Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/26/2014US20140175662 Power layout for integrated circuits
06/26/2014US20140175661 Semiconductor Device and Method of Making Bumpless Flipchip Interconnect Structures
06/26/2014US20140175660 Stack packages having token ring loops
06/26/2014US20140175659 Semiconductor device including air gaps and method of fabricating the same
06/26/2014US20140175658 Anchoring a trace on a substrate to reduce peeling of the trace
06/26/2014US20140175657 Methods to improve laser mark contrast on die backside film in embedded die packages
06/26/2014US20140175656 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures
06/26/2014US20140175655 Chip bonding structure and manufacturing method thereof
06/26/2014US20140175654 Surface modified tsv structure and methods thereof
06/26/2014US20140175653 Semiconductor devices comprising interconnect structures and methods of fabrication
06/26/2014US20140175652 Barrier for Through-Silicon Via
06/26/2014US20140175651 Landing structure for through-silicon via
06/26/2014US20140175650 Interconnection wires of semiconductor devices
06/26/2014US20140175649 Electronic device including electrically conductive vias having different cross-sectional areas and related methods
06/26/2014US20140175648 Semiconductor Device and Power Supply Unit Utilizing the Same
06/26/2014US20140175647 Packaged microelectronic elements having blind vias for heat dissipation
06/26/2014US20140175646 Package structure and method for manufacturing same
06/26/2014US20140175645 Semiconductor device and method for manufacturing the same
06/26/2014US20140175644 Methods of forming ultra thin package structures including low temperature solder and structures formed therby
06/26/2014US20140175643 Apparatuses and methods to enhance passivation and ild reliability
06/26/2014US20140175642 Semiconductor Device and Method of Forming Interconnect Structure with Conductive Pads Having Expanded Interconnect Surface Area for Enhanced Interconnection Properties
06/26/2014US20140175641 Method for Welding Gold-Silicon Eutectic Chip, and Transistor
06/26/2014US20140175640 Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form
06/26/2014US20140175639 Semiconductor Device and Method of Simultaneous Molding and Thermalcompression Bonding
06/26/2014US20140175638 Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same
06/26/2014US20140175637 Back-to-back stacked integrated circuit assembly and method of making
06/26/2014US20140175636 High density interconnect device and method
06/26/2014US20140175635 Packaging structure
06/26/2014US20140175634 Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby
06/26/2014US20140175633 Thermally enhanced semiconductor assembly with embedded chip and interposer and method of manufacturing the same
06/26/2014US20140175632 Three-dimensional integrated circuit
06/26/2014US20140175631 Semiconductor module having sliding case and manufacturing method thereof
06/26/2014US20140175630 Semiconductor Package with Multiple Conductive Clips
06/26/2014US20140175629 Apparatus and methods for reducing impact of high rf loss plating
06/26/2014US20140175628 Copper wire bonding structure in semiconductor device and fabrication method thereof
06/26/2014US20140175627 Lead frame having a perimeter recess within periphery of component terminal
06/26/2014US20140175626 Integrated circuit package and method of manufacture
06/26/2014US20140175625 Semiconductor device including at least one element
06/26/2014US20140175624 Method for manufacturing a chip arrangement, and chip arrangement
06/26/2014US20140175623 Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die
06/26/2014US20140175622 Segmented conductive top layer for radio frequency isolation
06/26/2014US20140175621 Systems and methods for providing intramodule radio frequency isolation
06/26/2014US20140175619 Stripline and reference plane implementation for interposers using an implant layer
06/26/2014US20140175615 Semiconductor device and method for manufacturing the same
06/26/2014US20140175614 Wafer stacking structure and method of manufacturing the same
06/26/2014US20140175613 Chip Positioning in Multi-Chip Package
06/26/2014US20140175611 Electrostatic discharge (esd) clamp
06/26/2014US20140175607 Semiconductor device integrating passive elements
06/26/2014US20140175605 Semiconductor chip and semiconductor apparatus with embedded capacitor
06/26/2014US20140175601 Anti-fuse structure and anti-fuse programming method
06/26/2014US20140175594 Active pad patterns for gate alignment marks
06/26/2014US20140175573 Soi wafer, manufacturing method therefor, and mems device
06/26/2014US20140175541 Manufacturing of electronic devices in a wafer of semiconductor material having trenches with different directions
06/26/2014US20140175477 Edge coupling alignment using embedded features
06/26/2014US20140175444 Semiconductor Device and Manufacturing Method Thereof
06/26/2014US20140175422 Deposition of Rutile Films with Very High Dielectric Constant
