| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/29/2008 | US7324328 Integrated ultracapacitor as energy source |
| 01/29/2008 | US7324155 Camera case structure for a mobile communication device |
| 01/29/2008 | US7323905 Programmable structured arrays |
| 01/29/2008 | US7323788 Semiconductor device and manufacturing method of them |
| 01/29/2008 | US7323787 Off-grid decoupling of ball grid array (BGA) devices and method |
| 01/29/2008 | US7323786 Semiconductor device package of stacked semiconductor chips with spacers provided therein |
| 01/29/2008 | US7323783 Electrode, method for producing same and semiconductor device using same |
| 01/29/2008 | US7323781 Semiconductor device and manufacturing method thereof |
| 01/29/2008 | US7323780 Electrical interconnection structure formation |
| 01/29/2008 | US7323779 Semiconductor device |
| 01/29/2008 | US7323778 Semiconductor device with improved design freedom of external terminal |
| 01/29/2008 | US7323777 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
| 01/29/2008 | US7323776 Elevated heat dissipating device |
| 01/29/2008 | US7323775 Memory module |
| 01/29/2008 | US7323774 Integrated circuit package system with pedestal structure |
| 01/29/2008 | US7323772 Ball grid array structures and tape-based method of manufacturing same |
| 01/29/2008 | US7323771 Electronic circuit device |
| 01/29/2008 | US7323770 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 01/29/2008 | US7323769 High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
| 01/29/2008 | US7323768 Voltage contrast monitor for integrated circuit defects |
| 01/29/2008 | US7323767 Standoffs for centralizing internals in packaging process |
| 01/29/2008 | US7323766 Sensor module |
| 01/29/2008 | US7323765 Die attach paddle for mounting integrated circuit die |
| 01/29/2008 | US7323761 Antifuse structure having an integrated heating element |
| 01/29/2008 | US7323760 Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance |
| 01/29/2008 | US7323752 ESD protection circuit with floating diffusion regions |
| 01/29/2008 | US7323751 Thin film resistor integration in a dual damascene structure |
| 01/29/2008 | US7323737 DRAM constructions and electronic systems |
| 01/29/2008 | US7323736 Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits |
| 01/29/2008 | US7323735 Method of manufacturing semiconductor integrated circuit device having capacitor element |
| 01/29/2008 | US7323727 System with meshed power and signal buses on cell array |
| 01/29/2008 | US7323717 Semiconductor device |
| 01/29/2008 | US7323715 Semiconductor device and manufacturing method thereof |
| 01/29/2008 | US7323712 Anisotropically conductive connector and production process thereof, and probe member |
| 01/29/2008 | US7323704 Chip type led |
| 01/29/2008 | US7323642 Thin printed circuit board for manufacturing chip scale package |
| 01/29/2008 | US7323515 Sealing composition and seals made by using the same |
| 01/29/2008 | US7323408 Metal barrier cap fabrication by polymer lift-off |
| 01/29/2008 | US7323407 Method of fabricating dual damascene interconnections of microelectronic device using diffusion barrier layer against base material |
| 01/29/2008 | US7323393 Method of reducing film stress on overlay mark |
| 01/29/2008 | US7323383 Method for fabricating an NROM memory cell arrangement |
| 01/29/2008 | US7323365 Semiconductor device manufacturing method and manufacturing apparatus |
| 01/29/2008 | US7323362 Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices |
| 01/29/2008 | US7323361 Packaging system for semiconductor devices |
| 01/29/2008 | US7323358 Method and system for sizing a load plate |
| 01/29/2008 | US7323350 Method of fabricating thin film calibration features for electron/ion beam image based metrology |
| 01/29/2008 | US7323348 Superconducting integrated circuit and method for fabrication thereof |
| 01/29/2008 | US7323255 Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate |
| 01/29/2008 | US7323250 Vinylsiloxane, hydrogensiloxane, hydrosilation catalyst, phenol antioxidant, hindered amine photostabilizer; siloxane from addition reaction product of cyclic siloxane and 5- or 6-vinylbicyclo[2.2.1]hept-2-ene; hardness and strength, transparency, and light transmittance and shortwave photostability |
| 01/29/2008 | US7323227 Process for precise arrangement of micro-bodies |
| 01/29/2008 | US7323097 Electroplating method for a semiconductor device |
