| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/06/2008 | EP1884993A1 An heat conductive pipe with flat end and its manufacturing method |
| 02/06/2008 | EP1884989A2 Semiconductor device and method of manufacturing the same |
| 02/06/2008 | EP1883962A1 Ubm pad solder contact and method for production of a solder connection |
| 02/06/2008 | EP1883961A2 Materials and method to seal vias in silicon substrates |
| 02/06/2008 | EP1883960A2 Semiconductor device with reduced metal layer stress |
| 02/06/2008 | EP1883957A1 Forming of local and global wiring for semiconductor product |
| 02/06/2008 | EP1642334B1 Electronic power module comprising a rubber seal and corresponding production method |
| 02/06/2008 | EP1565932B1 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 02/06/2008 | CN201018751Y Liquid cooling heat radiator |
| 02/06/2008 | CN201018750Y Fin annular-arranged heat radiator |
| 02/06/2008 | CN201018748Y Heat dissipating structure |
| 02/06/2008 | CN201018747Y Heat radiation base |
| 02/06/2008 | CN201018740Y Water-cooled heat radiator |
| 02/06/2008 | CN201018737Y Shape changeable heat radiator |
| 02/06/2008 | CN201018736Y Heat radiator capable of altering air-supply direction |
| 02/06/2008 | CN201018735Y Heat radiating module |
| 02/06/2008 | CN201018734Y Radiation fin assembly and its radiation fin |
| 02/06/2008 | CN201017904Y Led |
| 02/06/2008 | CN201017898Y Packaging colloid structure of LED |
| 02/06/2008 | CN201017891Y 100mA and above plastic capsulation high voltage diode |
| 02/06/2008 | CN201017883Y Flaw memory packaging structure |
| 02/06/2008 | CN201017881Y Illuminating diode apparatus having protection function |
| 02/06/2008 | CN201017880Y Semi-conductor packaging body stacking structure |
| 02/06/2008 | CN201017879Y Chip assembling body and chip packaging body |
| 02/06/2008 | CN201017878Y Luminous diode having over temperature and overcurrent protection structure |
| 02/06/2008 | CN201017877Y Staged thru hole chain structure easy to test reliability |
| 02/06/2008 | CN201017876Y Waterproof type plastic capsulation series lead wire frame |
| 02/06/2008 | CN201017875Y Luminous diode heat radiation structure |
| 02/06/2008 | CN201017874Y Heat radiating device of luminous diode |
| 02/06/2008 | CN201017873Y Special-shaped second heat superconductivity heat radiator used for CPU cool-down |
| 02/06/2008 | CN201017872Y CPU heat radiating device |
| 02/06/2008 | CN201017871Y Auxiliary heat radiator of central processing unit of host board |
| 02/06/2008 | CN201017870Y Packaging structure of minisize electron assembly block |
| 02/06/2008 | CN201017869Y Insulation type high power electric power semiconductor module |
| 02/06/2008 | CN201017274Y CPU power supply module wind-guiding groove |
| 02/06/2008 | CN101120446A Semiconductor module and device |
| 02/06/2008 | CN101120445A Substrate with built-in chip and method for manufacturing substrate with built-in chip |
| 02/06/2008 | CN101120440A Area mounting semiconductor device, and die bonding resin composition and sealing resin composition for use therein |
| 02/06/2008 | CN101120438A Semiconductor device manufacturing method and semiconductor device |
| 02/06/2008 | CN101120436A Process for producing modified porous silica film, modified porous silica film obtained by the process, and semiconductor device employing the modified porous silica film |
| 02/06/2008 | CN101120433A Methods and devices for fabricating and assembling printable semiconductor elements |
| 02/06/2008 | CN101120023A Thermally conductive sheet |
| 02/06/2008 | CN101119625A Water-cooled heat sink and water-cooled system |
| 02/06/2008 | CN101119624A Heat sinks for dissipating a thermal load and methods for parallel dissipation of a thermal load |
| 02/06/2008 | CN101119622A Radiating module and fan and housing |
| 02/06/2008 | CN101119621A Combination of cooling device |
| 02/06/2008 | CN101119063A Frequency converter |
| 02/06/2008 | CN101118989A Light emitting diode and circuit module assembly |
| 02/06/2008 | CN101118944A Optical diode package structure |
| 02/06/2008 | CN101118942A Solid state device |
| 02/06/2008 | CN101118940A Built crystal substrate and liquid built crystal growing method |
| 02/06/2008 | CN101118939A Luminous element packaging device |
| 02/06/2008 | CN101118920A High voltage light emitting diode circuit having multistage threshold voltage and diode luminous device |
