| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/17/2008 | DE19613642B4 Halbleitereinrichtung zum Verkleinern von Wirkungen eines Rauschens auf eine interne Schaltung Semiconductor device to Shrink effects of noise on an internal circuit |
| 01/17/2008 | DE112004000956T5 Verfahren zur Ausbildung einer Verbindung A process for preparing a compound |
| 01/17/2008 | DE10319538B4 Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitereinrichtung A semiconductor device and method of manufacturing a semiconductor device |
| 01/17/2008 | DE10261009B4 Halbleiterchip-Stapelpackung und Leiterrahmen hierfür Semiconductor chip stack package and lead frame for this |
| 01/17/2008 | DE10255427B4 Verfahren zur Herstellung einer Antifuse in einem Substrat und Antifuse-Struktur zur Integration in einem Substrat A process for producing an antifuse in a substrate and antifuse structure to be integrated into a substrate |
| 01/17/2008 | DE102007008912A1 Halbleitervorrichtung Semiconductor device |
| 01/17/2008 | DE102006032796A1 Semiconductor component chip, particularly chip with electrically insulated rear side, for integrated computing circuits, has insulation layer at rear end, which is formed to electrically insulate semiconductor component chip from base body |
| 01/17/2008 | DE102006032251A1 Verfahren zum Herstellen von Chip-Packages sowie derartig hergestelltes Chip-Package A method for producing chip package and chip package produced in this way |
| 01/17/2008 | DE102006031539A1 Integrierter Halbleiterchip mit lateraler Wärmedämmung Integrated semiconductor chip with lateral thermal insulation |
| 01/17/2008 | DE102006031358A1 Verfahren zur Gehäusung optischer oder optoelektronischer Bauteile, sowie verfahrensgemäß herstellbares optisches oder optoelektronisches Gehäuseelement Method for Gehäusung optical or optoelectronic devices, as well as process according producible optical or optoelectronic housing element |
| 01/17/2008 | DE102006030631A1 Semiconductor component assembly, has trench which extends within semiconductor body starting from side and gate electrode is arranged in trench which is insulated by gate dielectric opposite to semiconductor body |
| 01/17/2008 | DE102006030564A1 Housing production method involves activating cover by plasma treatment, where cover is arranged in connecting area, before connection, with carrier substrate, and connection between connecting area and substrate is made by soldering |
| 01/17/2008 | DE102006030257A1 Teststruktur zum Bestimmen der Eigenschaften von Halbleiterlegierungen in SOI-Transistoren mittels Röntgenbeugung Test structure for determining the properties of semiconductor alloys in SOI-transistors by means of X-ray diffraction |
| 01/17/2008 | DE102006029457B4 Anordnung zur Befestigung einer Kühlvorrichtung in einem Computersystem Arrangement for fixing a cooling device in a computer system |
| 01/17/2008 | DE102006025961A1 Halbleiterschaltungsanordnung, Systemträger und Verfahren zur Herstellung eines Systemträgers und einer Halbleiterschaltungsanordnung A semiconductor circuit arrangement, system unit and method of manufacturing a lead frame and a semiconductor circuit arrangement |
| 01/17/2008 | DE102006020243B3 Leistungshalbleitermodul als H-Brückenschaltung und Verfahren zur Herstellung desselben The power semiconductor module of the same as an H-bridge circuit and methods for making |
| 01/17/2008 | DE10019812B4 Schaltungsanordnung Circuitry |
| 01/16/2008 | EP1879228A1 Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket |
| 01/16/2008 | EP1879227A1 Multilayer wiring substrate and manufacturing method thereof |
| 01/16/2008 | EP1879226A2 Semiconductor module and heat radiating plate |
| 01/16/2008 | EP1879222A2 Method of producing group 3 nitride substrate wafers and group 3 nitride substrate wafers |
| 01/16/2008 | EP1878809A1 Al-Ni-B ALLOY WIRING MATERIAL AND ELEMENT STRUCTURE USING THE SAME |
| 01/16/2008 | EP1878767A1 Heat conductive silicone grease composition and cured product thereof |
| 01/16/2008 | EP1878692A1 Semiconductor package substrate, in particular for MEMS devices |
| 01/16/2008 | EP1878051A1 Wire bonded semiconductor device having low inductance and noise |
| 01/16/2008 | EP1878050A1 Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip |
| 01/16/2008 | EP1878042A2 Silicon wafer having through-wafer vias |
| 01/16/2008 | EP1877809A2 Assembly for regulating the temperature of an integrated circuit |
| 01/16/2008 | EP1451860B1 Cmos process with an integrated, high performance, silicide agglomeration fuse |
| 01/16/2008 | EP1451759B1 Semiconductor device, card, methods of initializing, checking the authenticity and the identity thereof |
| 01/16/2008 | EP1266405B1 Planarised semiconductor structure including a conductive fuse and process for fabrication thereof |
| 01/16/2008 | EP0926931B1 Wiring board having vias |
| 01/16/2008 | CN201008246Y Easy-to-detach heat radiator |
| 01/16/2008 | CN201008245Y Heat radiator with vertical air flow panel |
| 01/16/2008 | CN201008243Y Fastener |
| 01/16/2008 | CN201007993Y Insulation type high-power triode |
| 01/16/2008 | CN201007991Y Short circuit, overload safeguard for transistor output |
| 01/16/2008 | CN201007990Y Contact window structure |
| 01/16/2008 | CN201007989Y Left-and-right pendulum type wiring structure |
