| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/25/2014 | CN103881022A 用于封装的组合物和包括该组合物的封装的设备 The composition and the package for the composition comprising the encapsulated device |
| 06/25/2014 | CN102853701B 一种环路热管用蒸发器及其应用 One kind of loop heat pipe evaporator and Its Applications |
| 06/25/2014 | CN102842564B 集成开关电源的倒装封装装置及其倒装封装方法 Flip-flip-packaged device and method of packaging an integrated switching power supply |
| 06/25/2014 | CN102569272B 一种基板的多层隔片式ic芯片堆叠封装件及其生产方法 A multilayer board spacer type ic chip stack package and its production method |
| 06/25/2014 | CN102508369B 用于液晶面板的软板上芯片构造 Soft chip on board configuration for a liquid crystal panel |
| 06/25/2014 | CN102446811B 金属互连结构及金属层间通孔和互连金属线的形成方法 Between the metal interconnect structure and method of forming the metal layer vias and interconnect metal lines |
| 06/25/2014 | CN102428558B 半导体装置 Semiconductor device |
| 06/25/2014 | CN102414806B 管芯连接监控系统及方法 Die attach monitoring system and method |
| 06/25/2014 | CN102386156B 晶片封装体 Chip package |
| 06/25/2014 | CN102270585B 电路板结构、封装结构与制作电路板的方法 Circuit board structure, package structure and method of making the circuit board |
| 06/25/2014 | CN102163594B 树脂密封型电子控制装置及其制造方法 Apparatus and method for manufacturing a resin sealed type electronic control |
| 06/25/2014 | CN102163591B 一种球型光栅阵列ic芯片封装件及其生产方法 One kind of ball-type grating array ic chip package and production method |
| 06/25/2014 | CN102163581B 半导体模块 Semiconductor Modules |
| 06/25/2014 | CN102163564B 接合结构体及接合结构体的制造方法 Manufacturing method of a structure body, and the engagement structure engaging |
| 06/25/2014 | CN102052577B 发光二极管照明装置 LED illumination apparatus |
| 06/25/2014 | CN101960706B 半导体装置及使用半导体装置的电力变换装置 A semiconductor device and a semiconductor device using a power conversion device |
| 06/25/2014 | CN101776248B 灯具及其照明装置 Lamps and lighting equipment |
| 06/25/2014 | CN101714562B 半导体晶片 Semiconductor wafer |
| 06/25/2014 | CN101689540B 制造集成电路的方法 The method of manufacturing an integrated circuit |
| 06/25/2014 | CN101679601B 含磷环氧树脂、以该环氧树脂作为必须成分的环氧树脂组合物及其固化物 Phosphorus-containing epoxy resin, an epoxy resin as an essential component in the epoxy resin composition and cured product |
| 06/25/2014 | CN101673679B 薄型半导体晶片和减薄半导体晶片的方法 The method of thinning a semiconductor wafer and a thin semiconductor wafer |
| 06/25/2014 | CN101393888B 栈式1T-n存储单元结构 Stacker 1T-n memory cell structure |
| 06/25/2014 | CN101365328B 热沉和具有热沉的半导体器件 Heat sink and semiconductor device having a heat sink |
| 06/25/2014 | CN101248154B 热界面材料及方法 Thermal interface material and method |
| 06/25/2014 | CN101009310B 有机发光显示器及其制造方法 The organic light emitting display and a method of manufacturing |
| 06/24/2014 | US8761842 Encapsulated integrated-circuit device with thin-film battery |
| 06/24/2014 | US8760904 One-Time Programmable memories using junction diodes as program selectors |
| 06/24/2014 | US8759989 Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each |
| 06/24/2014 | US8759988 Method for producing semiconductor components, and corresponding semiconductor component |
| 06/24/2014 | US8759987 Semiconductor device and method of manufacturing the semiconductor device |
| 06/24/2014 | US8759985 Methods for multi-wire routing and apparatus implementing same |
| 06/24/2014 | US8759984 Semiconductor memory device |
| 06/24/2014 | US8759982 Deskewed multi-die packages |
| 06/24/2014 | US8759981 Method for the production of a fixed connection between two layers of a multilayer system, and multilayer system |
| 06/24/2014 | US8759979 Semiconductor memory device having dummy conductive patterns on interconnection |
| 06/24/2014 | US8759978 Chip-on-lead package and method of forming |
| 06/24/2014 | US8759977 Elongated via structures |
| 06/24/2014 | US8759976 Structure with sub-lithographic random conductors as a physical unclonable function |
| 06/24/2014 | US8759975 Approach for reducing copper line resistivity |
| 06/24/2014 | US8759974 Solder joints with enhanced electromigration resistance |
| 06/24/2014 | US8759973 Microelectronic assemblies having compliancy and methods therefor |
| 06/24/2014 | US8759972 Semiconductor device and method of forming composite bump-on-lead interconnection |
| 06/24/2014 | US8759971 Semiconductor apparatus |
| 06/24/2014 | US8759970 Semiconductor device having copper interconnect for bonding |
| 06/24/2014 | US8759969 Integrated circuit dice with edge finishing |
| 06/24/2014 | US8759968 Semiconductor memory apparatus for controlling pads and multi-chip package having the same |
| 06/24/2014 | US8759967 Semiconductor package and package on package having the same |
| 06/24/2014 | US8759965 Modular low stress package technology |
| 06/24/2014 | US8759963 Underfill material dispensing for stacked semiconductor chips |