| 01/29/2008 | US7322531 Electronic device and method of manufacturing the same |
| 01/29/2008 | US7322402 Heat pipe structure and method for fabricating the same |
| 01/29/2008 | US7322400 Cooling apparatus having low profile extrusion |
| 01/29/2008 | CA2210833C Method of wire bonding an integrated circuit to an ultraflexible substrate |
| 01/24/2008 | WO2008011459A2 Power semiconductor devices having integrated inductor |
| 01/24/2008 | WO2008011408A2 An integrated circuit device having at least one bond pad with a selectable plurality of input-output functionalities |
| 01/24/2008 | WO2008011255A2 Systems and methods for laser processing during periods having non-constant velocities |
| 01/24/2008 | WO2008010982A2 Thermally imageable dielectric layers, thermal transfer donors and receivers |
| 01/24/2008 | WO2008010774A1 Integrated circuit package system with offset stacked die |
| 01/24/2008 | WO2008010591A1 Method for forming porous insulating film |
| 01/24/2008 | WO2008010489A1 Film forming method and film forming apparatus |
| 01/24/2008 | WO2008010378A1 Copper alloy sheets for electrical/electronic part |
| 01/24/2008 | WO2008010371A1 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, computer program and storage medium |
| 01/24/2008 | WO2008010370A1 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, semiconductor device, computer program and storage medium |
| 01/24/2008 | WO2008010270A1 Process for producing functional substrate, functional substrate and semiconductor device |
| 01/24/2008 | WO2008010261A1 Substrate structure, and mobile terminal |
| 01/24/2008 | WO2008009998A1 A semiconductor device |
| 01/24/2008 | WO2008009328A1 Method for encasing electronic components and integrated circuits |
| 01/24/2008 | WO2008009262A2 Module having a flat structure, and equipment method |
| 01/24/2008 | WO2008009225A1 Led assembly and use thereof |
| 01/24/2008 | WO2007120078A3 Polymer anisotropic electroconductive gluing material and a gluing method |
| 01/24/2008 | WO2007050774A3 Universal pad arrangement for surface mounted semiconductor devices |
| 01/24/2008 | WO2007027762A3 Metal interconnect structure for integrated ciruits and a design rule therefor |
| 01/24/2008 | WO2006119485A3 Wirebonded device packages for semiconductor devices having elongated electrodes |
| 01/24/2008 | WO2006036315A3 Method and apparatus for high temperature operation of electronics |
| 01/24/2008 | US20080022252 Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit |
| 01/24/2008 | US20080021436 Analyte Monitoring Device and Methods of Use |
| 01/24/2008 | US20080020946 Thin-film thermoelectric cooling and heating devices for DNA genomic and proteomic chips, thermo-optical switching circuits, and IR tags |
| 01/24/2008 | US20080020568 Semiconductor device having a silicide layer and method of fabricating the same |
| 01/24/2008 | US20080020538 One Mask High Density Capacitor for Integrated Circuits |
| 01/24/2008 | US20080020513 Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device |
| 01/24/2008 | US20080020292 photoresists; photomasks |
| 01/24/2008 | US20080020231 Epoxy Resin Composition |
| 01/24/2008 | US20080018378 Structure and method for providing precision passive elements |
| 01/24/2008 | US20080018000 Method and apparatus for precisely aligning integrated circuit chips |
| 01/24/2008 | US20080017999 Semiconductor device and method for manufacturing same |
| 01/24/2008 | US20080017998 Semiconductor component and method of manufacture |
| 01/24/2008 | US20080017997 Interconnection architecture for semiconductor device |
| 01/24/2008 | US20080017996 Semiconductor device |
| 01/24/2008 | US20080017995 Flip Chip Mounting Process and Flip Chip Assembly |
| 01/24/2008 | US20080017994 Leaded stacked packages having elevated die paddle |
| 01/24/2008 | US20080017993 Semiconductor device and method of manufacturing the same |
| 01/24/2008 | US20080017992 Semiconductor device and method of manufacturing the same |
| 01/24/2008 | US20080017991 Semiconductor chip |
| 01/24/2008 | US20080017990 Semiconductor integrated circuit device |
| 01/24/2008 | US20080017989 Electrically inactive via for electromigration reliability improvement |
| 01/24/2008 | US20080017988 Semiconductor device having copper metal line and method of forming the same |
| 01/24/2008 | US20080017987 Semiconductor device with reduced contact resistance |
| 01/24/2008 | US20080017986 Electronic Component of VQFN Design and Method for Producing the Same |