| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/31/2008 | US20080028349 Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip |
| 01/31/2008 | US20080026594 Reduction of Cracking in Low-K Spin-On Dielectric Films |
| 01/31/2008 | US20080026569 Advanced Seed Layers for Interconnects |
| 01/31/2008 | US20080026560 Methods of forming electronic structures including conductive shunt layers and related structures |
| 01/31/2008 | US20080026559 Solder Ball Pad Structure |
| 01/31/2008 | US20080026557 Electronic system modules and method of fabrication |
| 01/31/2008 | US20080026212 Film splicer |
| 01/31/2008 | US20080025450 Multiplexed rf isolator circuit |
| 01/31/2008 | US20080025003 Memory card |
| 01/31/2008 | US20080024997 Staggered memory layout for improved cooling in reduced height enclosure |
| 01/31/2008 | US20080024714 Multi-layer flexible film package and liquid crystal display device including the same |
| 01/31/2008 | US20080024475 Display Device |
| 01/31/2008 | US20080023855 Overlay marks, methods of overlay mark design and methods of overlay measurements |
| 01/31/2008 | US20080023854 Generating an Integrated Circuit Identifier |
| 01/31/2008 | US20080023853 Flip chip adaptor package for bare die |
| 01/31/2008 | US20080023852 Metal pad of mode dial and manufacturing method thereof |
| 01/31/2008 | US20080023851 Microelectronic device connection structure |
| 01/31/2008 | US20080023850 Silicon-based thin substrate and packaging schemes |
| 01/31/2008 | US20080023849 Chip module |
| 01/31/2008 | US20080023848 Semiconductor device and its wiring method |
| 01/31/2008 | US20080023847 Semiconductor device and its wiring method |
| 01/31/2008 | US20080023846 Semiconductor device and manufacturing method of the same |
| 01/31/2008 | US20080023845 Land grid array (lga) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries |
| 01/31/2008 | US20080023844 Interconnection substrate, semiconductor chip package including the same, and display system including the same |
| 01/31/2008 | US20080023843 Semiconductor device |
| 01/31/2008 | US20080023842 Semiconductor device |
| 01/31/2008 | US20080023841 Mounting board, method for manufacturing mounting board, and semiconductor module |
| 01/31/2008 | US20080023840 Via heat sink material |
| 01/31/2008 | US20080023839 Molybdenum-based electrode with carbon nanotube growth |
| 01/31/2008 | US20080023838 Manufacturing method of semiconductor device and semiconductor device |
| 01/31/2008 | US20080023837 Method for fabricating interconnect and interconnect fabricated thereby |
| 01/31/2008 | US20080023836 Semiconductor device |
| 01/31/2008 | US20080023835 Ohmic contact film in semiconductor device |
| 01/31/2008 | US20080023834 Raised Solder-Mask-Defined (SMD) Solder Ball Pads For a Laminate Electronic Circuit Board |
| 01/31/2008 | US20080023833 Solder bumps in flip-chip technologies |
| 01/31/2008 | US20080023832 Contact structure and manufacturing method thereof |
| 01/31/2008 | US20080023831 Semiconductor device and manufacturing method for the same |
| 01/31/2008 | US20080023830 Contact structure having a compliant bump and a testing area and manufacturing method for the same |
| 01/31/2008 | US20080023829 Substrate and process for semiconductor flip chip package |
| 01/31/2008 | US20080023828 Semiconductor device having bumps in a same row for staggered probing |
| 01/31/2008 | US20080023827 Solder connector structure and method |
| 01/31/2008 | US20080023826 Mounting device for a semiconductor package |
| 01/31/2008 | US20080023824 Double-sided die |
| 01/31/2008 | US20080023823 Power delivery using an integrated heat spreader |
| 01/31/2008 | US20080023822 Chip on flexible printed circuit type semiconductor package |
| 01/31/2008 | US20080023821 Substrate structure integrated with passive components |
| 01/31/2008 | US20080023820 Bond finger on via substrate, process of making same, package made thereby, and method of assembling same |
| 01/31/2008 | US20080023819 Package structure having semiconductor chip embedded therein and method for fabricating the same |
| 01/31/2008 | US20080023818 Contact device for use in a power semiconductor module or in a disc-type thyristor |
| 01/31/2008 | US20080023817 Component packaging apparatus, systems, and methods |
| 01/31/2008 | US20080023816 Semiconductor package |
| 01/31/2008 | US20080023815 Interlayer dielectric layer for printed wiring board, printed wiring board, and method of producing the same |
| 01/31/2008 | US20080023814 Stacked ball grid array semiconductor package |
| 01/31/2008 | US20080023813 Multi-die apparatus including moveable portions |
| 01/31/2008 | US20080023812 Semiconductor package having passive component and semiconductor memory module including the same |
| 01/31/2008 | US20080023811 Structure combining an ic integrated substrate and a carrier, and method of manufacturing such structure |
| 01/31/2008 | US20080023810 Semiconductor device |
| 01/31/2008 | US20080023809 Chip package and digital camera module using same |
| 01/31/2008 | US20080023808 Chip package and digital camera module using same |
| 01/31/2008 | US20080023807 Dual side cooling integrated power device package and module and methods of manufacture |
| 01/31/2008 | US20080023806 Stress-free lead frame |
| 01/31/2008 | US20080023805 Array-Processed Stacked Semiconductor Packages |
