Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2008
02/07/2008US20080032496 Post passivation interconnection schemes on top of the IC chips
02/07/2008US20080032493 Semiconductor device
02/07/2008US20080032487 Semiconductor wafer and manufacturing method thereof
02/07/2008US20080032486 Semiconductor wafer and manufacturing method thereof
02/07/2008US20080032481 Semiconductor device and method of manufacturing the same
02/07/2008US20080032463 Semiconductor memory device
02/07/2008US20080032459 Mold compound cap in a flip chip multi-matrix array package and process of making same
02/07/2008US20080032458 Semiconductor device and method of manufacturing same
02/07/2008US20080032457 Structure and method of making sealed capped chips
02/07/2008US20080032453 Method of manufacturing a semiconductor device
02/07/2008US20080032449 Stacked Die in Die BGA Package
02/07/2008US20080032233 Crossbar-array designs and wire addressing methods that tolerate misalignment of electrical components at wire overlap points
02/07/2008US20080032205 Formed on photomask during integrated circuit processing
02/07/2008US20080031286 Multiplexed rf isolator
02/07/2008US20080030968 Capacitor built-in interposer and method of manufacturing the same and electronic component device
02/07/2008US20080030257 Driver Circuit for a Semiconductor Power Switching Element
02/07/2008US20080030130 Hermetic encapsulation of organic, electro-optical elements
02/07/2008US20080030080 Chip-scale coils and isolators based thereon
02/07/2008US20080029913 Multi-layer structure for parameter measurement
02/07/2008US20080029912 Tisin layer on semiconductor device
02/07/2008US20080029911 Integrated circuit package system
02/07/2008US20080029910 Layout of array of electrical interconnect to increase i/o density packaging
02/07/2008US20080029909 Nanowire Semiconductor Device
02/07/2008US20080029908 Integrated circuit utilizing down bond to define the function of the die and the implementing method thereof
02/07/2008US20080029907 Power Semiconductor Devices Having Integrated Inductor
02/07/2008US20080029906 Semiconductor switching module and method
02/07/2008US20080029905 Integrated circuit package-in-package system
02/07/2008US20080029904 Double-Sided Waffle Pack
02/07/2008US20080029903 Chip-stacked package structure
02/07/2008US20080029902 Multi-layered complementary conductive line structure
02/07/2008US20080029901 Post vertical interconnects formed with silicide etch stop and method of making
02/07/2008US20080029900 Semiconductor device and method of manufacturing the same
02/07/2008US20080029898 Via stack structures
02/07/2008US20080029897 Side connectors for rfid chip
02/07/2008US20080029896 Sip semiconductor device and method for manufacturing the same
02/07/2008US20080029895 Carrier board structure with embedded semiconductor chip and fabrication method thereof
02/07/2008US20080029894 Flip-chip package substrate and a method for fabricating the same
02/07/2008US20080029893 Power and Ground Ring Layout
02/07/2008US20080029892 Method of fabricating semiconductor device
02/07/2008US20080029891 Semiconductor Device and Method for Fabricating the Same
02/07/2008US20080029890 Embedded chip package process and circuit board with embedded chip
02/07/2008US20080029889 Method to create flexible connections for integrated circuits
02/07/2008US20080029888 Solder Interconnect Joints For A Semiconductor Package
02/07/2008US20080029887 Electronic device including a conductive stud over a bonding pad region and a process for forming the electronic device
02/07/2008US20080029886 Versatile Si-based packaging with integrated passive components for mmWave applications
02/07/2008US20080029885 Inverted Pyramid Multi-Die Package Reducing Wire Sweep And Weakening Torques
02/07/2008US20080029884 Multichip device and method for producing a multichip device
02/07/2008US20080029883 Diamond composite heat spreaders having low thermal mismatch stress and associated methods
02/07/2008US20080029882 Thermal Interconnect System and Method of Production Thereof
02/07/2008US20080029881 Circuit board with cooling function
02/07/2008US20080029880 Micro Electrical Mechanical System
02/07/2008US20080029879 Structure and method of making lidded chips
02/07/2008US20080029878 Method and Device For Secure, Insulated and Electrically Conductive Assembling Of Treated Semiconductor Wafers
02/07/2008US20080029877 Method for separating package of wlp
02/07/2008US20080029876 Bump pattern design for flip chip semiconductor package
02/07/2008US20080029875 Hermetically sealed semiconductor device module
02/07/2008US20080029874 Integrated Circuit Component with a Surface-Mount Housing and Method for Producing the Same
02/07/2008US20080029873 Integrated circuit package system with molding vents
02/07/2008US20080029872 Plate structure having chip embedded therein and the manufacturing method of the same
02/07/2008US20080029871 Interposer and semiconductor package using the same
