| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/20/2008 | CN101127331A Electronic package comprising semiconductor chip and its manufacture method |
| 02/20/2008 | CN101127330A Structure combining IC integration base board and carrier board and its manufacturing method for electronic device |
| 02/20/2008 | CN101127313A Resin material |
| 02/20/2008 | CN101127309A A making method for thermal sediment of GaAs single-chip microwave integration circuit power amplifier |
| 02/20/2008 | CN101127097A Double interface IC card and its production method |
| 02/20/2008 | CN101126950A Apparatus, data processing apparatus and heat radiating member |
| 02/20/2008 | CN101126879A Liquid crystal display and method for fabricating the same |
| 02/20/2008 | CN101126873A Liquid crystal display device and method of fabricating the same |
| 02/20/2008 | CN101126016A Heat interface materials |
| 02/20/2008 | CN101126010A Bi-component silicon resin for sealing power-type LED and synthesis method thereof |
| 02/20/2008 | CN101125482A Structure with through hole, production method thereof, and liquid discharge head |
| 02/20/2008 | CN100370887C Improved structure of stacked vias in multiple layer electronic device carriers |
| 02/20/2008 | CN100370659C Micro-channel heat sink structure for semiconductor laser head pumping source and preparing method thereof |
| 02/20/2008 | CN100370634C Thermoelectric modular |
| 02/20/2008 | CN100370623C Semiconductor device and method for manufacturing the same |
| 02/20/2008 | CN100370612C 半导体装置 Semiconductor device |
| 02/20/2008 | CN100370611C Electronic assembly stacking structure |
| 02/20/2008 | CN100370609C Oblique recess for interconnecting conductors in a semiconductor device |
| 02/20/2008 | CN100370608C Device and method for reducing dishing of critical on-chip interconnect lines |
| 02/20/2008 | CN100370607C Semiconductor device and manufacturing method thereof |
| 02/20/2008 | CN100370606C Semiconductor device and its producing method |
| 02/20/2008 | CN100370605C Heat sink for heat pipe |
| 02/20/2008 | CN100370604C Heat interface material and its producing method |
| 02/20/2008 | CN100370603C Mounting structure of semiconductor chip, liquid crystal device, and electronic equipment |
| 02/20/2008 | CN100370602C Board for mounting semiconductor element, method for manufacturing same, and semiconductor device |
| 02/20/2008 | CN100370598C Method of manufacturing high performance copper inductors |
| 02/20/2008 | CN100370595C Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it |
| 02/20/2008 | CN100370589C Novel integrated circuit or discrete components ultra-thin non-pin packing technology and packing arrangement |
| 02/20/2008 | CN100370581C Sheet material for forming chip protection film |
| 02/20/2008 | CN100370580C Semiconductor wafer and its producing method |
| 02/20/2008 | CN100370349C Thin film transistor circuit device, production method thereof and liquid crystal display using the thin film transistor circuit device |
| 02/20/2008 | CN100370339C Organic electroluminescen device and liquid crystal display device |
| 02/20/2008 | CN100370318C Electrooptical apparatus and electronic apparatus |
| 02/20/2008 | CN100370210C Method for filling up slots between heat conductive parts as well as structure of part |
| 02/20/2008 | CN100370145C Oil-proof device of fan |
| 02/19/2008 | US7334131 Protected storage of a datum in an integrated circuit |
| 02/19/2008 | US7333346 Circuit board having test coupon and method for evaluating the circuit board |
| 02/19/2008 | US7333335 Using the wave soldering process to attach motherboard chipset heat sinks |
| 02/19/2008 | US7333334 Liquid cooling system and electronic equipment using the same |
| 02/19/2008 | US7333200 Overlay metrology method and apparatus using more than one grating per measurement direction |
| 02/19/2008 | US7333061 RFID device and method of making |
| 02/19/2008 | US7332823 Providing a metal layer in a semiconductor package |
| 02/19/2008 | US7332822 Flip chip system with organic/inorganic hybrid underfill composition |
| 02/19/2008 | US7332821 Compressible films surrounding solder connectors |
| 02/19/2008 | US7332820 Stacked die in die BGA package |
| 02/19/2008 | US7332819 Stacked die in die BGA package |
| 02/19/2008 | US7332818 Multi-chip electronic package with reduced line skew and circuitized substrate for use therein |
| 02/19/2008 | US7332817 Die and die-package interface metallization and bump design and arrangement |
| 02/19/2008 | US7332816 Method of fabricating crossing wiring pattern on a printed circuit board |
| 02/19/2008 | US7332815 Semiconductor device |
| 02/19/2008 | US7332814 Bondwire utilized for coulomb counting and safety circuits |