06/26/2014US20140175405 Electronic device package structure and manufacturing method thereof
06/26/2014US20140175333 Curable composition
06/26/2014US20140175159 Thermocompression Bonding Method And Apparatus For Mounting Semiconductor Chips On A Substrate
06/26/2014US20140174627 Multiple bonding layers for thin-wafer handling
06/26/2014DE112012004185T5 Leistungsmanagements-Anwendungen von Zwischenverbindungssubstraten Performance management applications of interconnect substrates
06/26/2014DE112012004136T5 Kühleinheit Cooling unit
06/26/2014DE112007001424B4 Kühler Cooler
06/26/2014DE102013222052A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
06/26/2014DE102013114594A1 Paketstrukturen umfassend auf einem Bauelement angebrachte diskrete Antennen Packet structures comprising on a device attached discrete antennas
06/26/2014DE102013114472A1 Verfahren zur Herstellung einer Chipanordnung und Chipanordnung Method of manufacturing a chip layout and chip assembly
06/26/2014DE102013114410A1 Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
06/26/2014DE102013114026A1 Organische Leuchtdioden-Anzeigevorrichtung und Verfahren zur Herstellung derselben Organic light emitting display device and method of manufacturing the same
06/26/2014DE102013113909A1 Sensormodul und Batterieelemente Sensor module and battery elements
06/26/2014DE102013113777A1 Protection device i.e. signal input/output protection device, for e.g. interface pins for system-on-chip application, has diffusion regions, semiconductor regions designed as thyristor and operated in electrical path between nodes
06/26/2014DE102013113423A1 Mixed-signal integrated circuit for e.g. digital camera, for automotive application, has PNP bipolar transistor including emitter connected to signal pin, where another PNP and NPN transistor operate as thyristor structure
06/26/2014DE102013104522B3 Power semiconductor module for arrangement with capacitor, has contact devices at longitudinal side of adjacent sub-units arranged mirror-symmetrically to one another
06/26/2014DE102013020811A1 Aufnahme von überschüssigem Unterfüllungs-Fluss mit einem Lot-Graben Absorbing excess underfill flow with a solder trench
06/26/2014DE102013018140A1 Chip mit Gehäuse unter Verwendung eines Zwischenelementesubstrats mit durch Silizium hindurchgehende Durchführungen Chip with casing using a substrate with intermediate elements passing through silicon feedthroughs
06/26/2014DE102012223982A1 Verfahren zum Herstellen einer elektronischen Baugruppe A method of manufacturing an electronic assembly
06/26/2014DE102012113018A1 Verfahren zur Herstellung eines Mehrschichtträgerkörpers A process for producing a multi-layer support body
06/26/2014DE102012113014A1 Bauelementträger und Bauelementträgeranordnung Component carrier and the component carrier assembly
06/26/2014DE102012112738A1 Elektronikmodul mit einer mit Kunststoff umhüllten elektronische Schaltung und Verfahren zu dessen Herstellung Electronic module having an electronic circuit wrapped with plastic and process for its preparation
06/26/2014DE102012025433A1 Method for measuring sub millimeter wave semiconductor circuits in semiconductor module, involves completely covering thermal conductive plate on top surface of semiconductor component, which is made from dielectric material
06/26/2014DE102006017042B4 Zuleitungsrahmen für ein Halbleiterbauteil A lead frame for a semiconductor device
06/26/2014DE102006002452B4 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
06/26/2014DE102005025452B4 Verfahren zur Herstellung einer Halbleitervorrichtung mit einer Durchgangselektrode A method of manufacturing a semiconductor device having a through electrode
06/25/2014EP2747144A1 Gate leakage of GaN HEMTs and GaN diodes
06/25/2014EP2747143A1 GaN HEMTs and GaN diodes
06/25/2014EP2747137A1 Semiconductor module
06/25/2014EP2747136A1 High density organic bridge device and method
06/25/2014EP2747134A1 Amplifier device
06/25/2014EP2747133A2 Power module package with cooling fluid reservoir
06/25/2014EP2747132A1 A method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package
06/25/2014EP2746287A1 Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device including the quaternary phosphonium salt and semiconductor device encapsulated with the epoxy resin composition
06/25/2014EP2745361A1 Semiconductor laser mounting with intact diffusion barrier layer
06/25/2014EP2745319A1 Semiconductor package
06/25/2014EP2745318A1 Multi-chip package and interposer with signal line compression
06/25/2014EP2745317A1 Offset interposers for large-bottom packages and large-die package-on-package structures
06/25/2014EP2745316A1 Mixing manifold and method
06/25/2014EP2745315A1 Through-wafer via device and method of manufacturing the same
06/25/2014CN203674966U 一种氙气灯电源 One kind of xenon lamp power supply
06/25/2014CN203674217U 一种晶闸管芯片 Thyristor chips
06/25/2014CN203674207U 晶闸管焊压接组件 Thyristor welding crimp assembly
06/25/2014CN203674206U 晶圆级封装结构和指纹识别装置 Wafer-level packaging structure and fingerprint recognition device
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