| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/19/2008 | CA2440023C Liquid-cooled power semiconductor device heatsink |
| 02/19/2008 | CA2427426C Enhanced interface thermoelectric coolers |
| 02/19/2008 | CA2358007C Ceramic biomolecule imaging chip |
| 02/19/2008 | CA2348146C Electronic power device |
| 02/19/2008 | CA2286433C Electrical hook-up process for igbt transistor chips mounted on an integrated circuit board |
| 02/14/2008 | WO2008019252A1 Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing |
| 02/14/2008 | WO2008018959A2 Overmolded semiconductor package with a wirebond cage for emi shielding |
| 02/14/2008 | WO2008018738A1 Fabricating method for chip molding type semiconductor package |
| 02/14/2008 | WO2008018557A1 Semiconductor package and method for manufacturing same, and sealing resin |
| 02/14/2008 | WO2008018524A1 Semiconductor device and its manufacturing method |
| 02/14/2008 | WO2008018490A1 Method for forming conductive film, thin film transistor, panel with thin film transistor, and method for manufacturing thin film transistor |
| 02/14/2008 | WO2008017619A1 Method for producing an electric functional layer on a surface of a substrate |
| 02/14/2008 | WO2008017556A2 Molded housing used in force fit method |
| 02/14/2008 | WO2008017232A1 Substrate and process for semiconductor flip chip package |
| 02/14/2008 | WO2007149819A3 Three-dimensional wafer-level integrated circuit assembly |
| 02/14/2008 | WO2007145741A3 Encapsulated multi-phase electronics heat sink |
| 02/14/2008 | WO2007128126A9 Work light |
| 02/14/2008 | WO2007103224A3 Structure and method of making lidded chips |
| 02/14/2008 | WO2007022399A3 Semiconductor assembly and packaging for high current and low inductance |
| 02/14/2008 | US20080039312 Ceramic base material |
| 02/14/2008 | US20080038923 Device and methodology for reducing effective dielectric constant in semiconductor devices |
| 02/14/2008 | US20080038915 Device and methodology for reducing effective dielectric constant in semiconductor devices |
| 02/14/2008 | US20080038902 Semiconductor bonding and layer transfer method |
| 02/14/2008 | US20080038879 Split-channel antifuse array architecture |
| 02/14/2008 | US20080038869 High performance system-on-chip using post passivation process |
| 02/14/2008 | US20080038868 Process for Packaging Components, and Packaged Components |
| 02/14/2008 | US20080038861 Support with integrated deposit of gas absorbing material for manufacturing microelectronic microoptoelectronic or micromechanical devices |
| 02/14/2008 | US20080038854 Light emitting diode package and fabrication method thereof |
| 02/14/2008 | US20080038577 Component Arrangement Provided With a Carrier Substrate |
| 02/14/2008 | US20080038535 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods |
| 02/14/2008 | US20080038518 Air gap formation |
| 02/14/2008 | US20080038400 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer |
| 02/14/2008 | US20080037236 IC Package, IC Socket, and IC Socket Assembly |
| 02/14/2008 | US20080037230 Circuit board and chassis |
| 02/14/2008 | US20080037200 Multi-Level Thin Film Capacitor on a Ceramic Substrate and Method of Manufacturing the Same |
| 02/14/2008 | US20080036545 Modulation device using frequency-shift keying |
| 02/14/2008 | US20080036485 Semiconductor wafer and method of testing the same |
| 02/14/2008 | US20080036100 Solder elements with columnar structures and methods of making the same |
| 02/14/2008 | US20080036099 Method for producing a component and device having a component |
| 02/14/2008 | US20080036098 Configurable universal interconnect device |
| 02/14/2008 | US20080036097 Semiconductor package, method of production thereof and encapsulation resin |
| 02/14/2008 | US20080036096 Semiconductor Multi-Package Module Having Package Stacked Over Die-Up Flip Chip Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages |
| 02/14/2008 | US20080036095 Semiconductor device and method of fabricating the same |
| 02/14/2008 | US20080036094 Functional device-mounted module and a method for mounting functional device-mounted module |
| 02/14/2008 | US20080036093 Method for embedding a component in a base |
| 02/14/2008 | US20080036092 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner |
| 02/14/2008 | US20080036091 Semiconductor integrated circuit device |
| 02/14/2008 | US20080036090 Semiconductor device and method for producing the same |
| 02/14/2008 | US20080036089 Semiconductor device having multilayer wiring structure |
