| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/17/2008 | WO2008008939A2 Emi absorbing gap filling material |
| 01/17/2008 | WO2008008798A1 Integrated circuit mount system with solder mask pad |
| 01/17/2008 | WO2008008587A2 A stacked-die electronics package with planar and three-dimensional inductor elements |
| 01/17/2008 | WO2008008581A2 An electronics package with an integrated circuit device having post wafer fabrication integrated passive components |
| 01/17/2008 | WO2008008085A2 Ic coolant microchannel assembly with integrated attachment hardware |
| 01/17/2008 | WO2008007799A1 Cooling device and vehicle with the same |
| 01/17/2008 | WO2008007732A1 Method for manufacturing semiconductor device |
| 01/17/2008 | WO2008007472A1 Electronic device, method for manufacturing same, and liquid crystal display device |
| 01/17/2008 | WO2008007467A1 Field effect transistor |
| 01/17/2008 | WO2008007466A1 Semiconductor device for high frequency |
| 01/17/2008 | WO2008007327A2 Integrated circuit, transponder, method of producing an integrated circuit and method of producing a transponder |
| 01/17/2008 | WO2008007173A1 Wafer and method of forming alignment markers |
| 01/17/2008 | WO2008006299A1 Method for packing resin coating on a substrate |
| 01/17/2008 | WO2007117819A3 Molded semiconductor package with integrated through hole heat spreader pin(s) |
| 01/17/2008 | WO2007109652A3 Aluminum bump bonding for fine aluminum wire |
| 01/17/2008 | WO2007102062A3 Method and process of manufacturing robust high temperature solder joints |
| 01/17/2008 | WO2007101251A3 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices |
| 01/17/2008 | WO2007057472A3 Method and structure for charge dissipation in integrated circuits |
| 01/17/2008 | US20080014771 Universal-Serial-Bus (USB) Flash-Memory Device With Metal Wrap Formed Over Plastic Housing |
| 01/17/2008 | US20080014739 Silicon nitride/oxygen doped silicon carbide etch stop bi-layer for improved interconnect reliability |
| 01/17/2008 | US20080014719 Semiconductor device and manufacturing method for the same |
| 01/17/2008 | US20080014683 Wiring base, semiconductor device, manufacturing method thereof and electronic equipment |
| 01/17/2008 | US20080014682 Method and system for sealing packages for optics |
| 01/17/2008 | US20080014681 Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same |
| 01/17/2008 | US20080013635 Transformer coils for providing voltage isolation |
| 01/17/2008 | US20080013286 Semiconductor module and heat radiating plate |
| 01/17/2008 | US20080013284 Heat radiation device for memory module |
| 01/17/2008 | US20080013232 Electrostatic discharge protective circuit and semiconductor integrated circuit using the same |
| 01/17/2008 | US20080012572 Semiconductor device having a function of detection breakages on a periphery thereof |
| 01/17/2008 | US20080012156 Reacted with a polyarylene ether flexibilizer; thermoplastic poly(2,3-epoxy-2-methyl ether) thermoplastic; spheriodal particle filler; higher fracture toughness, lower viscosity or increased thermal shock resistance at below -40 degrees C.; encapsulated semiconductor chips |
| 01/17/2008 | US20080012155 Aligned nanotube bearing composite material |
| 01/17/2008 | US20080012154 Molded circuit board and method for the same |
| 01/17/2008 | US20080012153 Direct drive technology chip package |
| 01/17/2008 | US20080012152 Component and method for producing a component |
| 01/17/2008 | US20080012151 Method and an Apparatus for Manufacturing an Electronic Thin-Film Component and an Electronic Thin-Film Component |
| 01/17/2008 | US20080012150 Chip structure |
| 01/17/2008 | US20080012149 Semiconductor chip structure |
| 01/17/2008 | US20080012148 Semiconductor chip package and method manufacturing method thereof |
| 01/17/2008 | US20080012147 Semiconductor device for preventing defective filling of interconnection and cracking of insulating film |
| 01/17/2008 | US20080012146 Semiconductor device and method of fabricating the same |
| 01/17/2008 | US20080012145 Semiconductor Device and Method for Manufacturing the Same |
| 01/17/2008 | US20080012144 Method for producing chip packages, and chip package produced in this way |
| 01/17/2008 | US20080012143 Semiconductor Device and Method of Fabricating the Same |
| 01/17/2008 | US20080012142 Structure and method of chemically formed anchored metallic vias |
| 01/17/2008 | US20080012141 Semiconductor device |
| 01/17/2008 | US20080012140 Wiring substrate, semiconductor device, and method of manufacturing the same |
| 01/17/2008 | US20080012139 Thin film transistor array panel and manufacturing method thereof |
| 01/17/2008 | US20080012138 One-time-programmable anti-fuse formed using damascene process |
| 01/17/2008 | US20080012137 Semiconductor device having trench structures and method |
