| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/10/2008 | US20080006925 Integrated circuit package-in-package system |
| 01/10/2008 | US20080006924 Package mounted module |
| 01/10/2008 | US20080006923 Electronic Module with Switching Functions and Method for Producing the Same |
| 01/10/2008 | US20080006922 Thermal release adhesive-backed carrier tapes |
| 01/10/2008 | US20080006921 Integrated circuit packaging system with ultra-thin die |
| 01/10/2008 | US20080006920 Multi-chip semiconductor connector assemblies |
| 01/10/2008 | US20080006919 Flip chip package and method of fabricating the same |
| 01/10/2008 | US20080006918 Surface mounting structure for electronic component |
| 01/10/2008 | US20080006917 Chip package structure and fabricating method threrof |
| 01/10/2008 | US20080006916 Method of Manufacturing a Semiconductor Device |
| 01/10/2008 | US20080006915 Semiconductor package, method of production of same, printed circuit board, and electronic apparatus |
| 01/10/2008 | US20080006914 Semiconductor device |
| 01/10/2008 | US20080006913 Integrated semiconductor chip with lateral thermal insulation |
| 01/10/2008 | US20080006912 Electrical connector |
| 01/10/2008 | US20080006911 Silver layer formed by electrosilvering substrate material |
| 01/10/2008 | US20080006910 Semiconductor Device and Method for Manufacturing Semiconductor Device |
| 01/10/2008 | US20080006909 Method of increasing the area of a useful layer of material transferred onto a support |
| 01/10/2008 | US20080006905 Method for production of an integrated circuit bar arrangement, in particular comprising a capacitor assembly, as well as an integrated circuit arrangement |
| 01/10/2008 | US20080006900 Semiconductor Package and Method for Producing the Same |
| 01/10/2008 | US20080006897 Semiconductor Device |
| 01/10/2008 | US20080006877 Method of Forming a Solution Processed Device |
| 01/10/2008 | US20080006389 Preventing burst-related hazards in microelectronic cooling systems |
| 01/10/2008 | US20080006037 Computer cooling apparatus |
| 01/10/2008 | US20080005902 Method for increasing a production rate of printed wiring boards |
| 01/10/2008 | US20080005897 Flexible wiring sheet, display apparatus and manufacturing method thereof |
| 01/10/2008 | US20080005886 Thermal interface apparatus, systems, and fabrication methods |
| 01/10/2008 | DE202007015200U1 Kühlmodul Cooling module |
| 01/10/2008 | DE202007014837U1 Kühlmodul Cooling module |
| 01/10/2008 | DE19960503B4 Metall-Verbindungs-Kontakt-Struktur mit einem kleinen Kontaktwiderstand und einem geringen Übergangsverlust sowie Verfahren zur Herstellung derselben Metal connection contact structure with a small contact resistance and a low loss transition as well as methods for producing the same |
| 01/10/2008 | DE10238816B4 Verfahren zur Herstellung von Anschlussbereichen einer integrierten Schaltung und integrierte Schaltung mit Anschlussbereichen A process for the production of connection areas of an integrated circuit and integrated circuit with connection areas |
| 01/10/2008 | DE102006062728A1 Semiconductor device with a multi-layered interconnecting structure, useful for highly integrated semiconductor circuits, comprises an UV-light blocking film, a porous insulating film and a connecting layer |
| 01/10/2008 | DE102006031844A1 Verfahren zur Befestigung von elektrischen Bauelementen auf einem Träger durch Drucksinterung und Schaltungsanordnung A method for mounting electric components on a substrate by pressure sintering, and the circuit arrangement |
| 01/10/2008 | DE102006031515A1 Component passivation device, has barrier connected with carrier substrate for forming inner area of housing by connecting areas, where one of connecting areas has large distance relative to other connecting area |
| 01/10/2008 | DE102006021673B3 Cooling unit for electronic component, particularly power transistor, has two cooling elements, where housing recess is provided on other opposite side for accommodating projection adjacent to cooling elements |
| 01/10/2008 | DE102005056569B4 Zwischenverbindung für Flip-Chip in Package Aufbauten Intermediate for flip-chip package in structures |
| 01/10/2008 | DE10129388B4 Verfahren zur Herstellung eines elektronischen Bauteils A method of manufacturing an electronic component |
| 01/10/2008 | DE10101948B4 Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat und auf einem Substrat montierbarer Halbleiterbaustein A method for disposing a semiconductor chip on a substrate and on a substrate mountable semiconductor module |
| 01/10/2008 | DE10045043B4 Halbleiterbauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 01/10/2008 | CA2656316A1 Electronic module configured for air flow therethrough and system including same |
| 01/09/2008 | EP1876643A1 Semiconductor-integrated electronic device having a plurality of leads |
| 01/09/2008 | EP1876642A1 Electronic component mounting board and electronic device using same |
