| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/21/2008 | WO2008021860A2 Process for precision placement of integrated circuit overcoat material |
| 02/21/2008 | WO2008021797A1 Thermally enhanced bga package apparatus and method |
| 02/21/2008 | WO2008021744A2 Side connectors for rfid chip |
| 02/21/2008 | WO2008021575A2 Microelectronic package |
| 02/21/2008 | WO2008021489A2 Integrated circuit chip with repeater flops and method for automated design of same |
| 02/21/2008 | WO2008021362A1 Memory device with non-orthogonal word and bit lines and manufacturing method thereof |
| 02/21/2008 | WO2008021272A2 Semiconductor device and method for manufacturing a semiconductor device |
| 02/21/2008 | WO2008021268A1 Led device and back panel of liquid crystal display |
| 02/21/2008 | WO2008021220A2 Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities |
| 02/21/2008 | WO2008021219A2 Semiconductor device having improved heat dissipation capabilities |
| 02/21/2008 | WO2008021072A1 Reduction of damage to thermal interface material due to asymmetrical load |
| 02/21/2008 | WO2008020810A1 Edge bond chip connection (ebcc) |
| 02/21/2008 | WO2008020402A2 Testing for correct undercutting of an electrode during an etching step |
| 02/21/2008 | WO2008020392A2 Semiconductor component and assembly with projecting electrode |
| 02/21/2008 | WO2008020391A2 Reducing stress between a substrate and a projecting electrode on the substrate |
| 02/21/2008 | WO2008020361A2 Deformable integrated circuit device |
| 02/21/2008 | WO2008020295A1 Three-dimensional thermal spreading in an air-cooled thermal device |
| 02/21/2008 | WO2008019479A1 Method and apparatus for reducing thermal stress in light-emitting elements |
| 02/21/2008 | WO2008005944A3 Systems and methods for alignment of laser beam (s) for semiconductor link processing |
| 02/21/2008 | WO2008001282A3 Flip-chip interconnection with a small passivation layer opening |
| 02/21/2008 | WO2008001248A3 Integrated circuit |
| 02/21/2008 | WO2007119188A3 Micro device with microtubes |
| 02/21/2008 | WO2007053686A3 Monolithically integrated semiconductor materials and devices |
| 02/21/2008 | US20080046080 Method for forming packaged microelectronic devices and devices thus obtained |
| 02/21/2008 | US20080045111 Sealing substrate, method of fabricating the same, display device and electronic instrument |
| 02/21/2008 | US20080045033 Stacked structure and patterning method using the same |
| 02/21/2008 | US20080045008 Post passivation interconnection schemes on top of IC chip |
| 02/21/2008 | US20080045004 Post passivation interconnection schemes on top of IC chips |
| 02/21/2008 | US20080045003 Method of wire bonding over active area of a semiconductor circuit |
| 02/21/2008 | US20080045002 Post passivation interconnection schemes on top of IC chip |
| 02/21/2008 | US20080045001 Post passivation interconnection schemes on top of IC chip |
| 02/21/2008 | US20080045000 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium |
| 02/21/2008 | US20080044999 Method for an improved air gap interconnect structure |
| 02/21/2008 | US20080044997 Semiconductor device and method for manufacturing same |
| 02/21/2008 | US20080044996 Contact structure of semiconductor device, manufacturing method thereof, thin film transistor array panel including contact structure, and manufacturing method thereof |
| 02/21/2008 | US20080044977 High performance system-on-chip using post passivation process |
| 02/21/2008 | US20080044976 High performance system-on-chip using post passivation process |
| 02/21/2008 | US20080044974 Embedded stressed nitride liners for cmos performance improvement |
| 02/21/2008 | US20080044969 Turn-on-efficient bipolar structures with deep n-well for on-chip esd protection |
| 02/21/2008 | US20080044951 Semiconductor package and method of manufacturing the same |
| 02/21/2008 | US20080044950 Multi-layer fin wiring interposer fabrication process |
| 02/21/2008 | US20080044948 Manufacturing method for resin sealed semiconductor device |
| 02/21/2008 | US20080044944 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof |
| 02/21/2008 | US20080044933 Method for forming matching table of inner pads and outer pads and method for matching inner pads with outer pads using the same |
| 02/21/2008 | US20080044685 Articles Comprising High-Electrical-Conductivity Nanocomposite Material and Method for Fabricating Same |
| 02/21/2008 | US20080044670 Interface materials and methods of production and use thereof |
| 02/21/2008 | US20080044660 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
| 02/21/2008 | US20080044651 Coatings Comprising Carbon Nanotubes |
