| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/14/2008 | US20080035922 Display Apparatus and Enable Circuit Thereof |
| 02/14/2008 | US20080035921 Method and circuit for detecting and compensating for a degradation of a semiconductor device |
| 02/14/2008 | US20080035895 Silver powder and method for producing same |
| 02/14/2008 | US20080035851 Processing method, manufacturing method of semiconductor device, and processing apparatus |
| 02/14/2008 | US20080035614 Energy efficient, laser-based method and system for processing target material |
| 02/14/2008 | US20080035362 Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers |
| 02/14/2008 | US20080035315 Cooling system with miniature fans for circuit board devices |
| 02/14/2008 | DE202007015392U1 Kühler Cooler |
| 02/14/2008 | DE202007013623U1 Modulare LED-Einheiten Modular LED units |
| 02/14/2008 | DE202007011681U1 Wärmeaufnehmer Heat absorber |
| 02/14/2008 | DE112005003325T5 System für kostengünstige Flüssigkühlung System for cost liquid cooling |
| 02/14/2008 | DE10360573B4 Leistungshalbleitermodul The power semiconductor module |
| 02/14/2008 | DE10320186B4 Wärmeleitpaste und Verfahren zu deren Auftrag und Schutz Thermal Compounds and methods for their order and protection |
| 02/14/2008 | DE10314876B4 Verfahren zum mehrstufigen Herstellen von Diffusionslötverbindungen und seine Verwendung für Leistungsbauteile mit Halbleiterchips A method for multistage manufacturing Diffusionslötverbindungen and its use for power devices with semiconductor chips |
| 02/14/2008 | DE10234162B4 Verfahren zur Herstellung eines organischen Bauelements A method for producing an organic device |
| 02/14/2008 | DE10228771B4 Verfahren zur Planarisierung mit definierbarer Planarisierungslänge in integrierten Halbleiterschaltungen und derartige integrierte Halbleiterschaltung Method for planarization with definable planarization length in semiconductor integrated circuits and such semiconductor integrated circuit |
| 02/14/2008 | DE102007037419A1 Automotive heat exchanger to cool electronic components has alternating thick and thin folded metal ribbon strips |
| 02/14/2008 | DE102007036268A1 Halbleiterbauelement Semiconductor device |
| 02/14/2008 | DE102007033229A1 Chip module e.g. for smart card, has full trace of chip system which in part has hidden outer polymeric protective layer |
| 02/14/2008 | DE102006037691A1 Moldgehäuse in Einpresstechnik In press-fit molded housing |
| 02/14/2008 | DE102006037587A1 Semiconducting component protection structure has substrate configured above second buffer coating so second buffer coating essentially encloses entire substrate to reduce substrate damage if external force is exerted on side of substrate |
| 02/14/2008 | DE102006036798A1 Electronic module for diverse uses e.g. vehicle equipment, mobile phones or cameras, includes layer containing nickel palladium alloy and further layer of copper or aluminum |
| 02/14/2008 | DE102006035864A1 Verfahren zur Herstellung einer elektrischen Durchkontaktierung A method for producing an electrical plated-through hole |
| 02/14/2008 | DE102006033073B3 Verfahren zur Schaffung einer hitze- und stoßfesten Verbindung des Baugruppen-Halbleiters und zur Drucksinterung vorbereiteter Halbleiterbaustein A method of providing a heat and impact resistant connection of the module-type semiconductor and pressure sintering prepared semiconductor device |
| 02/14/2008 | DE102005047547B4 Andrückkonzept für ein Substrat eines Leistungsmoduls und Leistungsmodul Andrückkonzept for a substrate of a power module and the power module |
| 02/14/2008 | DE10103966B4 Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat und zum Anordnen auf einem Substrat angepaßte Halbleitervorrichtung A method for disposing a semiconductor chip on a substrate and adapted for mounting on a substrate the semiconductor device |
| 02/13/2008 | EP1887846A1 Printed wiring board |
| 02/13/2008 | EP1887845A1 Printed wiring board |
| 02/13/2008 | EP1887683A1 Three level power converter |
| 02/13/2008 | EP1887622A2 Capacitor built-in substrate and method of manufacturing the same and electronic component device |
| 02/13/2008 | EP1887621A2 High performance electronics with cooling unit |
| 02/13/2008 | EP1887033A1 Thermally conductive material |
| 02/13/2008 | EP1886351A2 Apparatus and methods for maintaining integrated circuit performance at reduced power |
| 02/13/2008 | EP1885907A2 Systems and methods for thermal management of electronic components |
| 02/13/2008 | CN201022253Y Multi-function heat conduction device |
| 02/13/2008 | CN201022252Y Loop liquid cooling heat dispersion array module |
| 02/13/2008 | CN201022251Y Micro heat dispersion module |
| 02/13/2008 | CN201022249Y Heat radiator buckle tool |
| 02/13/2008 | CN201022248Y Heat radiator buckle tool |
| 02/13/2008 | CN201022149Y Integrated non wiring controllable silicon phase conversion protection part |
| 02/13/2008 | CN201022080Y 高功率led导线架 High power led wire rack |
| 02/13/2008 | CN201022079Y A white light LED |
| 02/13/2008 | CN201022078Y A center positioning power part |
