Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2014
06/25/2014CN203674205U 高端摄像模组的晶元封装结构 Epistar high-end camera module package structure
06/25/2014CN203674204U 带焊球面阵列四边无引脚ic芯片堆叠封装件 Four sides with an array of non-leaded solder ball surface ic chip stack package
06/25/2014CN203674203U 一种带焊球面阵列四边无引脚封装体堆叠封装件 A tape edges leadless solder area array package stacked package
06/25/2014CN203674202U 一种高可靠性sop封装引线框架 A highly reliable package leadframe sop
06/25/2014CN203674201U 一种dip8l多载体矩阵式引线框架 One kind dip8l multi-carrier matrix leadframe
06/25/2014CN203674200U 具有防外漏散热片溢料的esop8l引线框架 With anti-leakage fins burrs esop8l leadframe
06/25/2014CN203674199U 绝缘封装引线框架 Insulation package leadframe
06/25/2014CN203674198U 一种改进型引线框架 An improved lead frame
06/25/2014CN203674197U 新型qfn引线框架 The new qfn leadframe
06/25/2014CN203674196U 一种晶闸管 Thyristor
06/25/2014CN203674195U 一种结构修饰型石墨烯热整流器件 A structure Modified Graphene thermal rectifier
06/25/2014CN203674194U 三极管 Transistor
06/25/2014CN203674193U 封装结构 Package structure
06/25/2014CN203674192U 相机模组及其封装结构 The camera module and package structure
06/25/2014CN203674191U 传感器的真空陶瓷封装结构 Vacuum ceramic package structure of the sensor
06/25/2014CN203672209U 一种具有梯度孔隙结构毛细吸液芯的微型毛细泵环 Having a gradient pore structure of micro-capillary wick capillary pump loop
06/25/2014CN103891424A 元器件内置树脂基板 Built resin substrate components
06/25/2014CN103890941A 功率半导体模块和具有多个功率半导体模块的功率半导体模块组件 The power semiconductor module and a power semiconductor module having a plurality of components of the power semiconductor module
06/25/2014CN103890940A 包括结合使用双镶嵌型方案制造的微细间距背侧金属再分布线的穿硅过孔的3d互连结构 Includes a combination of dual damascene metal fine pitch backside redistribution type for manufacturing lines through silicon vias 3d interconnect structure
06/25/2014CN103890939A 包括与穿硅过孔组合的细间距单镶嵌后侧金属再分布线的3d互连结构 Including through silicon vias combination with fine-pitch single damascene interconnect structure 3d metal back side redistribution lines
06/25/2014CN103890938A 半导体模块用冷却器及半导体模块 Semiconductor module cooler and semiconductor module
06/25/2014CN103890937A 块体无定形合金散热器 Bulk amorphous alloy radiator
06/25/2014CN103890936A 光半导体装置用白色固化性组合物、光半导体装置用成形体及光半导体装置 An optical semiconductor device with a white curable composition for an optical semiconductor device and optical semiconductor device into a body
06/25/2014CN103890935A 树脂封装型半导体装置及其制造方法 A resin sealing type semiconductor device and its manufacturing method
06/25/2014CN103890934A 半导体装置以及半导体装置制造方法 Semiconductor device and manufacturing method of a semiconductor device
06/25/2014CN103890933A 用于嵌入式裸片封装的高精度自对准裸片 For embedded die package with high precision self-aligned die
06/25/2014CN103890932A 电子部件及其制造方法 An electronic component and its manufacturing method
06/25/2014CN103890931A 半导体装置及半导体模块 A semiconductor device and a semiconductor module
06/25/2014CN103890924A 具有用于接触厚布线或条片的金属成型体的功率半导体芯片及其制造方法 Having a power semiconductor chip and a method of manufacturing a thick wiring for contacting a metal sheet or strip shaped body
06/25/2014CN103890692A 冷却单元 The cooling unit
06/25/2014CN103890088A 树脂组合物 Resin composition
06/25/2014CN103889637A 带盖容器的制造方法及接合方法 The method of manufacturing a container with a lid, and the bonding method of
06/25/2014CN103889376A 生物相容性电极部件及其制造方法 Biocompatible electrode member and its manufacturing method