| 02/21/2008 | US20080043791 Semiconductor Laser Equipment |
| 02/21/2008 | US20080042852 RFID tag |
| 02/21/2008 | US20080042851 RFID tag and RFID tag production method |
| 02/21/2008 | US20080042561 Devices Including, Methods Using, and Compositions of Reflowable Getters |
| 02/21/2008 | US20080042501 Thermal transfer container for semiconductor component |
| 02/21/2008 | US20080042302 Plastic overmolded packages with molded lid attachments |
| 02/21/2008 | US20080042301 Semiconductor device package and manufacturing method |
| 02/21/2008 | US20080042300 Circuit substrate and semiconductor device |
| 02/21/2008 | US20080042299 Interconnections For Crosswire Arrays |
| 02/21/2008 | US20080042298 Semiconductor devices and methods of fabricating the same |
| 02/21/2008 | US20080042297 Post passivation interconnection schemes on top of the ic chips |
| 02/21/2008 | US20080042296 Post passivation interconnection schemes on top of the IC Chips |
| 02/21/2008 | US20080042295 Post passivation interconnection schemes on top of IC chip |
| 02/21/2008 | US20080042294 Post passivation interconnection schemes on top of IC chip |
| 02/21/2008 | US20080042293 Post passivation interconnection schemes on top of IC chip |
| 02/21/2008 | US20080042292 Bond pad for wafer and package for cmos imager |
| 02/21/2008 | US20080042291 Copper contact via structure using hybrid barrier layer |
| 02/21/2008 | US20080042290 Structures Electrically Connecting Aluminum and Copper Interconnections and Methods of Forming the Same |
| 02/21/2008 | US20080042289 High performance system-on-chip using post passivation process |
| 02/21/2008 | US20080042288 Method for manufacturing display device |
| 02/21/2008 | US20080042287 Integrated Circuit Chip Utilizing Oriented Carbon Nanotube Conductive Layers |
| 02/21/2008 | US20080042286 Semiconductor device |
| 02/21/2008 | US20080042285 Post passivation interconnection schemes on top of IC chip |
| 02/21/2008 | US20080042284 Semiconductor integrated circuit and the method of designing the layout |
| 02/21/2008 | US20080042283 Treatment of plasma damaged layer for critical dimension retention, pore sealing and repair |
| 02/21/2008 | US20080042282 Semiconductor integrated circuit device and a method of manufacturing the same |
| 02/21/2008 | US20080042281 Semiconductor device and semiconductor device fabrication method |
| 02/21/2008 | US20080042280 Semiconductor chip structure |
| 02/21/2008 | US20080042279 Mounting structure of semiconductor device having flux and under fill resin layer and method of mounting semiconductor device |
| 02/21/2008 | US20080042278 Substrate structure having N-SMD ball pads |
| 02/21/2008 | US20080042277 BGA package with leads on chip field of the invention |
| 02/21/2008 | US20080042276 System and method for reducing stress-related damage to ball grid array assembly |
| 02/21/2008 | US20080042275 Structure for bumped wafer test |
| 02/21/2008 | US20080042274 Components, methods and assemblies for stacked packages |
| 02/21/2008 | US20080042273 High performance system-on-chip using post passivation process |
| 02/21/2008 | US20080042272 Semiconductor Device |
| 02/21/2008 | US20080042270 System and method for reducing stress-related damage to ball grid array assembly |
| 02/21/2008 | US20080042269 Bump structures and packaged structures thereof |
| 02/21/2008 | US20080042268 Void boundary structures, semiconductor devices having the void boundary structures and methods of forming the same |
| 02/21/2008 | US20080042267 Integrated circuit package and system interface |
| 02/21/2008 | US20080042266 Noncontact Ic Label and Method and Apparatus for Manufacturing the Same |
| 02/21/2008 | US20080042265 Chip scale module package in bga semiconductor package |
| 02/21/2008 | US20080042264 Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures |
| 02/21/2008 | US20080042263 Reinforced semiconductor package and stiffener thereof |
| 02/21/2008 | US20080042262 Plastic overmolded packages with mechanically decoupled lid attach attachment |
| 02/21/2008 | US20080042261 Integrated circuit package with a heat dissipation device and a method of making the same |
| 02/21/2008 | US20080042260 Micro-electromechanical systems device and manufacturing method thereof |
| 02/21/2008 | US20080042259 Semiconductor device and method of manufacturing the same, circult board, and electronic instrument |
| 02/21/2008 | US20080042258 Package for semiconductor devices |
| 02/21/2008 | US20080042257 Die pad arrangement and bumpless chip package applying the same |
| 02/21/2008 | US20080042256 Chip package structure and circuit board thereof |
| 02/21/2008 | US20080042255 Chip package structure and fabrication method thereof |