| 01/31/2008 | US20080023804 High-speed electrical interconnects and method of manufacturing |
| 01/31/2008 | US20080023802 Semiconductor device having a scribeline structure favorable for preventing chipping |
| 01/31/2008 | US20080023785 Bottom source LDMOSFET structure and method |
| 01/31/2008 | US20080023770 Stacked semiconductor devices and methods of manufacturing the same |
| 01/31/2008 | US20080023768 Synchronous substrate injection clamp |
| 01/31/2008 | US20080023767 High voltage electrostatic discharge protection devices and electrostatic discharge protection circuits |
| 01/31/2008 | US20080023766 electrostatic discharge protection device |
| 01/31/2008 | US20080023702 Integrated circuit module and method of forming the same |
| 01/31/2008 | US20080023701 Test module for semiconductor device |
| 01/31/2008 | US20080023700 Scan testing in single-chip multicore systems |
| 01/31/2008 | US20080023699 A test structure and method for detecting charge effects during semiconductor processing |
| 01/31/2008 | US20080023639 Ultraviolet Irradiation Apparatus |
| 01/31/2008 | US20080023627 Scanning electron microscope and CD measurement calibration standard specimen |
| 01/31/2008 | US20080023562 Ic card |
| 01/31/2008 | US20080023218 Electrolytic plating method |
| 01/31/2008 | US20080022519 Electronic package with optimized lamination process |
| 01/31/2008 | DE19517676B4 Drucksensor für eine Brennkraftmaschine mit einem Ansaugrohr Pressure sensor for an internal combustion engine having an intake pipe |
| 01/31/2008 | DE10356097B4 Seitenwandsperrschichtstruktur und Herstellungsverfahren Sidewall barrier structure and manufacturing method |
| 01/31/2008 | DE10332009B4 Halbleiterbauelement mit elektromagnetischer Abschirmvorrichtung A semiconductor device with electromagnetic shielding |
| 01/31/2008 | DE10303682B4 Verfahren zum Bewerten lateraler Dotier- und/oder Ladungsträgerprofile A method for evaluating lateral doping and / or carrier profiles |
| 01/31/2008 | DE102007033234A1 Halbleiterchip und Verfahren zur Ausbildung desselben The same semiconductor chip and process for forming |
| 01/31/2008 | DE102007031966A1 Struktur eines Bildsensormoduls und Herstellungsverfahren für ein Wafer-Level-Package An image sensor module structure and production method of a wafer level package |
| 01/31/2008 | DE102007029873A1 Wiring substrate for pressure sensors, acceleration sensors and ultrasonic sensors, comprises electrode cushion pad, which is arranged in opening, formed in protection insulation film |
| 01/31/2008 | DE102007029378A1 Nachgiebige, leitende Zwischenverbindungen Resilient, conductive interconnections |
| 01/31/2008 | DE102007028791A1 Thermoelektrische Umwandlungsvorrichtung und Herstellungsverfahren dafür Thermoelectric conversion device and manufacturing method thereof |
| 01/31/2008 | DE102007025950A1 Halbleitervorrichtung und ihr Herstellungsverfahren A semiconductor device and its manufacturing method |
| 01/31/2008 | DE102006048583B3 Component has two connections and four side surfaces with contact areas, where two side surfaces are opposite to each other, and contact areas of opposite side surfaces are connected with different connections |
| 01/31/2008 | DE102006040435B3 Power semiconductor module assembling arrangement, has area of terminal contacts aligned parallel towards lower side of module housing such that contacts form angle of preset degrees to lower side of housing |
| 01/31/2008 | DE102006035552A1 Wärmetauscher Heat exchanger |
| 01/31/2008 | DE102006034679A1 Halbleitermodul mit Leistungshalbleiterchip und passiven Bauelement sowie Verfahren zur Herstellung desselben The same semiconductor module with a power semiconductor die and passive component as well as methods for preparing |
| 01/31/2008 | DE102006034175A1 Electronic component`s housing apparatus for use in motor vehicle, has frame, which is filled with elastic sealing medium, such that elastic sealing medium closes one of recesses in common wall in sealed fashion |
| 01/31/2008 | DE102006033870A1 Elektronisches Bauteil mit mehreren Substraten sowie ein Verfahren zur Herstellung desselben The same electronic component having a plurality of substrates, and a process for preparing |
| 01/31/2008 | DE102006033701A1 Herstellungsverfahren für ein elektronisches Bauelement und Bauelement in VQFN-Bauweise Manufacturing method for an electronic component and structural element in construction VQFN |
| 01/31/2008 | DE102006025162B3 Flip-Chip-Bauelement und Verfahren zur Herstellung Flip-chip component and method for preparing |
| 01/31/2008 | DE102005044331B4 Verfahren zur Herstellung eines Halbleiterbauelements auf der Basis einer Lead-on-Chip-Architektur, Halbleiterbauelement und Leiterrahmen zur Implementierung in einem Halbleiterbauelement A process for producing a semiconductor device based on a lead-on-chip architecture, semiconductor device and lead frame for implementation in a semiconductor device |
| 01/31/2008 | DE102004063702B4 Verfahren zur Herstellung eines Halbleiter-Bauelements mit einer HfNx-Schicht auf einer Hf-haltigen Schicht A process for producing a semiconductor device with a HfNx layer on a Hf-containing layer |
| 01/30/2008 | EP1883287A1 Liquid cooling unit and heat receiver therefor |
| 01/30/2008 | EP1883108A2 Assembly with a high performance semiconductor element and a contact device |