| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/21/2008 | US20080042254 Semiconductor device and manufacturing method of the same |
| 02/21/2008 | US20080042253 Stack type ball grid array package and method for manufacturing the same |
| 02/21/2008 | US20080042252 Stackable ceramic fbga for high thermal applications |
| 02/21/2008 | US20080042251 Stackable semiconductor package |
| 02/21/2008 | US20080042250 Stacked microelectronic assemblies and methods therefor |
| 02/21/2008 | US20080042249 Microelectronic package |
| 02/21/2008 | US20080042248 Method of enabling solder deposition on a substrate and electronic package formed thereby |
| 02/21/2008 | US20080042247 Stacked Semiconductor Components With Through Wire Interconnects (TWI) |
| 02/21/2008 | US20080042246 Integrated circuit including clip |
| 02/21/2008 | US20080042245 Integrated circuit package system with waferscale spacer |
| 02/21/2008 | US20080042239 High performance system-on-chip using post passivation process |
| 02/21/2008 | US20080042238 High performance system-on-chip using post passivation process |
| 02/21/2008 | US20080042208 Trench mosfet with esd trench capacitor |
| 02/21/2008 | US20080042207 Contact array layout for improving ESD capability of CMOS transistors |
| 02/21/2008 | US20080042206 Integrated circuit device having input/output electrostatic discharge protection cell equipped with electrostatic discharge protection element and power clamp |
| 02/21/2008 | US20080042203 Single and double-gate pseudo-fet devices for semiconductor materials evaluation |
| 02/21/2008 | US20080042175 Solid state image pickup device and method of producing solid state image pickup device |
| 02/21/2008 | US20080042155 Semiconductor device, LED head and image forming apparatus |
| 02/21/2008 | US20080042142 Highly Heat-Resistant Synthetic Polymer Compound and High Withstand Voltage Semiconductor Device |
| 02/21/2008 | US20080041625 Apparatus, system and method for use in mounting electronic elements |
| 02/21/2008 | US20080041607 Microcomponent Comprising a Hermetically-Sealed Microcavity and Method for Production of Such a Microcomponent |
| 02/21/2008 | US20080041568 Direct facility water test head cooling architecture |
| 02/21/2008 | US20080041566 Computer Cooling Apparatus |
| 02/21/2008 | US20080041560 Diamond heat sink |
| 02/21/2008 | US20080041067 Thermoelectric conversion device and manufacture method of the same |
| 02/21/2008 | US20080040925 Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same |
| 02/21/2008 | DE202007017043U1 Kühlmodul mit einer veränderbaren Positionierung Cooling module with a variable positioning |
| 02/21/2008 | DE112006000954T5 Halbleiterpaket Semiconductor package |
| 02/21/2008 | DE112006000645T5 Systeme für eine verbesserte passive Flüssigkeitskühlung Systems for improved passive liquid cooling |
| 02/21/2008 | DE10250538B4 Elektronisches Bauteil als Multichipmodul und Verfahren zu dessen Herstellung Electronic component as a multi-chip module and method of producing the |
| 02/21/2008 | DE102007037543A1 Gehäuse für eine integrierte Schaltung mit einer Wärmeabgabeeinheit und Verfahren zu dessen Herstellung Package for an integrated circuit having a heat dissipation unit and process for its preparation |
| 02/21/2008 | DE102007034247A1 Vorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung Apparatus and method for manufacturing a semiconductor device |
| 02/21/2008 | DE102006052202B3 Semiconductor component has metal layer comprising coherent section, and other metal layer is arranged on coherent section of former metal layer, where latter metal layer is structured between layered regions |
| 02/21/2008 | DE102006038875A1 Electronic unit manufacturing method, involves fastening semiconductor unit to carrier, and providing wire bond connection between semiconductor unit and carrier by applying conductive embossed contact sill on carrier |
| 02/21/2008 | DE102006038552A1 Beleuchtungsmodul und Verfahren zur Herstellung eines Beleuchtungsmoduls Lighting module and method of manufacturing a illumination module |
| 02/21/2008 | DE102006037538A1 Elektronisches Bauteil bzw. Bauteilstapel und Verfahren zum Herstellen eines Bauteils Electronic component or component stack and method for manufacturing a component |
| 02/21/2008 | DE102006033864A1 Elektronische Schaltung in einer Package-in-Package-Konfiguration und Herstellungsverfahren für eine solche Schaltung Electronic circuit in a package-on-package configuration and manufacturing method for such a circuit |
| 02/21/2008 | DE102006033856B3 Temperaturmesssensor und Verfahren zu dessen Herstellung Temperature measuring sensor and method for its production |
| 02/21/2008 | DE102006030581B3 Verfahren zum Herstellen eines Bauelements A method of manufacturing a device |
| 02/21/2008 | DE102005025465B4 Halbleiterbauteil mit Korrosionsschutzschicht und Verfahren zur Herstellung desselben Of the same semiconductor device with an anticorrosive layer and processes for preparing |
| 02/21/2008 | DE102004050027B4 Verfahren zum Herstellen eines Wafer Level Packages A method of manufacturing a wafer-level packages |
| 02/20/2008 | EP1890331A2 Air cooled computer chip |