| 02/13/2008 | CN201022077Y Silicon underling plane LED integration chip |
| 02/13/2008 | CN201022076Y LED structure |
| 02/13/2008 | CN201022075Y Testing structure for electronic migration rate |
| 02/13/2008 | CN201022074Y Improved circuit board structure for contact image sensor |
| 02/13/2008 | CN201022073Y Encapsulation structure of optical sensor |
| 02/13/2008 | CN101124857A Package mounting module and package base plate module |
| 02/13/2008 | CN101124684A Superconductive articles having density characteristics |
| 02/13/2008 | CN101124677A Semiconductor device and preparing method thereof |
| 02/13/2008 | CN101124676A Supercritical fluid-assisted deposition of materials on semiconductor substrates |
| 02/13/2008 | CN101124675A Stacked electronic component, electronic device and method for manufacturing stacked electronic component |
| 02/13/2008 | CN101124674A Electronic component module |
| 02/13/2008 | CN101124673A Method for collectively producing a superimposed element microstructure |
| 02/13/2008 | CN101124348A Indium oxide/zinc oxide/magnesium oxide sputtering target and transparent conductive film |
| 02/13/2008 | CN101124345A Copper alloy and method for production thereof |
| 02/13/2008 | CN101124258A Thermosetting composition for solder resist and cured product thereof |
| 02/13/2008 | CN101124233A Novel curable resin, method for producing same, epoxy resin composition and electronic component device |
| 02/13/2008 | CN101123861A Liquid supply module and its applied electronic device |
| 02/13/2008 | CN101123860A Heat radiator |
| 02/13/2008 | CN101123859A Heat dispersion device combination and its assembly method |
| 02/13/2008 | CN101123858A Heat dispersion device combination and its used buckle |
| 02/13/2008 | CN101123853A Capacitor built-in interposer, method of manufacturing the same, and electronic component device |
| 02/13/2008 | CN101123289A Bidirectional luminescent heat radiation LED |
| 02/13/2008 | CN101123268A Display device and manufacturing method thereof |
| 02/13/2008 | CN101123266A Pixel having intrinsic semiconductor as electrode and electroluminescent displays employing such a pixel |
| 02/13/2008 | CN101123262A Display substrate, method of fabricating the same, and liquid crystal display device having the same |
| 02/13/2008 | CN101123261A LCD film transistor array base plate and its repairable capacitor |
| 02/13/2008 | CN101123257A Thin film transistor array base plate and its making method |
| 02/13/2008 | CN101123256A Vertical electromechanical storage device and its manufacture method |
| 02/13/2008 | CN101123255A Semiconductor integrated circuit device |
| 02/13/2008 | CN101123250A Layout architecture with high-performance and high-density design |
| 02/13/2008 | CN101123249A Semiconductor device and its production method |
| 02/13/2008 | CN101123248A Semiconductor package having improved thermal performance |
| 02/13/2008 | CN101123247A LED encapsulation structure |
| 02/13/2008 | CN101123246A Chip interconnection structure and system |
| 02/13/2008 | CN101123245A Testing structure for MOS capacitor and location method for failure point |
| 02/13/2008 | CN101123244A Electromechanical memory devices and methods of manufacturing the same |
| 02/13/2008 | CN101123243A Making method for dual enchasing structure |
| 02/13/2008 | CN101123242A Method for manufacturing through-hole and electronic device |
| 02/13/2008 | CN101123241A Semiconductor encapsulation coiling belt |
| 02/13/2008 | CN101123240A Array line base board |
| 02/13/2008 | CN101123239A Wafer carrier and its encapsulation body |
| 02/13/2008 | CN101123238A Lead frame and semiconductor device using the same |
| 02/13/2008 | CN101123237A An internal memory chip encapsulated lead frame |
| 02/13/2008 | CN101123236A Making procedure for array encapsulation structure of lead frame base ball and lead frame without external pin |
| 02/13/2008 | CN101123235A Semiconductor encapsulation structure for improving crystal shift upon pressing and its using lead frame |
| 02/13/2008 | CN101123234A Encapsulation structure and its making method |
| 02/13/2008 | CN101123233A Electronic device and method of manufacturing the same |
| 02/13/2008 | CN101123232A Semiconductor apparatus |
| 02/13/2008 | CN101123231A Encapsulation structure for wafer chip dimension of micro mechanical-electrical system and its making method |
| 02/13/2008 | CN101123230A Internal lead structure for semiconductor part |
| 02/13/2008 | CN101123229A Semiconductor device and manufacturing method thereof |
| 02/13/2008 | CN101123228A Fixing location for chip and heat radiating slice |
| 02/13/2008 | CN101123227A Luminescent and heat radiation device and its encapsulation making method |
| 02/13/2008 | CN101123226A Luminescent and heat radiation device and its making method |
| 02/13/2008 | CN101123225A Protection method and device for semiconductor part table |
| 02/13/2008 | CN101123207A Filling method for concave slot and its structure |
| 02/13/2008 | CN101123195A Resin molding semiconductor device and its manufacturing device and method |