Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2014
05/14/2014CN103797577A 模块制造方法及端子集合体 Module manufacturing method and terminal assembly
05/14/2014CN103797576A 在存储装置上形成彩色图像的方法以及由此形成的存储装置 The method of forming a color image on a storage device and the storage device thus formed
05/14/2014CN103797575A 制造包括封装的支持结构内的嵌入式电路组件的半导体封装 Manufacturing includes embedded circuit components encapsulated within the support structure of a semiconductor package
05/14/2014CN103797574A 封装中的存储器模块 The memory module in the package
05/14/2014CN103797569A 金属凸块的焊料沉积系统和方法 Solder deposition system and method for metal bump
05/14/2014CN103796423A 具有减少的电磁辐射的发射的印刷电路板 Having a reduced emission of electromagnetic radiation of the printed circuit board
05/14/2014CN103795384A 开关电路封装模块 Switching circuit encapsulation module
05/14/2014CN103795026A 输入级esd保护电路 Esd protection circuit input stage
05/14/2014CN103794604A 一体式功率半导体模块 Integrated power semiconductor module
05/14/2014CN103794599A 半导体装置 Semiconductor device
05/14/2014CN103794598A 硅通孔测试版图、测试结构、制备方法及量测方法 TSV test layout, test structure, preparation and measurement methods
05/14/2014CN103794597A 可选择连接或断开待测目标芯片的测试方法 May choose to connect or disconnect the target chip testing methods tested
05/14/2014CN103794596A 标准晶片及其制造方法 Standard wafer and manufacturing method thereof
05/14/2014CN103794595A Pop封装结构及其封装方法 Pop package and packaging method
05/14/2014CN103794594A 半导体封装件 The semiconductor package
05/14/2014CN103794593A 功率mos晶体管阵列 Power mos transistor array
05/14/2014CN103794592A 具有接地屏蔽结构的半导体器件 The semiconductor device having a ground shield structure
05/14/2014CN103794591A 半导体器件 Semiconductor devices
05/14/2014CN103794590A 功率模块封装 Power Module Package
05/14/2014CN103794589A 半导体元件结构 Semiconductor device structures
05/14/2014CN103794588A 一种集成电路芯片和显示装置 An integrated circuit chip and the display device
05/14/2014CN103794587A 一种高散热芯片嵌入式重布线封装结构及其制作方法 A high-heat-chip embedded rewiring package structure and production methods
05/14/2014CN103794586A 短的和低的回路丝线键合 Short circuit and a low bonding wires
05/14/2014CN103794585A 半导体功率转换器及其制造方法 The semiconductor power converter and manufacturing method
05/14/2014CN103794584A 用于半导体晶圆的混合接合机制 For mixing the bonding mechanism of a semiconductor wafer
05/14/2014CN103794583A 一种增强焊球与ubm粘附性的方法及封装结构 A method of enhancing the adhesion of the solder ball and ubm package structure
05/14/2014CN103794582A 半导体装置 Semiconductor device
05/14/2014CN103794581A 一种热电散热装置 A thermoelectric cooling devices
05/14/2014CN103794580A 一种绝缘互联散热板及功率模块 An insulated heat sink plate and power module interconnection
05/14/2014CN103794579A 一种散热器 Radiator
05/14/2014CN103794578A 一种高频大功率碳化硅mosfet模块 A high-frequency power SiC mosfet module
05/14/2014CN103794577A 一种基于半导体基板的3d封装装置及其工艺方法 3d A process for encapsulating a semiconductor device and a substrate based on
05/14/2014CN103794576A 一种封装结构及封装方法 A packaged structure and encapsulation method
05/14/2014CN103794575A 一种封装结构及封装方法 A packaged structure and encapsulation method
05/14/2014CN103794574A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/14/2014CN103794573A 电子封装模块及其制造方法 Electronic package module and a manufacturing method
05/14/2014CN103794572A 模塑封装及其制造方法 Package and method of manufacturing the molded
05/14/2014CN103794571A 一种功率半导体用新型金属-陶瓷绝缘基板 A power semiconductor with new metal - ceramic insulating substrate
05/14/2014CN103794570A 芯片封装结构及封装用线路板制造方法 Chip package structure and encapsulation circuit board manufacturing method
05/14/2014CN103794569A 封装结构及其制法 Package structure Jiqizhifa
05/14/2014CN103794568A 集成电路底部填充方案 IC bottom padding scheme
05/14/2014CN103794567A 部分镂空基板的模块结构 Part of the modular structure of hollow board
05/14/2014CN103794553A 用于在衬底中制造电覆镀通孔的方法以及具有电覆镀通孔的衬底 The method of manufacturing an electrical substrate in the substrate for plating through holes, and having an electric plating through hole
05/14/2014CN103794518A 半导体装置的制造方法、半导体装置 The method of manufacturing a semiconductor device, a semiconductor device
05/14/2014CN103794515A 芯片封装基板和结构及其制作方法 Chip package substrate and the structure and production methods
05/14/2014CN103792748A 阵列基板、阵列基板的制备方法和显示装置 An array substrate, a method for preparing the array substrate and a display device
05/14/2014CN103792744A 存储电容、像素单元及存储电容的制造方法 A storage capacitor, a pixel unit and a method of manufacturing a storage capacitor
05/14/2014CN103789568A 一种合金键合丝及其制备方法及应用 An alloy bonding wire and its preparation method and application
05/14/2014CN103050469B 无外引脚半导体封装构造的导线架条 No external pin semiconductor package lead frame strip