| 02/20/2008 | EP1890330A1 Heat sink and method of manufacturing the same |
| 02/20/2008 | EP1890329A1 Mounted board, mounted body, and electronic device using same |
| 02/20/2008 | EP1890326A2 Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure |
| 02/20/2008 | EP1890325A1 Aligning stage, bump forming apparatus and bump forming method using such aligning stage |
| 02/20/2008 | EP1890324A2 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 02/20/2008 | EP1889877A1 Semiconductor device encapsulated by silicon resin composition, and silicone resin tablet for encapsulating semiconductor device |
| 02/20/2008 | EP1889343A2 High current electrical switch and method |
| 02/20/2008 | EP1889290A2 Integrated circuit die attach using backside heat spreader |
| 02/20/2008 | EP1889285A2 Backside method and system for fabricating semiconductor components with conductive interconnects |
| 02/20/2008 | EP1889262A1 Anti-fuse memory device |
| 02/20/2008 | EP1508162A4 Method for producing an electrical circuit |
| 02/20/2008 | EP1433208A4 Phonon-blocking, electron-transmitting low-dimensional structures |
| 02/20/2008 | EP1374310A4 Nanofabrication |
| 02/20/2008 | EP0749633B1 Method of manufacturing a semiconductor die carrier |
| 02/20/2008 | CN201025750Y Fixed buckler for heat radiator |
| 02/20/2008 | CN201025749Y Heat radiator |
| 02/20/2008 | CN201025621Y LED device |
| 02/20/2008 | CN201025616Y Heat radiation module for LED encapsulation |
| 02/20/2008 | CN201025614Y Semiconductor encapsulation structure for surface printing heat dispersion glue connection dielectric layer |
| 02/20/2008 | CN201025613Y Coattail semiconductor rack encapsulation structure |
| 02/20/2008 | CN201025612Y Porcelain heat dispersion semiconductor encapsulation structure |
| 02/20/2008 | CN201025525Y Computer system |
| 02/20/2008 | CN101129102A Ceramic substrate, electronic apparatus, and method for producing ceramic substrate |
| 02/20/2008 | CN101128931A Microelectronic assemblies having compliancy |
| 02/20/2008 | CN101128930A Systems for improved passive liquid cooling |
| 02/20/2008 | CN101128926A Structure and method for fabricating flip chip devices |
| 02/20/2008 | CN101128921A Semiconductor integrated circuit |
| 02/20/2008 | CN101128556A Method for felting underlay |
| 02/20/2008 | CN101128543A Resin composition and coating film forming material containing the same |
| 02/20/2008 | CN101128505A Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin |
| 02/20/2008 | CN101128105A Radiator |
| 02/20/2008 | CN101128103A Heat conduction module and its making method |
| 02/20/2008 | CN101128102A Heat radiator and its radiator |
| 02/20/2008 | CN101128101A Heat radiator assembly |
| 02/20/2008 | CN101127388A Organic EL part with static protection structure and its making method |
| 02/20/2008 | CN101127384A 发光装置 Light-emitting device |
| 02/20/2008 | CN101127361A Pixel structure and LCD panel |
| 02/20/2008 | CN101127358A Thin-film transistor substrate, method of manufacturing the same and display apparatus having the same |
| 02/20/2008 | CN101127357A Passivation layer structure, thin film transistor part and manufacturing method of passivation layer |
| 02/20/2008 | CN101127351A Grid contact and conduction channel in high-density groove metal oxide semiconductor field effect transistor (MOSFET) |
| 02/20/2008 | CN101127350A Apparatus, system and method for use in mounting electronic elements |
| 02/20/2008 | CN101127349A Plastic overmolded packages with mechanically decoupled lid attach attachment |
| 02/20/2008 | CN101127348A Plastic overmolded packages with molded lid attachments |
| 02/20/2008 | CN101127347A Semiconductor device and method of manufacturing the same |
| 02/20/2008 | CN101127345A Semiconductor device and manufacturing method thereof |
| 02/20/2008 | CN101127344A Integrated circuit (IC) package and stacking IC packages device and manufacture method |
| 02/20/2008 | CN101127343A Structure for integrating IC integration base board and carrier board, its manufacturing method and manufacturing method of electronic device |
| 02/20/2008 | CN101127342A Thin film coating wafer encapsulation structure for reducing soft plate distortion |
| 02/20/2008 | CN101127341A Integrated circuit for defining crystal particle function with below welding and its making method |
| 02/20/2008 | CN101127340A Semiconductor device and wire bonding method used for the same |
| 02/20/2008 | CN101127339A Encapsulation structure for high frequency integrated circuit and its making method |
| 02/20/2008 | CN101127338A Encapsulation structure of lead rack base ball grid array and its wafer carrier |
| 02/20/2008 | CN101127337A Chip encapsulation structure |
| 02/20/2008 | CN101127336A Semiconductor device, manufacturing method thereof, circuit substrate and electric device |
| 02/20/2008 | CN101127335A An encapsulation image compensation method and device for ball array encapsulation welding tray |
| 02/20/2008 | CN101127334A Integrated circuit packages and its manufacture method |
| 02/20/2008 | CN101127333A Semiconductor device and manufacturing method of the same |
| 02/20/2008 | CN101127332A Pin ball grid array encapsulation structure of wafer |