014CN103814441A 用于形成复合材料的方法和散热器 A method for forming a composite material and a heat sink
05/21/2014CN103814440A 具有模制壳体的电控制器 Molding a housing having an electrical controller
05/21/2014CN103814439A 模块基板 Module substrate
05/21/2014CN103814438A 电子装置 Electronic devices
05/21/2014CN103814056A 树脂组合物 Resin composition
05/21/2014CN103813696A 一种热管式散热器及其制造方法 A heat pipe radiator and its manufacturing method
05/21/2014CN103813695A 虹吸式散热装置 Siphon cooling devices
05/21/2014CN103812522A Rf功率放大器分路器 Rf power amplifier splitter
05/21/2014CN103811553A 带有通过电阻器电路互连的有源器件和隔离结构的半导体器件和驱动电路及其制作方法 The semiconductor device and driver circuit having an active device and the isolation structure are interconnected via a resistor and its manufacturing method of the circuit
05/21/2014CN103811550A 半导体器件的接触结构 Contact structure of a semiconductor device
05/21/2014CN103811499A 薄膜晶体管阵列面板及其制造方法 The thin film transistor array panel and a manufacturing method
05/21/2014CN103811485A Esd保护电路 Esd protection circuit
05/21/2014CN103811480A 具有感应装置的载板封装结构及制作方法 Carrier package structure and method of preparing a sensor device
05/21/2014CN103811476A 半导体器件 Semiconductor devices
05/21/2014CN103811474A 半导体器件、半导体器件的制造方法及天线开关模块 The method of manufacturing a semiconductor device, the semiconductor device and the antenna switch module
05/21/2014CN103811473A 一种多层膜结构的多源调控的阻变存储器及其制备方法 Multi-source regulation of a multilayer film structure resistance change memory and its preparation method
05/21/2014CN103811472A 半导体封装件和制造半导体封装件的方法 The method of manufacturing a semiconductor package and a semiconductor package
05/21/2014CN103811471A 保护环结构及其制造方法 Guard ring structure and manufacturing method
05/21/2014CN103811470A 电路模块 Circuit module
05/21/2014CN103811469A 测试结构和测试方法 Test structures and test methods
05/21/2014CN103811468A 一种可寻址测试芯片及其测试方法 , An addressable test chip and test methods
05/21/2014CN103811467A 电迁移测试结构及测试方法 Electromigration test structure and test methods
05/21/2014CN103811466A Goi_tddb测试电路结构 Goi_tddb test circuit structure
05/21/2014CN103811465A 封装结构和其制作方法 Package structure and its manufacturing method
05/21/2014CN103811464A 铜互连结构及其制造方法 Copper interconnect structure and manufacturing method
05/21/2014CN103811463A 用于decap的埋入式tsv The submerged tsv for decap
05/21/2014CN103811462A 用于中介层的去耦电容器 For mediating layer decoupling capacitor
05/21/2014CN103811461A 内连线结构和其制作方法 Interconnection structure and its manufacturing method
05/21/2014CN103811460A 包括具有集成电路后端电容器及集成电路后端薄膜电阻器的半导体结构的电子装置及其制造方法 Includes a method of manufacturing an electronic device and an integrated circuit capacitor and a rear end of the rear end of the thin film resistors integrated semiconductor structure
05/21/2014CN103811459A 达到较精细设计规则和经增加的封装共面性的衬底积层 Achieve finer design rules and by increasing the package substrate coplanarity laminated
05/21/2014CN103811458A 切割具有硅穿通道的半导体晶圆的方法及其所形成的结构 The method of cutting a silicon semiconductor wafer through the channels formed by its structure
05/21/2014CN103811457A 多芯片sop封装结构 Multi-chip package structure sop
05/21/2014CN103811456A 多芯片dip封装结构 Multi-chip package structure dip
05/21/2014CN103811455A 利用引线框架对磁耦合通信链路的噪声消除 Using the lead frame of the noise elimination of the magnetic coupling of the communication link
05/21/2014CN103811454A 使用引线框架的磁耦合电流隔离式通信 Use leadframe magnetic coupling galvanically isolated communication
05/21/2014CN103811453A 扁平包装无铅微电子封装上的可湿性引线端 Wettable lead end flat on the package lead-free microelectronic packages
05/21/2014CN103811452A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811451A 芯片级封装结构 Chip scale package structure
05/21/2014CN103811450A 具有交错的焊盘线结构的半导体器件 A semiconductor device having a staggered configuration of pad lines
05/21/2014CN103811449A 焊球凸块结构及其形成方法 Solder bump structure and method of forming
05/21/2014CN103811448A 弯曲轮廓的堆叠封装件接头 The curved profile of the stacked package header
05/21/2014CN103811447A 焊料、接点结构及接点结构的制作方法 Production methods solder joint structure and contact structure
05/21/2014CN103811446A 一种半导体器件中的铜线键接结构及其制造方法 A semiconductor device bonded to the copper structure and manufacturing method
05/21/2014CN103811445A 一种通过贴片工艺生产智能卡用的晶圆 A method of producing a wafer by using a smart card chip technology