| 01/17/2008 | US20080012136 Metal Interconnection Structure of Semiconductor Device and Method for Manufacturing the Same |
| 01/17/2008 | US20080012135 Semiconductor Device and Method for Manufacturing the Same |
| 01/17/2008 | US20080012134 Metal interconnection structures and methods of forming the same |
| 01/17/2008 | US20080012133 Reducing resistivity in interconnect structures by forming an inter-layer |
| 01/17/2008 | US20080012132 Chip structure with redistribution traces |
| 01/17/2008 | US20080012131 Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction |
| 01/17/2008 | US20080012130 Semiconductor device, circuit substrate, electro-optic device and electronic appliance |
| 01/17/2008 | US20080012129 Semiconductor device and method of producing the same |
| 01/17/2008 | US20080012128 Semiconductor device and manufacturing method of the same |
| 01/17/2008 | US20080012127 Insulation structure for multilayer passive elements and fabrication method thereof |
| 01/17/2008 | US20080012126 Paper including semiconductor device and manufacturing method thereof |
| 01/17/2008 | US20080012125 Light Emitting Diode Package |
| 01/17/2008 | US20080012124 Curable protectant for electronic assemblies |
| 01/17/2008 | US20080012123 Cooling module against esd and electronic package, assembly and system using the same |
| 01/17/2008 | US20080012122 Integrated circuit heat spreader stacking system |
| 01/17/2008 | US20080012121 Semiconductor device, electro-optical device, and method for manufacturing semiconductor device |
| 01/17/2008 | US20080012120 Multilayer wiring substrate and manufacturing method thereof |
| 01/17/2008 | US20080012119 Semiconductor component and method for producing the same |
| 01/17/2008 | US20080012118 Method of manufacturing semiconductor device |
| 01/17/2008 | US20080012117 Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same |
| 01/17/2008 | US20080012116 Semiconductor device and method of forming the same |
| 01/17/2008 | US20080012115 Methods and apparatus for packaging integrated circuit devices |
| 01/17/2008 | US20080012114 System for contacting electronic devices and production processes thereof |
| 01/17/2008 | US20080012113 Carrier module and test tray for an upright-positionable packaged chip, and testing method |
| 01/17/2008 | US20080012112 Semiconductor package having advantage for stacking and stack-type semiconductor package |
| 01/17/2008 | US20080012111 Semiconductor package and fabrication method thereof |
| 01/17/2008 | US20080012110 Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods |
| 01/17/2008 | US20080012109 Method for the packaging of optical or optoelectronic components, and optical or optoelectronic package element producible according to the method |
| 01/17/2008 | US20080012108 Semiconductor Device, Electronic Card and Pad Rearrangement Substrate |
| 01/17/2008 | US20080012107 Semiconductor device |
| 01/17/2008 | US20080012106 Chip package structure and fabricating method threrof |
| 01/17/2008 | US20080012105 Chip adapter |
| 01/17/2008 | US20080012104 Inverted planar avalanche photodiode |
| 01/17/2008 | US20080012103 Emi absorbing gap filling material |
| 01/17/2008 | US20080012102 Semiconductor-integrated electronic device having a plurality of leads |
| 01/17/2008 | US20080012101 Semiconductor Package Having Improved Adhesion and Solderability |
| 01/17/2008 | US20080012100 Integrated circuit package system with flashless leads |
| 01/17/2008 | US20080012099 Electronic assembly and manufacturing method having a reduced need for wire bonds |
| 01/17/2008 | US20080012098 Integrated circuit package system employing an exposed thermally conductive coating |
| 01/17/2008 | US20080012097 Semiconductor device and wireless device using the semiconductor device |
| 01/17/2008 | US20080012096 Semiconductor chip and method of forming the same |
| 01/17/2008 | US20080012057 Semiconductor Device Using Fuse/Anti-Fuse System and Method of Manufacturing the Same |
| 01/17/2008 | US20080012055 Layout structure of non-volatile memory |
| 01/17/2008 | US20080012042 Semiconductor device and method of producing the same, and power conversion apparatus incororating this semiconductor device |
| 01/17/2008 | US20080012000 Method and apparatus for forming an integrated circuit electrode having a reduced contact area |
| 01/17/2008 | US20080011513 Glossy colored injection molded article |
| 01/17/2008 | US20080011508 Electronic parts packaging structure and method of manufacturing the same |
| 01/17/2008 | US20080011228 Semiconductor device, method for manufacturing the same, and plating solution |
| 01/17/2008 | US20080010823 Method for increasing a production rate of printed wiring boards |
| 01/17/2008 | US20080010822 Method for increasing a production rate of printed wiring boards |
| 01/17/2008 | US20080010819 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof |