Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/05/2014WO2014083874A1 Protective-film-forming composition, protective-film-forming sheet, and chip with curable protective film
06/05/2014WO2014083872A1 Sheet for forming resin film for chips and method for manufacturing semiconductor device
06/05/2014WO2014083718A1 Wiring board
06/05/2014WO2014083717A1 Power module
06/05/2014WO2014083715A1 Cable connecting structure and cable connecting method
06/05/2014WO2014083714A1 Mounting substrate and light emitting apparatus using mounting substrate
06/05/2014WO2014083123A1 Motor vehicle lighting and/or signalling device
06/05/2014WO2014083122A1 Motor vehicle lighting and/or signalling device
06/05/2014WO2014082809A1 Semiconductor device
06/05/2014US20140154844 Computer modules with small thicknesses and associated methods of manufacturing
06/05/2014US20140154841 Hermetic Wafer Level Packaging
06/05/2014US20140154838 Mounting apparatus and mounting method
06/05/2014US20140153206 Systems and methods for embedding devices in printed circuit board structures
06/05/2014US20140153167 Conductive compositions and methods of using them
06/05/2014US20140153002 Display substrate and method of measuring pattern dimensions of display substrate
06/05/2014US20140152349 Semiconductor device, manufacturing method thereof and operating method thereof
06/05/2014US20140151905 Devices and Methods for Providing an Electrical Connection
06/05/2014US20140151904 Semiconductor device
06/05/2014US20140151903 Repairing method, repairing structure, and repairing system for disconnected defect
06/05/2014US20140151902 Semiconductor Constructions and Methods of Forming Interconnects
06/05/2014US20140151901 Method for manufacturing semiconductor device, semiconductor device and jig for forming wiring
06/05/2014US20140151900 Stacked packaging using reconstituted wafers
06/05/2014US20140151899 Dual-damascene process to fabricate thick wire structure
06/05/2014US20140151898 Far back end of the line stack encapsulation
06/05/2014US20140151897 Printed circuit board and method for manufacturing the same
06/05/2014US20140151896 Implementing enhanced power supply distribution and decoupling utilizing tsv exclusion zone
06/05/2014US20140151895 Die having through-substrate vias with deformation protected tips
06/05/2014US20140151894 Far back end of the line stack encapsulation
06/05/2014US20140151893 Semiconductor interconnect structures
06/05/2014US20140151892 Three dimensional through-silicon via construction
06/05/2014US20140151891 Semiconductor package
06/05/2014US20140151890 Package with a fan-out structure and method of forming the same
06/05/2014US20140151889 Techniques for enhancing dielectric breakdown performance
06/05/2014US20140151888 Air-Gap Formation in Interconnect Structures
06/05/2014US20140151887 Memory Device Interconnects and Method of Manufacture
06/05/2014US20140151886 Semiconductor element and method for manufacturing semiconductor element
06/05/2014US20140151885 Semiconductor device and method for manufacturing a semiconductor device
06/05/2014US20140151884 Self-forming barrier structure and semiconductor device having the same
06/05/2014US20140151883 Method for manufacturing a semiconductor component and structure therefor
06/05/2014US20140151882 Three-dimensional integrated circuit having stabilization structure for power supply voltage, and method for manufacturing same
06/05/2014US20140151881 Packaged semiconductor chips with array
06/05/2014US20140151880 Package-on-package structures
06/05/2014US20140151879 Stress-resilient chip structure and dicing process
06/05/2014US20140151878 System and Method for Fine Pitch PoP Structure
06/05/2014US20140151877 Semiconductor package and method for fabricating the same
06/05/2014US20140151876 Semiconductor package and process for fabricating same
06/05/2014US20140151875 Crosstalk polarity reversal and cancellation through substrate material tuning
06/05/2014US20140151874 Bump-equipped electronic component and method for manufacturing bump-equipped electronic component
06/05/2014US20140151873 Semiconductor device and semiconductor device manufacturing method
06/05/2014US20140151872 Semiconductor module
06/05/2014US20140151871 Heat spreader with flexible tolerance mechanism
06/05/2014US20140151870 Semiconductor package including a heat-spreading part and method for its manufacture
06/05/2014US20140151868 Moisture-tight semiconductor module and method for producing a moisture-tight semiconductor module
06/05/2014US20140151867 Semiconductor package and method for fabricating base for semiconductor package
06/05/2014US20140151866 Packaged Semiconductor Device with Tensile Stress and Method of Making a Packaged Semiconductor Device with Tensile Stress
06/05/2014US20140151865 Semiconductor device packages providing enhanced exposed toe fillets
06/05/2014US20140151864 Atomic level bonding for electronics packaging
06/05/2014US20140151863 Semiconductor packages and methods of fabricating the same
06/05/2014US20140151862 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
06/05/2014US20140151861 Managing Method of Building Material and Wireless Chip Applied to the Method
06/05/2014US20140151860 Wireless module
06/05/2014US20140151859 Semiconductor package
06/05/2014US20140151856 Chip Module, an Insulation Material and a Method for Fabricating a Chip Module
06/05/2014US20140151848 Mimcap structure in a semiconductor device package
06/05/2014US20140151846 Shielding silicon from external rf interference
06/05/2014US20140151845 Semiconductor device having fuse pattern
06/05/2014US20140151842 Semiconductor apparatus
06/05/2014US20140151820 Gas-diffusion barriers for mems encapsulation
06/05/2014US20140151812 Contact Plugs in SRAM Cells and the Method of Forming the Same
06/05/2014US20140151795 Semiconductor device including gate drivers around a periphery thereof
06/05/2014US20140151794 Semiconductor device including a redistribution layer and metallic pillars coupled thereto
06/05/2014US20140151773 FINFET eDRAM STRAP CONNECTION STRUCTURE
06/05/2014US20140151763 Semiconductor structure having contact plug and method of making the same
06/05/2014US20140151745 Electrostatic discharge protective device
06/05/2014US20140151718 Semiconductor device and manufacturing method thereof
06/05/2014US20140151717 Packaged Vertical Power Device Comprising Compressive Stress and Method of Making a Packaged Vertical Power Device
06/05/2014US20140151701 Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
06/05/2014US20140151700 Chip package and a method for manufacturing a chip package
06/05/2014US20140151437 Apparatus for mounting semiconductor chips on a circuit board
06/05/2014US20140151341 Wire bonding apparatus
06/05/2014US20140151146 Mold module utilized as power unit of electric power steering apparatus and electric power steering apparatus
06/05/2014DE112007002215B4 Dielektrische Abstandshalter für Metallverbindungen und Verfahren zu ihrer Herstellung Dielectric spacers for metal compounds and processes for their preparation
06/05/2014DE102013224643A1 Systeme und Verfahren zum Einbetten von Bauelementen in Leiterplattenstrukturen Systems and methods for embedding components in PCB structures
06/05/2014DE102013216007A1 Halbleitervorrichtungstreiberschaltung und Verfahren zu ihrem Testen Semiconductor device driver circuit and method for its testing
06/05/2014DE102013113558A1 Eingebettetes chipgehäuse, chipgehäuse und verfahren zur herstellung eines eingebetteten chipgehäuses Embedded chip packages, chip packages and methods for manufacturing of an embedded chip package
06/05/2014DE102013113464A1 Chipmodul, Isoliermaterial und Verfahren zur Herstellung eines Chipmoduls Chip module, insulating material and method for producing a chip module
06/05/2014DE102013113451A1 Eingehäuste vertikale Leistungsvorrichtung, die eine Druckbelastung aufweist, und Verfahren zur Herstellung einer eingehäusten vertikalen Leistungsvorrichtung Eingehäuste vertical power device, comprising a pressure load, and method of manufacturing a vertical power device eingehäusten
06/05/2014DE102013113232A1 Gehäuste Halbleitervorrichtung mit Zugspannung und Verfahren zur Herstellung einer gehäusten Halbleitervorrichtung mit Zugspannung Packaged semiconductor device with tensile stress and method of manufacturing a packaged semiconductor device having tensile stress
06/05/2014DE102013113186A1 Halbleiterpackages, Systeme und Verfahren für deren Ausbildung Semiconductor packages, systems, and methods for their training
06/05/2014DE102013105020A1 SRAM-Zelle, die FinFETs umfasst SRAM cell includes the FinFETs
06/05/2014DE102013104369A1 Einbetten von Materialien mit niedrigem k-Wert in Antennen Embedding materials with a low k-value in antennas
06/05/2014DE102013103400A1 Sram-zelle, die finfets umfasst SRAM cell, which comprises FinFETs
06/05/2014DE102013019513A1 Dreidimensionaler aufbau von siliziumdurchführungen Three-dimensional construction of silicon grommets
06/05/2014DE102012222340A1 Cooling device for cooling electronic component i.e. processor arranged on printed circuit board, has fan including fan wheel, where fan wheel sweeps surface area projecting on one side of end face of surface of heat sink
06/05/2014DE102012222015A1 Feuchtigkeitsdichtes Halbleitermodul und Verfahren zu dessen Herstellung Moisture-proof semiconductor module and method for its production
06/05/2014DE102012222011A1 Leistungshalbleitermodulsystem Power semiconductor module system
06/05/2014DE102012215787B4 Leistungselektronisches System mit Flüssigkeitskühleinrichtung und Fahrzeug damit Power electronic system with liquid cooling device and vehicle so
06/05/2014DE102012023639A1 Method for three-dimensional (3D) integration of e.g. chips mounted in printed circuit board, involves patterning composite layer prior to lamination, and performing gluing or melting by laser or by cutting or punching process
06/05/2014DE102011075921B4 Mittels Klemmkeil und Gegenkeil elektrisch anschließbares Leistungshalbeiitermodul und Leistungshalbleitermodulsystem mit einem solchen Leistungshalbleitermodul By means of clamping wedge and counter-wedge electrically connectable Leistungshalbeiitermodul and power semiconductor module system with such a power semiconductor module
06/05/2014DE102010037941B4 Verfahren und Verwendung eines rekonstituierten Wafer zur Halbleiterbauelementfabrikation The method and use of a reconstituted wafer for semiconductor device fabrication
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