02/07/2008US20080029870 Wafer-leveled chip packaging structure and method thereof
02/07/2008US20080029869 Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability
02/07/2008US20080029868 Stackable multi-chip package system
02/07/2008US20080029867 Stackable multi-chip package system
02/07/2008US20080029866 Stackable multi-chip package system with support structure
02/07/2008US20080029865 Electronic Device and Method For Producing the Same
02/07/2008US20080029864 Package of MEMS device and method for fabricating the same
02/07/2008US20080029863 Methods of fabrication of wafer-level vacuum packaged devices
02/07/2008US20080029862 Integrated circuit package system including die stacking
02/07/2008US20080029861 Micro chip-scale-package system
02/07/2008US20080029860 Semiconductor device with internal heat sink
02/07/2008US20080029859 Integrated circuit package system employing wafer level chip scale packaging
02/07/2008US20080029858 Integrated circuit package-on-package stacking system
02/07/2008US20080029857 Semiconductor device comprising an excess resin portion, manufacturing method thereof, and apparatus for manufacturing semiconductor device comprising a excess resin portion
02/07/2008US20080029856 Leadframe and non-lead package therewith
02/07/2008US20080029855 Lead Frame and Fabrication Method thereof
02/07/2008US20080029854 Conductive shielding pattern and semiconductor structure with inductor device
02/07/2008US20080029853 Integrated circuit system with contact film
02/07/2008US20080029846 Semiconductor Device
02/07/2008US20080029845 On-Chip Magnetic Components
02/07/2008US20080029820 ESD protection for bipolar-CMOS-DMOS integrated circuit devices and modular method of forming the same
02/07/2008US20080029785 Post passivation interconnection schemes on top of the IC chips
02/07/2008US20080029763 Transmission Circuit, Connecting Sheet, Probe Sheet, Probe Card, Semiconductor Inspection System and Method of Manufacturing Semiconductor Device
02/07/2008US20080029762 Test system incorporating a field effect transistor sensor
02/07/2008DE102007004303A1 Dünnfilm-Halbleiterbauelement und Bauelement-Verbund A thin film semiconductor device and component composite
02/07/2008DE102007004301A1 Semiconductor component i.e. film semiconductor component, or element group manufacturing method, involves forming semiconductor material with layer sequence, and arranging electrical connection area on side facing carrier layer
02/07/2008DE102006036627A1 Fastener for heat sink, has two clamping parts with transverse shank and side shank that is inserted into slots of cooling fins through sides of heat sink, where transverse shank has fastening part that is formed by flexible disk
02/07/2008DE102006035876A1 Multi chip module e.g. sensor chip module, has chip connected with one of main surfaces with thermal contact surface of heat conductor, and has electrical connections connected with electrical contact surfaces of electrical conductors
02/07/2008DE102005055761B4 Leistungshalbleiterbauelement mit Halbleiterchipstapel in Brückenschaltung und Verfahren zur Herstellung desselben Power semiconductor component with the same semiconductor chip stack in a bridge circuit and methods for making
02/07/2008DE102005053842B4 Halbleiterbauelement mit Verbindungselementen und Verfahren zur Herstellung desselben Of the same semiconductor device with connecting elements and methods for making
02/07/2008DE102005052052B4 Ätzstoppschicht für Metallisierungsschicht mit verbesserter Haftung, Ätzselektivität und Dichtigkeit und Verfahren zur Herstellung eines dielektrischen Schichtstapels Etch stop layer for metallization having improved adhesion, etch selectivity and impermeability and methods for producing a dielectric layer stack
02/07/2008DE102005018280B4 Verfahren zur Herstellung eines Halbleiterbauelements mit Bondhügelstrukturen und Halbleiterbauelement A process for producing a semiconductor device with bump structures and semiconductor component
02/07/2008DE102004047306B4 Leistungs-Halbleiterbauteil mit mehreren Bauteilkomponenten Power semiconductor component with a plurality of structural components
02/07/2008DE10104731B4 Funktionalisierte Polymerbeschichtung und deren Verwendung Functionalized polymer coating and the use thereof
02/07/2008CA2657423A1 Heat pipe with nano-structured wicking material
02/06/2008EP1885171A1 Package for electronic component, electronic component using such package, and method for producing package for electronic component
02/06/2008EP1885170A1 Electronic device having heat spreader
02/06/2008EP1885019A1 A method of fabricating a 3D RFID antenna and device manufactured therewith
02/06/2008EP1884995A2 Wiring substrate and manufacturing method thereof, and semiconductor device
02/06/2008EP1884994A2 Semiconductor device and method of manufacturing the same
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