05/21/2014CN103811444A 电子装置、系统级封装模块及系统级封装模块的制造方法 The method of manufacturing an electronic device, the system-level and system-level encapsulation module package module
05/21/2014CN103811443A 一种多元胞大功率晶闸管铝垫片结构及晶闸管 A poly-cell power thyristor thyristor structure and aluminum spacer
05/21/2014CN103811442A 基板的连接结构及其制法 Jiqizhifa board connecting structure
05/21/2014CN103811441A 平板型压接igbt模块用接触式电极结构 Flat type crimp igbt module contact electrode structure
05/21/2014CN103811440A 半导体装置及其形成方法、半导体电路及其使用方法 Semiconductor device and method of forming a semiconductor circuit and method of use
05/21/2014CN103811439A 一种多元胞大功率晶闸管控制极引线结构及晶闸管 A poly-cell power thyristor structure and thyristor control electrode lead
05/21/2014CN103811438A 信号传输装置 Signal transmitting means
05/21/2014CN103811437A 有直接接触散热片的微电子封装及其制造方法 Direct contact with the heat sink and method for manufacturing a microelectronic package
05/21/2014CN103811436A 改进堆叠式封装结构中的逻辑芯片的热性能 To improve the thermal performance of the stacked package in logic chips
05/21/2014CN103811435A 一种可插拔热源的散热器 One kind of heat radiator pluggable
05/21/2014CN103811434A 一种ltcc无引线封装 One kind ltcc leadless package
05/21/2014CN103811433A 一种表面安装封装件 A surface mount package
05/21/2014CN103811432A 环境敏感电子元件封装体 Environmental sensitive electronic element package
05/21/2014CN103811431A 开放阻焊层和或电介质 Or open solder resist layer and the dielectric
05/21/2014CN103811430A 层叠封装结构及其形成方法 Laminated packaging structure and method of forming
05/21/2014CN103811429A 封装组件中的应力消除结构 Stress relief package assembly structure
05/21/2014CN103811428A 用于具有保护环的倒装芯片衬底的方法和装置 Methods and apparatus for flip-chip substrate having a protective ring
05/21/2014CN103811427A 一种影像感测器 An image sensor
05/21/2014CN103811426A 用于固定半导体封装件的承载件与半导体封装件的制法 For fixing the carrier of the semiconductor package and the semiconductor package manufacturing method
05/21/2014CN103811425A 一种可以防止光透射的晶闸管封装壳及晶闸管 A way to prevent the light transmittance of the enclosure and the thyristor SCR
05/21/2014CN103811424A 全压接封装高压半导体器件 Full-voltage semiconductor device package crimp
05/21/2014CN103811415A 具有改进的形貌控制的衬底通孔形成 With improved control of the morphology of the substrate through holes formed
05/21/2014CN103811414A 铜蚀刻集成方法 Copper etching integrated approach
05/21/2014CN103811362A 层叠封装结构及其制作方法 Stacked package structure and production methods
05/21/2014CN103811355A 用于叠层封装器件的模制底部填充物 Molding the bottom of the stacked package of the device for the filler
05/21/2014CN103811328A 防止多层外延生长时背面形成多晶颗粒的方法及背封结构 Method of preventing the formation of polycrystalline particles back of multilayer epitaxial growth and dorsal closure structure
05/21/2014CN103811310A 电阻结构及其形成方法 Resistance structure and method of forming
05/21/2014CN103811309A 半导体结构及其形成方法 And a method for forming a semiconductor structure
05/21/2014CN103811308A 电感的形成方法 The method of forming an inductor
05/21/2014CN103811307A 半导体器件及其形成方法 Semiconductor device and method of forming
05/21/2014CN103811299A 电容结构及其制造过程 Capacitor structure and the manufacturing process
05/21/2014CN103809314A 柔性电路板、半导体封装件及制造柔性电路板的方法 A flexible circuit board, a semiconductor package and method for manufacturing the flexible circuit board
05/21/2014CN103809103A 一种芯片失效点定位方法 A chip failure point positioning
05/21/2014CN103805081A 各向异性导电膜和半导体装置 The anisotropic conductive film and a semiconductor device
05/21/2014CN102569214B 三维系统级封装堆栈式封装结构 Three-dimensional system-in-package stack package structure
05/21/2014CN102569101B 无外引脚封装结构及其制作方法 No external pin package structure and production methods
05/21/2014CN102509723B 覆晶薄膜的面板结构 Panel structure of COF
05/21/2014CN102456540B 应用于外延工艺中的光刻套刻标记的制备方法 Applied to the preparation of the epitaxial process lithography overlay mark
05/21/2014CN102315184B 半导体器件 Semiconductor devices
05/21/2014CN102272920B 包括低应力配置的半导体管芯封装 Including a low stress configuration of a semiconductor die package
05/21/2014CN102132362B 电感器结构 Inductor structure
05/21/2014CN102044526B 一种电迁移监控结构 An electrical migration monitoring structure
05/21/2014CN101826716B 设有势垒齐纳二极管的低压瞬时电压抑制器 Zener diode has a barrier of low pressure transient voltage suppressor
05/21/2014CN101677072B 封装电子装置的方法 The method of encapsulating electronic devices
05/21/2014CN101546744B 用于半导体封装的导线架 A lead frame for a semiconductor package
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