| 01/16/2008 | CN101107896A Systems for integrated pump and cold plate |
| 01/16/2008 | CN101107715A 半导体装置 Semiconductor device |
| 01/16/2008 | CN101107709A Electronic component protected against the attacks |
| 01/16/2008 | CN101107708A Systems for improved heat exchanger |
| 01/16/2008 | CN101107707A Member for semiconductor device and method for manufacture thereof |
| 01/16/2008 | CN101107706A 电子元件封装的制造方法以及电子元件封装 The method of manufacturing encapsulated electronic components and electronic component packaging |
| 01/16/2008 | CN101107705A Sealing board and method for producing the same |
| 01/16/2008 | CN101107700A Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line |
| 01/16/2008 | CN101107699A Copper interconnect wiring and method of forming thereof |
| 01/16/2008 | CN101107687A Method for cutting lead terminal of packaged electronic component |
| 01/16/2008 | CN101107324A Silicone composition for encapsulating luminescent element and luminescent device |
| 01/16/2008 | CN101107293A Highly heat-resistant synthetic polymer compound and high withstand voltage semiconductor device |
| 01/16/2008 | CN101107285A Epoxy resin composition, method for forming latent of the same and semiconductor device |
| 01/16/2008 | CN101106892A A graphite-metal compound heat dispersion base material and its making technology |
| 01/16/2008 | CN101106891A A vacuumizing method for integrated phase change radiator of high power flat plate |
| 01/16/2008 | CN101106890A Fan heat radiation module |
| 01/16/2008 | CN101106888A Heat radiation module |
| 01/16/2008 | CN101106887A 散热器 Heat sink |
| 01/16/2008 | CN101106886A Heat radiator |
| 01/16/2008 | CN101106885A Heat radiator |
| 01/16/2008 | CN101106879A Heat dispersion device combination and its using clamper |
| 01/16/2008 | CN101106342A Multi-functional atomic power supply system |
| 01/16/2008 | CN101106208A Waveguide in semiconductor integrated circuit and electromagnetic wave shielding |
| 01/16/2008 | CN101106169A LED encapsulation structure and its making method |
| 01/16/2008 | CN101106168A LED waterproof encapsulation structure |
| 01/16/2008 | CN101106161A Underlay material for GaN epitaxial growth and its making method |
| 01/16/2008 | CN101106156A Organic light emitting diode display and method for manufacturing thereof |
| 01/16/2008 | CN101106155A Electroluminescent diplay |
| 01/16/2008 | CN101106152A Thermal isolation of phase change memory cells |
| 01/16/2008 | CN101106151A Phase change memory with diode unit selective connection and its making method |
| 01/16/2008 | CN101106140A Non-volatile memory devices including dummy word lines and related structures and methods |
| 01/16/2008 | CN101106133A Memory part, its making method and operation method |
| 01/16/2008 | CN101106131A Semiconductor structure and its forming method |
| 01/16/2008 | CN101106128A Semiconductor device and protection circuit |
| 01/16/2008 | CN101106126A Semiconductor module and heat radiating plate |
| 01/16/2008 | CN101106124A Direct insertion LED and its making method |
| 01/16/2008 | CN101106123A Wafer and semiconductor device testing method |
| 01/16/2008 | CN101106122A Buried bitline with reduced resistance |
| 01/16/2008 | CN101106121A Wiring substrate, semiconductor device, and method of manufacturing the same |
| 01/16/2008 | CN101106120A Spherical grid array encapsulation structure of base plate bottom glue encapsulation |
| 01/16/2008 | CN101106119A Encapsulation structure for preventing adhesive crystal glue from polluting wafer welding cushion |
| 01/16/2008 | CN101106118A Chip encapsulation structure |
| 01/16/2008 | CN101106117A Display panel and encapsulation structure of its control circuit |
| 01/16/2008 | CN101106116A Semiconductor device and method of producing the same |
| 01/16/2008 | CN101106115A Semiconductor device and method for manufacturing the same |
| 01/16/2008 | CN101106114A Chip structure and its forming method |
| 01/16/2008 | CN101106113A IC device package and its assembling method |
| 01/16/2008 | CN101106112A Packaging structure of electronic part, and its packaging method |
| 01/16/2008 | CN101106111A IC device package and its mounting method |
| 01/16/2008 | CN101106102A Compliant conductive interconnects |
| 01/16/2008 | CN101106101A Single inlay structure and dual inlay structure and their open hole forming method |
| 01/16/2008 | CN101106097A Semiconductor part with protective compound layer and its making method |
| 01/16/2008 | CN101106096A Method for forming conduction protruding block and its structure |
| 01/16/2008 | CN101106094A Built-in wafer encapsulation structure and its making process |
| 01/16/2008 | CN101106093A Making method for base plate welding cover layer and its structure |
| 01/16/2008 | CN101106081A Method of producing group iii nitride substrate wafers and group iii nitride substrate wafers |
| 01/16/2008 | CN101105377A Large power plate integral type phase change heat-radiation method and heat radiator |
| 01/16/2008 | CN101105286A Heat dissipation component and led lighting and/or signaling device comprising said component |
| 01/16/2008 | CN101104738A 导热硅脂组合物及其固化产物 Thermal grease composition and cured products |
| 01/16/2008 | CN100362707C Socket for semiconductor device |
| 01/16/2008 | CN100362670C Semiconductor device using semiconductor chip |