| 02/06/2008 | CN101118916A Sun sensor photodetecting component assembling structure and installation method |
| 02/06/2008 | CN101118913A Display device and method of manufacturing the display device |
| 02/06/2008 | CN101118912A Film transistor array substrates and its producing method |
| 02/06/2008 | CN101118910A Non volatile memory integrate circuit having vertical channel and fabricating method thereof |
| 02/06/2008 | CN101118907A And/not gate type non-volatility memory and manufacturing method and operation method therefor |
| 02/06/2008 | CN101118904A Integrated circuit and method for wiring and version number modification of integrated circuit |
| 02/06/2008 | CN101118902A Packed integrated circuit of system and packing method thereof |
| 02/06/2008 | CN101118901A Stack type chip packaging structure, chip packaging structure and manufacture process |
| 02/06/2008 | CN101118900A Light emitting diode packaging structure |
| 02/06/2008 | CN101118899A Apparatus and method for arranging predetermined element on target platform |
| 02/06/2008 | CN101118898A Semiconductor device and method for fabricating the same |
| 02/06/2008 | CN101118897A Reinforced type thin film crystal-coated packaging structure |
| 02/06/2008 | CN101118896A Thin film crystal-coated package structure with extended pin |
| 02/06/2008 | CN101118895A Semiconductor element with embedded heat sink |
| 02/06/2008 | CN101118894A Chip packaging structure and manufacturing method therefor |
| 02/06/2008 | CN101118893A Semiconductor packaging structure with common type wafer holder |
| 02/06/2008 | CN101118892A Silicon substrates and optoelectronic component packaging structure having the same |
| 02/06/2008 | CN101118891A 半导体器件 Semiconductor devices |
| 02/06/2008 | CN101118890A Si-based packaging with integrated passive components |
| 02/06/2008 | CN101118889A Semiconductor package structure |
| 02/06/2008 | CN101118888A Inner pin jointing tape coiling and tape coiling support packaging structure using the same |
| 02/06/2008 | CN101118887A Array packaging substrate and method for judging cutting mode of packaging array |
| 02/06/2008 | CN101118886A Composite indium column for infrared focal plane device and process for producing the same |
| 02/06/2008 | CN101118885A Crystal-coated packaging structure |
| 02/06/2008 | CN101118884A Projection structure and method for forming same |
| 02/06/2008 | CN101118883A High efficiency LED heat radiating module |
| 02/06/2008 | CN101118882A Glass crystal packaging structure for image sensory element |
| 02/06/2008 | CN101118861A Chip packaging structure and manufacturing method therefor |
| 02/06/2008 | CN101118838A Method, chip and wafer for preventing the formation of backside micro-crack and its frontside extension in the semiconductor chip or wafer |
| 02/06/2008 | CN101118785A Semiconductor devices with source and bulk coupled to separate voltage supplies |
| 02/06/2008 | CN101118720A Display device and pixel circuit layout method |
| 02/06/2008 | CN101118595A Three-dimensional circuit board and fingerprint sensor device |
| 02/06/2008 | CN101117558A Gel injection molding material composition for aluminium silicon carbide integrated circuit pipe shell and method for preparing products |
| 02/06/2008 | CN100367831C Distributing base board, displaying device and method for producing distributing base board |
| 02/06/2008 | CN100367618C Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balan |
| 02/06/2008 | CN100367522C LED packaging structure with thermoelectric device |
| 02/06/2008 | CN100367521C Wavelength-converting casting composition and white light-emitting semiconductor component |
| 02/06/2008 | CN100367499C 芯片装置 Chip device |
| 02/06/2008 | CN100367497C Semiconductor device and method for fabricating the same |
| 02/06/2008 | CN100367496C Microelectronic package having a bumpless laminated interconnection layer |
| 02/06/2008 | CN100367495C Electronic device and its producing method |
| 02/06/2008 | CN100367494C Liquid cooling type power transducer |
| 02/06/2008 | CN100367493C Liquid cooling system |
| 02/06/2008 | CN100367492C Method for making radiating structure of rectifier |
| 02/06/2008 | CN100367491C Intermediate substrate |
| 02/06/2008 | CN100367490C Diaphragm bearing belt for mounting electronic device and its mfg. method |
| 02/06/2008 | CN100367489C Semiconductor device and voltage regulator |