| 01/09/2008 | EP1876276A1 Carbon fiber composite sheet, use of the same as heat transferring article, and sheet for pitch-based carbon fiber mat for use therein |
| 01/09/2008 | EP1876250A1 Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCTION THEREOF |
| 01/09/2008 | EP1875504A2 Molded lead frame connector with one or more passive components |
| 01/09/2008 | EP1875503A2 Structure for stacking an integrated circuit on another integrated circuit |
| 01/09/2008 | EP1875502A1 Method of producing a wall, particularly a wall of a micro heat exchanger, and micro heat exchanger comprising, in particular, nanotubes |
| 01/09/2008 | EP1875501A1 Protection of an integrated circuit and method therefor |
| 01/09/2008 | EP1874870A1 Curable silicone composition and electronic components |
| 01/09/2008 | EP1505121B1 Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product |
| 01/09/2008 | EP1461829B1 Dual cure b-stageable underfill for wafer level |
| 01/09/2008 | EP1428257B1 Apparatus with compliant electrical terminals, and methods for forming same |
| 01/09/2008 | EP1419527B1 Adhesive tape |
| 01/09/2008 | CN201004754Y Audio power amplifier |
| 01/09/2008 | CN201004751Y Easy-to-dismantle heat dispersion device |
| 01/09/2008 | CN201004750Y Heat dispersion component, fan base and computer with heat dispersion component |
| 01/09/2008 | CN201004747Y Heat dispersion body and combination structure with thermal tube |
| 01/09/2008 | CN201004746Y System module free of fan heat dispersion |
| 01/09/2008 | CN201004469Y A high-power LED |
| 01/09/2008 | CN201004468Y LED improvement |
| 01/09/2008 | CN201004466Y A LED encapsulation structure with high light output rate |
| 01/09/2008 | CN201004460Y A LED lamp based on COA technology |
| 01/09/2008 | CN201004459Y Wind guiding cover heat radiation fan of computer CPU |
| 01/09/2008 | CN201004458Y Heat radiation device of LED |
| 01/09/2008 | CN201004240Y Encapsulation structure of memory card |
| 01/09/2008 | CN201003737Y Heat dissipation structure light-emitting diode head light |
| 01/09/2008 | CN101103659A Heat sink with microchannel cooling for power devices |
| 01/09/2008 | CN101103656A Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 01/09/2008 | CN101103460A Leadframe, semiconductor package and method for producing the same |
| 01/09/2008 | CN101103459A Wiring patterns formed by selective metal plating |
| 01/09/2008 | CN101103458A Heat radiation material and its production method |
| 01/09/2008 | CN101103457A Systems and methods for removing operating heat from a light emitting diode |
| 01/09/2008 | CN101103455A Semiconductor device |
| 01/09/2008 | CN101103454A Semiconductor chip and wafer production method |
| 01/09/2008 | CN101103450A Semiconductor device |
| 01/09/2008 | CN101103447A Method for forming dielectric film |
| 01/09/2008 | CN101102658A Heat sink arrangement, electric motor, housing part, and springy clip |
| 01/09/2008 | CN101102657A Micro slot cluster liquid absorption chip, micro slot cluster liquid absorption core and integrated heat thermal tube radiator |
| 01/09/2008 | CN101102656A Closed loop automatic compensation heat dispersion method and device |
| 01/09/2008 | CN101102655A Heat radiator |
| 01/09/2008 | CN101102642A 多层印刷电路板 Multilayer printed circuit board |
| 01/09/2008 | CN101102639A Wiring board and semiconductor device excellent in folding endurance |
| 01/09/2008 | CN101102638A COF flexible printed wiring board and manufacturing method for the same |
| 01/09/2008 | CN101102040A High-voltage I/O Buffer circuit structure |
| 01/09/2008 | CN101101952A Solid-state component and solid-state component device |
| 01/09/2008 | CN101101950A Silver layer formed by electrosilvering substrate material |
| 01/09/2008 | CN101101948A A high-power LED luminescent part |
| 01/09/2008 | CN101101945A A low-stress LED inversely installed power chip and its preparation |
| 01/09/2008 | CN101101944A Sub-mount for mounting light emitting device and light emitting device package |
| 01/09/2008 | CN101101941A Method for the packaging of optical or optoelectronic components, and optical or optoelectronic package element producible according to the method |
| 01/09/2008 | CN101101920A Light-emitting device and electronic apparatus |
| 01/09/2008 | CN101101918A Semiconductor device and its making method |
| 01/09/2008 | CN101101917A Active array base board for plane display and its repair method |
| 01/09/2008 | CN101101916A Semiconductor device and manufacturing method thereof |
| 01/09/2008 | CN101101915A Method for fabricating sige-on-insulator substrate material and the substrate |
| 01/09/2008 | CN101101914A Array substrate, and manufacturing method thereof, liquid crystal display device having the same |
| 01/09/2008 | CN101101913A Thin film transistor array |
| 01/09/2008 | CN101101912A Semiconductor device having an inductor |
| 01/09/2008 | CN101101911A Temperature detecting method, temperature detecting circuit and semiconductor device |
| 01/09/2008 | CN101101910A LED module |
| 01/09/2008 | CN101101909A Semiconductor device and method of manufacturing the same |