06/25/2014CN103889168A 承载电路板、承载电路板的制作方法及封装结构 Bearer circuit board carrying the circuit board manufacturing method and package structure
06/25/2014CN103888079A 用于lc振荡器的可变电感器 The variable inductor of the oscillator for lc
06/25/2014CN103887339A 一种晶体管、晶体管的散热结构以及晶体管的生产方法 Method for producing a transistor, a heat dissipation structure of the transistor and the transistor of
06/25/2014CN103887328A 薄膜晶体管阵列基板、液晶显示装置及制造方法 Apparatus and a method of manufacturing a thin film transistor array substrate, a liquid crystal display
06/25/2014CN103887324A 一种集成触控面板的有源矩阵有机发光二极管显示装置 An integrated touch panel active-matrix organic light emitting diode display device
06/25/2014CN103887300A 具有高可靠性导热绝缘基板的功率igbt模块 High reliability with power igbt module thermal insulating substrate
06/25/2014CN103887296A 发光装置及其制造方法 A light emitting device and manufacturing method
06/25/2014CN103887292A 堆叠式双芯片封装结构及其制备方法 Stacked dual-chip package structure and preparation method
06/25/2014CN103887291A 三维扇出型PoP封装结构及制造工艺 Three fan-out PoP package structure and manufacturing process
06/25/2014CN103887290A 具有接合中介层的集成电路器件 Joining the interposer having an integrated circuit device
06/25/2014CN103887289A 高密度互连器件及方法 High density interconnect devices and methods
06/25/2014CN103887288A 半导体集成电路和具有半导体集成电路的半导体系统 The semiconductor integrated circuit and a semiconductor integrated circuit system having a semiconductor
06/25/2014CN103887287A 半导体装置和半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
06/25/2014CN103887286A 一种具有提高抗浪涌电流能力的半导体装置 An improved surge current capability of the semiconductor device having
06/25/2014CN103887285A 防静电tft基板的制备方法 Preparation of anti-static tft board
06/25/2014CN103887284A 一种基于深n阱结构的垮芯片保护环电路 A deep n-well guard ring structure collapse chip circuit based
06/25/2014CN103887283A 多晶硅残留监测结构 Polysilicon residue monitoring structure
06/25/2014CN103887282A 一种金属电迁移结构 Structure of a metal electromigration
06/25/2014CN103887281A 改善嵌入式管芯封装中管芯背膜上激光标记对比度的方法 Improvement in the embedded die package die backing film contrast laser marking method
06/25/2014CN103887280A 对层间电介质进行可靠性分析的测试结构及测试方法 Interlayer dielectric structure and test methods for testing the reliability of the analysis
06/25/2014CN103887279A 三维扇出型晶圆级封装结构及制造工艺 Three fan-out wafer level packaging structure and manufacturing process
06/25/2014CN103887278A 封装和电介质或各向异性导电（acf）构造层 Packaging and dielectric or anisotropic conductive (acf) structural layer
06/25/2014CN103887277A 封装结构及其组装方法 Package structure and method of assembly
06/25/2014CN103887276A 防止凸点侧向刻蚀的凸点结构及成型方法 Bump bump structure to prevent lateral etching and molding method
06/25/2014CN103887275A 使用柔性基板实现三维层间垂直互连的结构及其制造方法 Use a flexible substrate to achieve vertical interconnects between three layers of structure and manufacturing method
06/25/2014CN103887274A 半导体封装件 The semiconductor package
06/25/2014CN103887273A 半导体模块 Semiconductor Modules
06/25/2014CN103887272A 电子模块以及其制造方法 And a manufacturing method of the electronic module
06/25/2014CN103887271A 一种迷你模塑封装手机卡以及封装方法 One kind of mini-molded package phone cards and packaging methods
06/25/2014CN103887270A Qfn框架结构 Qfn framework
06/25/2014CN103887269A 高频装置 High-frequency devices
06/25/2014CN103887268A 一种微型模塑封装手机卡用框架以及框架带 A miniature molded package with a phone card with a frame and a frame
06/25/2014CN103887267A 具有新型焊线的电力电子模块装置 Power electronics module device features a new bond wires