| 02/14/2008 | US20080036088 Semiconductor apparatus |
| 02/14/2008 | US20080036087 Web process interconnect in electronic assemblies |
| 02/14/2008 | US20080036086 Semiconductor device and method for manufacturing the same |
| 02/14/2008 | US20080036085 Circuit board including solder ball land having hole and semiconductor package having the circuit board |
| 02/14/2008 | US20080036084 Laser release process for very thin Si-carrier build |
| 02/14/2008 | US20080036083 Semiconductor device and method of manufacturing the same |
| 02/14/2008 | US20080036082 Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same |
| 02/14/2008 | US20080036081 Interconnection structure of integrated circuit chip |
| 02/14/2008 | US20080036080 Chip package |
| 02/14/2008 | US20080036079 Conductive connection structure formed on the surface of circuit board and manufacturing method thereof |
| 02/14/2008 | US20080036078 Wirebond-less semiconductor package |
| 02/14/2008 | US20080036077 Package structure and heat sink module thereof |
| 02/14/2008 | US20080036076 Intelligent cooling method combining passive and active cooling components |
| 02/14/2008 | US20080036075 Lightweight, Hermetically Sealed Package Having Auxiliary, Selectively Contoured, Low Mass, Pseudo Wall Insert For Surface-Mounting And Dissipating Heat From Electronic Circuit Components |
| 02/14/2008 | US20080036074 Package unit |
| 02/14/2008 | US20080036073 Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities |
| 02/14/2008 | US20080036072 Secmiconductor device and method for manufacturing a semiconductor device |
| 02/14/2008 | US20080036071 High Density Electronic Packages |
| 02/14/2008 | US20080036070 Bond Wireless Package |
| 02/14/2008 | US20080036069 Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device |
| 02/14/2008 | US20080036068 Stacked Module Systems and Methods |
| 02/14/2008 | US20080036067 Package structure with leadframe on offset chip-stacked structure |
| 02/14/2008 | US20080036066 Method of packaging and interconnection of integrated circuits |
| 02/14/2008 | US20080036065 Electronic device and method for producing a device |
| 02/14/2008 | US20080036064 Semiconductor device |
| 02/14/2008 | US20080036063 Semiconductor package having flexible lead connection plate for electrically connecting base and chip |
| 02/14/2008 | US20080036062 Multi-chip structure |
| 02/14/2008 | US20080036061 Integrated chip carrier with compliant interconnect |
| 02/14/2008 | US20080036060 Semiconductor chip packages and assemblies with chip carrier units |
| 02/14/2008 | US20080036059 Method for producing a module with components stacked one above another |
| 02/14/2008 | US20080036058 Package substrate |
| 02/14/2008 | US20080036057 Semiconductor device having improved heat dissipation capabilities |
| 02/14/2008 | US20080036056 Flip chip in leaded molded package and method of manufacture thereof |
| 02/14/2008 | US20080036055 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant |
| 02/14/2008 | US20080036054 Packaging System For Semiconductor Devices |
| 02/14/2008 | US20080036053 Reinforced micro-electromechanical system package structure |
| 02/14/2008 | US20080036052 Integrated circuit package system with supported stacked die |
| 02/14/2008 | US20080036051 Quad flat package |
| 02/14/2008 | US20080036050 Package with solder-filled via holes in molding layers |
| 02/14/2008 | US20080036049 Stacked integration module and method for manufacturing the same |
| 02/14/2008 | US20080036046 process for precision placement of integrated circuit overcoat material |
| 02/14/2008 | US20080036042 Semiconductor device |
| 02/14/2008 | US20080036041 Production Of Semiconductor Substrates With Buried Layers By Joining (Bonding) Semiconductor Wafers |
| 02/14/2008 | US20080036037 System and method for ESD protection |
| 02/14/2008 | US20080036034 Lead Frame with Included Passive Devices |
| 02/14/2008 | US20080036004 Semiconductor apparatus with improved esd withstanding voltage |
| 02/14/2008 | US20080036003 Backlighted membrane switch |
| 02/14/2008 | US20080035974 High performance system-on-chip using post passivation process |
| 02/14/2008 | US20080035972 High performance system-on-chip using post passivation process |
| 02/14/2008 | US20080035959 Chip scale package for power devices and method for making the same |
| 02/14/2008 | US20080035946 Rare earth element-doped silicon oxide film electroluminescence device |