| 02/19/2008 | US7332813 Semiconductor device |
| 02/19/2008 | US7332812 Memory card with connecting portions for connection to an adapter |
| 02/19/2008 | US7332811 Integrated circuit interconnect |
| 02/19/2008 | US7332810 Integrated circuit device and method of producing the same |
| 02/19/2008 | US7332809 Glass substrate having a grooved portion, method for fabricating the same, and press mold for fabricating the glass substrate |
| 02/19/2008 | US7332808 Semiconductor module and method of manufacturing the same |
| 02/19/2008 | US7332807 Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
| 02/19/2008 | US7332806 Thin, thermally enhanced molded package with leadframe having protruding region |
| 02/19/2008 | US7332805 Electronic package with improved current carrying capability and method of forming the same |
| 02/19/2008 | US7332804 Semiconductor device and method of manufacturing the same |
| 02/19/2008 | US7332803 Circuit device |
| 02/19/2008 | US7332802 Package for semiconductor light emitting element and semiconductor light emitting device |
| 02/19/2008 | US7332800 Semiconductor device |
| 02/19/2008 | US7332799 Packaged chip having features for improved signal transmission on the package |
| 02/19/2008 | US7332798 Non-contact ID card and manufacturing method thereof |
| 02/19/2008 | US7332797 Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold |
| 02/19/2008 | US7332796 Devices and methods of preventing plasma charging damage in semiconductor devices |
| 02/19/2008 | US7332795 Dielectric passivation for semiconductor devices |
| 02/19/2008 | US7332793 Semiconductor device |
| 02/19/2008 | US7332792 Magnetic layer processing |
| 02/19/2008 | US7332791 Electrically programmable polysilicon fuse with multiple level resistance and programming |
| 02/19/2008 | US7332778 Semiconductor device and method of manufacturing same |
| 02/19/2008 | US7332765 Variable resistance functional body and storage device |
| 02/19/2008 | US7332764 Metal-insulator-metal (MIM) capacitor and method of fabricating the same |
| 02/19/2008 | US7332757 MOSFET package |
| 02/19/2008 | US7332734 Lithography apparatus and pattern forming method using the same having an liquid crystal panel for a photo mask function |
| 02/19/2008 | US7332732 Alignment systems and methods for lithographic systems |
| 02/19/2008 | US7332701 Dual-mode CMOS imaging sensor with supporting LED |
| 02/19/2008 | US7332430 Method for improving the mechanical properties of BOC module arrangements |
| 02/19/2008 | US7332428 Metal interconnect structure and method |
| 02/19/2008 | US7332427 Method of forming an interconnection line in a semiconductor device |
| 02/19/2008 | US7332426 Substrate processing method and fabrication process of a semiconductor device |
| 02/19/2008 | US7332406 Air gap interconnect structure and method |
| 02/19/2008 | US7332405 Method of forming alignment marks for semiconductor device fabrication |
| 02/19/2008 | US7332401 Method of fabricating an electrode structure for use in an integrated circuit |
| 02/19/2008 | US7332387 MOSFET structure and method of fabricating the same |
| 02/19/2008 | US7332376 Method of encapsulating packaged microelectronic devices with a barrier |
| 02/19/2008 | US7332373 Method of manufacturing semiconductor device |
| 02/19/2008 | US7332372 Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween |
| 02/19/2008 | US7332371 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 02/19/2008 | US7332363 Integrated battery pack with lead frame connection |
| 02/19/2008 | US7332358 MOSFET temperature sensing |
| 02/19/2008 | US7332255 enables the user to measure process line shortening on an overlay tool; means for determining the misalignment, means for determining total line shortening, means for determining the equipment line shortening, and means for determining process line shortening |
| 02/19/2008 | US7332231 Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same |
| 02/19/2008 | US7332212 Immersion of polytetrafluoroethylene dielectric layers in solutions comprising electroconductive polymers and intermetallic seeding materials, then rinsing, drying and coppering to form printed circuits or laminated chip carriers; electronics; printed circuit boards (PCBs), laminated chip carriers |
| 02/19/2008 | US7331756 Axial-flow fan unit and heat-emitting element cooling apparatus |
| 02/19/2008 | US7331502 Method of manufacturing electronic part and electronic part obtained by the method |
| 02/19/2008 | US7331500 Solder bumps formation using solder paste with shape retaining attribute |
| 02/19/2008 | US7331190 Liquid/coolant system including boiling sensor |