| 06/24/2014 | US8759962 Semiconductor chip device with solder diffusion protection |
| 06/24/2014 | US8759961 Underfill material dispensing for stacked semiconductor chips |
| 06/24/2014 | US8759960 Semiconductor device comprising a stacked die configuration including an integrated Peltier element |
| 06/24/2014 | US8759959 Stacked semiconductor packages |
| 06/24/2014 | US8759958 Semiconductor package and method of manufacturing the same |
| 06/24/2014 | US8759957 Film for use in manufacturing semiconductor device, method for producing semiconductor device and semiconductor device |
| 06/24/2014 | US8759956 Chip package and method of manufacturing the same |
| 06/24/2014 | US8759955 Semiconductor device with chips on isolated mount regions |
| 06/24/2014 | US8759954 Integrated circuit package system with offset stacked die |
| 06/24/2014 | US8759953 Electronic component including a shielding metal film disposed on a resin layer |
| 06/24/2014 | US8759952 Oxygen-rich layers underlying BPSG |
| 06/24/2014 | US8759949 Wafer backside structures having copper pillars |
| 06/24/2014 | US8759948 Laser beam machining method and semiconductor chip |
| 06/24/2014 | US8759946 Semiconductor device |
| 06/24/2014 | US8759945 Fuse structures, e-fuses comprising fuse structures, and semiconductor devices comprising e-fuses |
| 06/24/2014 | US8759938 Semiconductor device |
| 06/24/2014 | US8759914 Deep sub-micron interconnection circuitry with shielded layer structure |
| 06/24/2014 | US8759883 Semiconductor integrated circuit |
| 06/24/2014 | US8759849 Driving substrate and display device |
| 06/24/2014 | US8759838 Package and fabrication method of the same |
| 06/24/2014 | US8759468 Silicone resin with improved barrier properties |
| 06/24/2014 | US8759234 Deposited material and method of formation |
| 06/24/2014 | US8759192 Semiconductor device having wiring and capacitor made by damascene method and its manufacture |
| 06/24/2014 | US8759157 Heat dissipation methods and structures for semiconductor device |
| 06/24/2014 | US8759153 Method for making a sensor device using a graphene layer |
| 06/24/2014 | US8759134 Gallium-nitride-on-diamond wafers and devices, and methods of manufacture |
| 06/24/2014 | US8759119 Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state |
| 06/24/2014 | US8759118 Plating process and structure |
| 06/20/2014 | DE202014003040U1 Verbindungsstruktur eines Kühlmoduls Connection structure of a cooling module |
| 06/19/2014 | WO2014093317A1 High performance package on package |
| 06/19/2014 | WO2014093035A1 Methods and apparatus for conformal shielding |
| 06/19/2014 | WO2014092881A1 Active cooling device |
| 06/19/2014 | WO2014092655A1 Advanced heat exchanger with integrated coolant fluid flow deflector |
| 06/19/2014 | WO2014092642A1 Thermal head for device under test and method for controlling the temperature of device under test |
| 06/19/2014 | WO2014092314A1 Encapsulation composition and encapsulated device comprising same |
| 06/19/2014 | WO2014092253A1 Photocurable composition, barrier layer including same, and encapsulated device including same |
| 06/19/2014 | WO2014092248A1 Memory card systems comprising flexible integrated circuit element packages, and methods for manufacturing said memory card systems |
| 06/19/2014 | WO2014092196A1 High-refractive index heat-conductive composition of exceptional transparence, heat-conductive grease comprising same, cured heat-conductive material, thermal-softening heat-conductive composition, and applications for same |
| 06/19/2014 | WO2014092176A1 Cooling apparatus |
| 06/19/2014 | WO2014092089A1 Power semiconductor device, rectifier device, and power source device |
| 06/19/2014 | WO2014092013A1 Sealing material, substrate having sealing material layer, layered body, and electronic device |
| 06/19/2014 | WO2014091959A1 Semiconductor device and production method therefor |
| 06/19/2014 | WO2014091714A1 Magnetic sensor and magnetic sensor device, and magnetic sensor manufacturing method |
| 06/19/2014 | WO2014091608A1 Power semiconductor module and power conversion apparatus using same |
| 06/19/2014 | WO2014091197A1 Manufacturing method |
| 06/19/2014 | WO2014090681A1 Semiconductor device with integrated hot plate and recessed substrate and method of production |
| 06/19/2014 | WO2014090442A1 Method for producing a switching module and an associated grid module, and an associated grid module and corresponding electronic subassembly |
| 06/19/2014 | WO2014089825A1 Semiconductor device and manufacturing method thereof |
| 06/19/2014 | WO2014089814A1 Semiconductor device and manufacturing method thereof |
| 06/19/2014 | WO2014066153A4 Multiple die stacking for two or more die |
| 06/19/2014 | US20140171822 Wafer-scale package including power source |