| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/24/2008 | US20080017985 Electronic device with a plurality of substrates and method for manufacturing same |
| 01/24/2008 | US20080017984 Blm structure for application to copper pad |
| 01/24/2008 | US20080017983 Flip-chip semiconductor package and chip carrier thereof |
| 01/24/2008 | US20080017982 Semiconductor Chip And Method For Manufacturing Same, Electrode Structure Of Semiconductor Chip And Method For Forming Same, And Semiconductor Device |
| 01/24/2008 | US20080017981 Compliant Bumps for Integrated Circuits Using Carbon Nanotubes |
| 01/24/2008 | US20080017980 Chip Having Two Groups Of Chip Contacts |
| 01/24/2008 | US20080017979 Semiconductor structure having extra power/ground source connections and layout method thereof |
| 01/24/2008 | US20080017978 Semiconductor Device With A High Thermal Dissipation Efficiency |
| 01/24/2008 | US20080017977 Heat dissipating semiconductor package and heat dissipating structure thereof |
| 01/24/2008 | US20080017976 Capillary underfill and mold encapsulation method and apparatus |
| 01/24/2008 | US20080017975 Capillary underflow integral heat spreader |
| 01/24/2008 | US20080017974 Apparatus for housing a micromechanical structure |
| 01/24/2008 | US20080017973 Semiconductor device and manufacturing method therefor |
| 01/24/2008 | US20080017972 Electronic circuit in a package-in-package configuration and production method |
| 01/24/2008 | US20080017971 High speed, high density, low power die interconnect system |
| 01/24/2008 | US20080017970 Brick type stackable semiconductor package |
| 01/24/2008 | US20080017969 Module and method of manufacturing the same |
| 01/24/2008 | US20080017968 Stack type semiconductor package and method of fabricating the same |
| 01/24/2008 | US20080017967 Electronic Circuit in a Package-On-Package Configuration and Method for Producing the Same |
| 01/24/2008 | US20080017966 Pillar Bump Package Technology |
| 01/24/2008 | US20080017965 Semiconductor device and manufacturing method thereof |
| 01/24/2008 | US20080017964 Hybrid Microelectronic Package |
| 01/24/2008 | US20080017963 Si-substrate and structure of opto-electronic package having the same |
| 01/24/2008 | US20080017962 Si-substrate and structure of opto-electronic package having the same |
| 01/24/2008 | US20080017960 Integrated circuit package system with laminate base |
| 01/24/2008 | US20080017959 Surface mount multichip devices |
| 01/24/2008 | US20080017958 Chip package structure |
| 01/24/2008 | US20080017957 Leaded stacked packages having integrated upper lead |
| 01/24/2008 | US20080017956 Interconnect structure for semiconductor package |
| 01/24/2008 | US20080017955 Integrated circuit package system with offset stacked die |
| 01/24/2008 | US20080017954 Semiconductor device and semiconductor device manufacturing method |
| 01/24/2008 | US20080017948 Structures of high-voltage MOS devices with improved electrical performance |
| 01/24/2008 | US20080017926 Semiconductor structure of a high side driver and method for manufacturing the same |
| 01/24/2008 | US20080017907 Semiconductor Module with a Power Semiconductor Chip and a Passive Component and Method for Producing the Same |
| 01/24/2008 | US20080017889 Wiring structure of a semiconductor device, method of forming the wiring structure, non-volatile memory device including the wiring structure, and method of manufacturing the non-volatile memory device |
| 01/24/2008 | US20080017884 Display substrate, display apparatus having the display substrate and method for manufacturing the display apparatus |
| 01/24/2008 | US20080017879 Methods and apparatus for packaging integrated circuit devices |
| 01/24/2008 | US20080017862 Array substrate, display device having the same and method of manufacturing the same |
| 01/24/2008 | US20080017857 Method of adding fabrication monitors to integrated circuit chips |
| 01/24/2008 | US20080017856 Wafer and semiconductor device testing method |
| 01/24/2008 | US20080017855 Display Substrate, Method of Manufacturing the Same and Display Device Having the Same |
| 01/24/2008 | US20080017700 Semiconductor device and an information management system therefor |
| 01/24/2008 | US20080017618 On-the-fly laser beam path error correction for specimen target location processing |
| 01/24/2008 | US20080017410 Method for forming a plated microvia interconnect |
| 01/24/2008 | US20080017367 Method, Device and System for Controlling Heating Circuits |
| 01/24/2008 | US20080017355 Case for a liquid submersion cooled electronic device |
| 01/24/2008 | US20080017223 Conductive adhesive rework method |
| 01/24/2008 | US20080017220 Apparatus for cleaning a substrate having metal interconnects |
| 01/24/2008 | US20080016941 Calibrating Device On A Silicon Substrate |
| 01/24/2008 | DE19956107B4 Form einer durch einen Laserstrahl hergestellten Mikromarkierung und Verfahren zur Mikromarkierung Form of a micro-marking and procedures produced by a laser beam to micromarking |
| 01/24/2008 | DE112006000745T5 Chip-Scale-Gehäuse Chip-scale package |
| 01/24/2008 | DE112006000568T5 Leistungshalbleiterbaugruppe Power semiconductor module |
| 01/24/2008 | DE10331857B4 Gießharzversiegelte Leistungshalbleitervorrichtung und Verfahren zu deren Herstellung Gießharzversiegelte power semiconductor device and process for their preparation |
| 01/24/2008 | DE10240355B4 Verbundbauteil und Verfahren zur Herstellung eines Verbundbauteiles Composite component and process for producing a composite component |