05/14/2014CN102543844B 一种制造半导体器件结构的方法和半导体器件结构 A method of manufacturing a semiconductor device structure and a semiconductor device structure
05/14/2014CN102420206B 先镀后刻四面无引脚封装结构及其制造方法 Carved four leadless package structure and method of manufacturing after the first plating
05/14/2014CN102332441B 一种高线位封装形式的引线框及其封装结构 A high-wire bit package leadframe and package structure
05/14/2014CN102324417B 半导体装置用基板、半导体装置及它们的制造方法 The semiconductor device substrate, a semiconductor device and manufacturing method thereof
05/14/2014CN102315182B 半导体芯片及其制造方法 The method of manufacturing a semiconductor chip and
05/14/2014CN102299100B 接触孔的制作方法 The method of making a contact hole
05/14/2014CN102254899B 具有对准标记的半导体结构及其形成方法 The semiconductor structure and method of forming an alignment mark
05/14/2014CN102214617B 半导体封装基板 The semiconductor package substrate
05/14/2014CN102148216B 用于互连工艺的半导体结构及其制造方法 Semiconductor structure and method of manufacturing processes for interconnection
05/14/2014CN102101910B 聚合物及其制造方法,以及包括其的光学元件及光电装置 Polymers and their manufacturing method, and an optical element including a photovoltaic device, and
05/14/2014CN102097410B 具有增进焊接强度的镀层的导线结构 Welded wire structure having a strength enhancing coating
05/14/2014CN101740605B 有源矩阵有机发光二极管像素结构及其制造方法 The active matrix organic light emitting diode pixel structure and its manufacturing method
05/14/2014CN101719493B 显示装置 The display device
05/14/2014CN101714546B 显示装置及其制造方法 Display device and method of manufacturing
05/14/2014CN101610664B 液体冷却器及其制造方法 Liquid coolers and its manufacturing method
05/14/2014CN101580629B 制造半导体元件封装用树脂组合物的方法 Producing a resin composition for encapsulating a semiconductor element
05/14/2014CN101114628B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/13/2014US8725458 Heat sink blockage detector
05/13/2014US8724393 Thermally assisted flash memory with diode strapping
05/13/2014US8724365 Programmable semiconductor device
05/13/2014US8724339 Compact media player
05/13/2014US8724324 Rotating rectifier
05/13/2014US8723341 Alignment mark and method of manufacturing the same
05/13/2014US8723340 Process for the production of solar cells comprising a selective emitter
05/13/2014US8723339 Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus
05/13/2014US8723338 Integrated circuit packaging system with array contacts and method of manufacture thereof
05/13/2014US8723337 Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate
05/13/2014US8723334 Semiconductor device including semiconductor package
05/13/2014US8723333 Semiconductor package including multiple chips and separate groups of leads
05/13/2014US8723332 Electrically interconnected stacked die assemblies
05/13/2014US8723331 Semiconductor device
05/13/2014US8723329 In-package fly-by signaling
05/13/2014US8723328 Multilayer wiring substrate and method of manufacturing the same
05/13/2014US8723327 Microelectronic package with stacked microelectronic units and method for manufacture thereof
05/13/2014US8723326 Semiconductor structures including tight pitch contacts
05/13/2014US8723325 Structure and method of forming a pad structure having enhanced reliability
05/13/2014US8723324 Integrated circuit packaging system with pad connection and method of manufacture thereof
05/13/2014US8723323 Method for fabricating solder columns for a column grid array package
05/13/2014US8723322 Method of metal sputtering for integrated circuit metal routing
05/13/2014US8723321 Copper interconnects with improved electromigration lifetime
05/13/2014US8723320 Power module and manufacturing method thereof
05/13/2014US8723319 BGA package structure and method for fabricating the same
05/13/2014US8723318 Microelectronic packages with dual or multiple-etched flip-chip connectors
05/13/2014US8723317 Trench metal oxide semiconductor field effect transistor with embedded schottky rectifier using reduced masks process
05/13/2014US8723316 Chip package structure using flexible substrate
05/13/2014US8723315 Flip chip package
05/13/2014US8723314 Semiconductor workpiece with backside metallization and methods of dicing the same
05/13/2014US8723312 Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element
05/13/2014US8723311 Half-bridge electronic device with common heat sink on mounting surface
05/13/2014US8723310 Integrated circuit packaging system having warpage prevention structures
05/13/2014US8723309 Integrated circuit packaging system with through silicon via and method of manufacture thereof
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