06/25/2014CN103887266A 利用焊料沟吸收过量底部填充流动 Ditch absorb excess use of solder flow underfill
06/25/2014CN103887265A 具有印刷电路层的集成电路封装及其制作方法 IC package and method of making a printed circuit layers
06/25/2014CN103887264A 预空间变换器、空间变换器、以及半导体装置检查设备 Pre space transformer, the space transformer, and a semiconductor device inspecting apparatus
06/25/2014CN103887263A 封装结构及其制作方法 Package structure and production methods
06/25/2014CN103887262A 堆叠式封装件与其制造方法 Stacked package and its manufacturing method
06/25/2014CN103887261A 一种柔性显示器及其制备方法 A flexible display its preparation method
06/25/2014CN103887260A 芯片接合结构及其制作方法 Chip bonding structure and production methods
06/25/2014CN103887259A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
06/25/2014CN103887258A 使用具有硅通孔的中介层衬底的芯片封装 Use an intermediary layer substrate having TSV chip packaging
06/25/2014CN103887257A 低寄生电感电力电子模块封装结构 Low parasitic inductance of power electronics module package structure
06/25/2014CN103887256A 一种高散热芯片嵌入式电磁屏蔽封装结构及其制作方法 A high-heat-chip embedded electromagnetic shielding package structure and production methods
06/25/2014CN103887255A 覆晶薄膜及显示装置 COF and display device
06/25/2014CN103887254A 含有导热颗粒填充物的功率器件模块 Thermally conductive filler particles containing a power device module
06/25/2014CN103887253A 使用齿状铜片的dbc板 Dentate copper plate using the dbc
06/25/2014CN103887252A 一种高效导热散热器 An efficient thermal radiator
06/25/2014CN103887251A 扇出型晶圆级封装结构及制造工艺 Fan-out wafer level package structure and manufacturing process
06/25/2014CN103887250A 用于导电性的电磁兼容晶片 Electromagnetic compatibility for conductive wafers
06/25/2014CN103887249A 半导体装置及其制造方法 Semiconductor device and manufacturing method
06/25/2014CN103887248A 一种igbt结构及其制备方法 One kind of structure and preparation method igbt
06/25/2014CN103887247A 功率模块封装件 Power Module package
06/25/2014CN103887246A 具有新型接合层的电力电子模块散热结构 Power electronics module having a heat dissipation structure of the new bonding layer
06/25/2014CN103887239A 薄膜晶体管阵列基板及其制造方法 The thin film transistor array substrate and a method of manufacturing
06/25/2014CN103887226A 晶圆堆叠结构及其制作方法与晶圆的制作方法 Wafer stack structure and method of making and wafer fabrication method
06/25/2014CN103887225A 基于铝合金引线框架的半导体器件及制备方法 Based on a semiconductor device and a method for preparing an aluminum alloy lead frame
06/25/2014CN103887191A 半导体器件和制作无凸块倒装芯片互连结构的方法 Semiconductor devices and making no bump flip chip interconnect structure approach
06/25/2014CN103887190A 组件端子周边内具有周边凹部的引线框架 Within the component having a lead frame perimeter around the terminal portion of the recess
06/25/2014CN103887189A 用于制造芯片布置的方法和芯片布置 The method for manufacturing the chip layout and chip layout
06/25/2014CN103887188A 大电流半导体器件的封装工艺 Packaging process large current semiconductor devices
06/25/2014CN103887187A 半导体封装结构的形成方法 The method for forming a semiconductor package structure
06/25/2014CN103887186A 包括在器件上组装的分立天线的封装结构 Including in the device package structure of the antenna assembly of discrete
06/25/2014CN103887184A 新型高密度高性能多层基板内对称结构及制作方法 Structure and production methods in the new high-density high-performance multi-layer substrate symmetry
06/25/2014CN103887183A 金/硅共晶芯片焊接方法及晶体管 Gold / silicon eutectic die bonding method and transistors
06/25/2014CN103886842A 显示装置 The display device
06/25/2014CN103886300A 一种电容式指纹传感器芯片及其封装结构 A capacitive fingerprint sensor chip and package structure
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