| 01/24/2008 | DE102006033887A1 Multi-layer body manufacturing method for e.g. polymer solar cell, involves providing transfer foil with transmission layers, and forming electrically conductive layer by transmission of layers from transfer foil to multi-layer body |
| 01/24/2008 | DE102006033319A1 Halbleiterbauelement in Halbleiterchipgröße mit einem Halbleiterchip und Verfahren zur Herstellung desselben Of the same semiconductor device in the semiconductor chip size of a semiconductor chip and method for producing |
| 01/24/2008 | DE102006033228A1 Heat-dissipating device manufacture for memory, involves integrally forming protrusions on one side of metal plate and flat portion on the other side of the metal plate |
| 01/24/2008 | DE102006033222A1 Modul mit flachem Aufbau und Verfahren zur Bestückung Module having a flat structure and method for mounting |
| 01/24/2008 | DE102006033178A1 Packed electronic component manufacturing method for mounting on printed circuit board, involves pre-centrally allowing electronic component with respect to centering tool that is premounted in printed circuit board using pre-centering unit |
| 01/24/2008 | DE102006033023A1 Semiconductor arrangement, has retaining substrate and controlling structure, which are formed by punched grid, and semiconductor is provided, which is pasted and soldered on punched grid, and is connected by electrical round plates |
| 01/24/2008 | DE102006032925A1 Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen Method for the encapsulation of electronic components and integrated circuits |
| 01/24/2008 | DE102006032073A1 Bauelement und Verfahren zum Herstellen eines Bauelements Device and method for manufacturing a device |
| 01/24/2008 | DE102006031769A1 Sensor unit e.g. rotary rate sensor, for use in electronic stability system of vehicle, has casing for covering sensor structure i.e. micromechanical sensor structure, where casing is partially made of porous silicon |
| 01/24/2008 | DE102006012232B4 Verfahren zur selektiven Herstellung von Folienlaminaten zum Packaging und zur Isolation von ungehäusten elektronischen Bauelementen und Leiterbahnen A process for the selective production of film laminates for packaging and insulation of bare electronic components and conductors |
| 01/24/2008 | DE102005006995B4 Halbleiterbauteil mit Kunstoffgehäuse und Außenanschlüssen sowie Verfahren zur Herstellung desselben Of the same semiconductor device with plastic housing and external terminals and methods for preparing |
| 01/24/2008 | DE102004047660B4 Bauteil mit integrierter Kapazitätsstruktur Component with integrated capacitance structure |
| 01/24/2008 | DE102004037011B4 Flüssigkristallanzeigevorrichtung A liquid crystal display device |
| 01/24/2008 | DE102004002908B4 Verfahren zum Herstellen eines Halbleiterbauelements oder einer mikromechanischen Struktur A method of manufacturing a semiconductor device or a micromechanical structure |
| 01/24/2008 | CA2653918A1 Method for encasing electronic components and integrated circuits |
| 01/23/2008 | EP1881751A1 Ceramic multilayer board |
| 01/23/2008 | EP1881538A1 Electronic component for heat transfer by boiling and condensation, and manufacturing method |
| 01/23/2008 | EP1881529A2 Thermal conduit |
| 01/23/2008 | EP1881394A1 Liquid-cooling heat dissipating device for dissipating heat by a casing |
| 01/23/2008 | EP1881366A1 Array substrate with copper conductors, display device having the same and method of manufacturing the same |
| 01/23/2008 | EP1880417A2 Silicon chips provided with inclined contact pads and an electronic module comprising said silicon chip |
| 01/23/2008 | EP1880389A2 Nonvolatile memory cell comprising a diode and a resistance-switching material |
| 01/23/2008 | EP1142019B1 Circuit assembly with at least one nanoelectronic component and method for producing the same |
| 01/23/2008 | EP0968529B1 Semiconductor device and method of manufacturing such a device |
| 01/23/2008 | CN201011755Y Radiator |
| 01/23/2008 | CN201011754Y Radiating conduit |
| 01/23/2008 | CN201011655Y Large power semiconductor device frame |
| 01/23/2008 | CN101112134A Packaging installation module |
| 01/23/2008 | CN101111936A Semiconductor chip with identification codes, manufacturing method of the chip and semiconductor chip management system |
| 01/23/2008 | CN101111935A Semiconductor apparatus |
| 01/23/2008 | CN101111562A Molding composition and method, and molded article |
| 01/23/2008 | CN101111528A Resin compositions, cured article obtained therefrom, and sheet |
| 01/23/2008 | CN101111142A Heat radiating device |
| 01/23/2008 | CN101111141A Heat radiator |
| 01/23/2008 | CN101111140A Heat radiating device |
| 01/23/2008 | CN101111139A Heat radiating device |
| 01/23/2008 | CN101111138A Heat sink assembly |
| 01/23/2008 | CN101111125A Multilayer interconnection board |
| 01/23/2008 | CN101111124A Silver alloy material, circuit board, electronic device and method of producing circuit board |
| 01/23/2008 | CN101111117A Integrated circuit and protective circuit |
| 01/23/2008 | CN101110555A Power converter |
| 01/23/2008 | CN101110462A Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices |
| 01/23/2008 | CN101110452A Adhered sheet type infrared receiver internal screening device |
| 01/23/2008 | CN101110448A Thin-film transistor, pixel structure and LCD panel |
| 01/23/2008 | CN101110443A Display substrate, method of manufacturing and display device comprising the substrate |
| 01/23/2008 | CN101110442A Image display system |