Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/18/2014CN103871993A Semiconductor device and manufacturing method of the same
06/18/2014CN103871992A Method and apparatus for manufacturing chip package
06/18/2014CN103871991A Methods and Apparatus for Package with Interposers
06/18/2014CN103871990A Package structure and package method
06/18/2014CN103871989A Semiconductor device
06/18/2014CN103871988A Annular coherent and bridge layout structures and verification method for wire open circuit and short circuit
06/18/2014CN103871987A Power module package
06/18/2014CN103871986A Insulation spacer with T-shaped hole and assembly structure of high-power IGBT (Insulated Gate Bipolar Transistor)
06/18/2014CN103871985A Semiconductor packaging structure
06/18/2014CN103871984A Cooling apparatus
06/18/2014CN103871983A Heat radiating device of power device
06/18/2014CN103871982A Chip thermal dissipation structure
06/18/2014CN103871981A Low-profile chip package with modified heat spreader
06/18/2014CN103871980A Semiconductor package and method for routing the package
06/18/2014CN103871979A Semiconductor device and method of manufacturing the same
06/18/2014CN103871978A Semiconductor device
06/18/2014CN103871977A SEMICONDUCTOR DEVICE and production method thereof
06/18/2014CN103871976A Improved encapsulation structure of high-temperature SQUID (Superconductivity Quantum Interference Device) and method
06/18/2014CN103871975A Chip packaging and radiating mode
06/18/2014CN103871974A Semiconductor Device and Method of Producing the Same
06/18/2014CN103871973A Carrier tape, package tape and series of electronic components
06/18/2014CN103871972A Flange, semiconductor power device and integrated circuit board
06/18/2014CN103871964A Interconnecting wire structure and forming method thereof
06/18/2014CN103871962A Interconnection structure and manufacturing method for same
06/18/2014CN103871959A Interconnection structure and manufacturing method for same
06/18/2014CN103871913A Recessed discrete component mounting on organic substrate
06/18/2014CN103871912A Semiconductor manufacturing process and structure thereof
06/18/2014CN103871907A Manufacturing technology of ultra-thin substrate
06/18/2014CN103871906A Electrical interconnect formed through buildup process
06/18/2014CN103871905A Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (wlp) packages
06/18/2014CN103871544A Composition for use of an anisotropic conductive film and an anisotropic conductive film thereof
06/18/2014CN103864000A Mini electric conjugate fluid pump
06/18/2014CN103862762A Environmentally sensitive electronic device package, and manufacturing methods thereof
06/18/2014CN103862742A Phase-change metal thermal interface composite material and preparation method thereof
06/18/2014CN102819975B Braille display device based on temperature control
06/18/2014CN102593105B Triggered enhanced polycrystalline diode and manufacturing method thereof
06/18/2014CN102482779B Stress-reduced ni-p/pd stacks for bondable wafer surfaces
06/18/2014CN102469687B Circuit board
06/18/2014CN102468261B QFN semiconductor package and fabrication method thereof
06/18/2014CN102427068B Monolithical integration lattice mismatched crystal template and manufacturing method thereof
06/18/2014CN102347320B Device and manufacturing method thereof
06/18/2014CN102300909B Prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
06/18/2014CN102246292B Method of plating through wafer vias in a wafer for 3D packaging
06/18/2014CN102224565B Integrated capacitor with array of crosses
06/18/2014CN102194778B Display wiring substrate and display apparatus
06/18/2014CN102074486B Method of forming an integrated circuit structure
06/18/2014CN101882616B Integrated circuit
06/18/2014CN101859790B Solid crystal illuminating device having insulating layer and manufacturing method thereof
06/18/2014CN101800073B 记忆体阵列以及记忆体装置 Memory array and memory devices
06/18/2014CN101772841B Packaged integrated circuit devices with through-body conductive vias, and methods of making same
06/18/2014CN101661914B Liquid-cooled-type cooling device
06/18/2014CN101582407B System, structure and method of manufacturing semiconductor substrate stack
06/18/2014CN101226954B Organic light emitting display
06/17/2014US8756560 Method for designing dummy pattern, exposure mask, semiconductor device, method for semiconductor device, and storage medium
06/17/2014US8755644 Silicon based optical vias
06/17/2014US8755186 Heat pipe type cooling device and railcar control equipment using the same
06/17/2014US8754742 Multilayer ceramic substrate and method for producing the same
06/17/2014US8754741 High-resistance thin-film resistor and method of forming the resistor
06/17/2014US8754737 Large inductance integrated magnetic induction devices and methods of fabricating the same
06/17/2014US8754538 Semiconductor chip including identifying marks
06/17/2014US8754537 Build-up package for integrated circuit devices, and methods of making same
06/17/2014US8754535 Semiconductor device with a semiconductor chip connected in a flip chip manner
06/17/2014US8754534 Semiconductor device
06/17/2014US8754533 Monolithic three-dimensional semiconductor device and structure
06/17/2014US8754532 Semiconductor device and manufacturing method thereof
06/17/2014US8754531 Through-silicon via with a non-continuous dielectric layer
06/17/2014US8754530 Self-aligned borderless contacts for high density electronic and memory device integration
06/17/2014US8754529 MEMS device with simplified electrical conducting paths
06/17/2014US8754527 Self aligned borderless contact
06/17/2014US8754525 Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
06/17/2014US8754524 Wafer-level interconnect for high mechanical reliability applications
06/17/2014US8754523 Surface-mounted electronic component
06/17/2014US8754522 Repairable semiconductor device and method
06/17/2014US8754521 Semiconductor device assembly having a heat spreader
06/17/2014US8754520 Formation of air gap with protection of metal lines
06/17/2014US8754519 Package for housing semiconductor element and semiconductor device using the same
06/17/2014US8754518 Devices and methods for configuring conductive elements for a semiconductor package
06/17/2014US8754517 Double side cooling power semiconductor module and multi-stacked power semiconductor module package using the same
06/17/2014US8754516 Bumpless build-up layer package with pre-stacked microelectronic devices
06/17/2014US8754515 Stacked packages having through hole vias
06/17/2014US8754514 Multi-chip wafer level package
06/17/2014US8754513 Lead frame apparatus and method for improved wire bonding
06/17/2014US8754512 Atomic level bonding for electronics packaging
06/17/2014US8754511 Heat sink for electrical power converter
06/17/2014US8754510 Conduction path, semiconductor device using the same, and method of manufacturing conduction path, and semiconductor device
06/17/2014US8754505 Method of producing a heterostructure with local adaptation of the thermal expansion coefficient
06/17/2014US8754503 Substrate strip plate structure for semiconductor device and method for manufacturing the same
06/17/2014US8754499 Semiconductor chip with power gating through silicon vias
06/17/2014US8754490 Element array with a plurality of electromechanical conversion devices
06/17/2014US8754424 Discontinuous patterned bonds for semiconductor devices and associated systems and methods
06/17/2014US8754334 Multilayer printed wiring board
06/17/2014US8753973 Method of fabricating semiconductor memory device
06/17/2014US8753939 Three-dimensional semiconductor architecture
06/17/2014US8753924 Grown carbon nanotube die attach structures, articles, devices, and processes for making them
06/17/2014US8753922 Method of manufacturing a semiconductor device
06/17/2014US8753901 Semiconductor wafer with electrically connected contact and test areas
06/17/2014US8753529 Clathrate compound, thermoelectric material, and method for producing thermoelectric material
06/12/2014WO2014088966A2 Advanced device assembly structures and methods
06/12/2014WO2014088370A1 Curable polysiloxane composition for optical instrument, encapsulating material and optical device
06/12/2014WO2014088115A1 Curable silicone composition and optical semiconductor device
1 ... 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 ... 2262