| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/06/2008 | CN100367483C Manufacturing method of tape carrier for TAB |
| 02/06/2008 | CN100367482C Direct chip connecting structure and method |
| 02/06/2008 | CN100367452C Semiconductor device and its manufacturing method |
| 02/06/2008 | CN100367451C Semiconductor device and manufacturing method thereof |
| 02/06/2008 | CN100366700C Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device |
| 02/06/2008 | CN100366697C Foamable underfill encapsulant |
| 02/05/2008 | US7327835 Methods and systems for enabling return to same position in a review of messages in a voice mail system using tag or identifier stored in the voice mail system |
| 02/05/2008 | US7327582 Integrated thin film capacitor/inductor/interconnect system and method |
| 02/05/2008 | US7327577 Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers |
| 02/05/2008 | US7327575 Locking device for heat sink |
| 02/05/2008 | US7327573 Heat sink clip with cammed handle |
| 02/05/2008 | US7327572 Heat dissipating device with enhanced boiling/condensation structure |
| 02/05/2008 | US7327568 Heat sink assembly with rotatable fins |
| 02/05/2008 | US7327554 Assembly of semiconductor device, interposer and substrate |
| 02/05/2008 | US7327541 Operation of dual-directional electrostatic discharge protection device |
| 02/05/2008 | US7327411 Driver chip and display apparatus having the same |
| 02/05/2008 | US7327266 Non-contact communication system information carrier |
| 02/05/2008 | US7327152 Integrated test circuit arrangement and test method |
| 02/05/2008 | US7327090 Electronic module, methods of manufacturing and driving the same, and electronic instrument |
| 02/05/2008 | US7327044 Integrated circuit package encapsulating a hermetically sealed device |
| 02/05/2008 | US7327043 Two layer substrate ball grid array design |
| 02/05/2008 | US7327042 Interconnection structure of electric conductive wirings |
| 02/05/2008 | US7327041 Semiconductor package and a method for producing the same |
| 02/05/2008 | US7327040 Module substrate and disk apparatus |
| 02/05/2008 | US7327039 Curable thermosetting adhesive |
| 02/05/2008 | US7327038 Semiconductor device package |
| 02/05/2008 | US7327037 High density nanostructured interconnection |
| 02/05/2008 | US7327035 System and method for providing a low frequency filter pole |
| 02/05/2008 | US7327034 Compositions for planarization of metal-containing surfaces using halogens and halide salts |
| 02/05/2008 | US7327033 Copper alloy via bottom liner |
| 02/05/2008 | US7327032 Semiconductor package accomplishing fan-out structure through wire bonding |
| 02/05/2008 | US7327031 Semiconductor device and method of manufacturing the same |
| 02/05/2008 | US7327030 Apparatus and method incorporating discrete passive components in an electronic package |
| 02/05/2008 | US7327029 Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink |
| 02/05/2008 | US7327028 Embedded heat spreader for folded stacked chip-scale package |
| 02/05/2008 | US7327027 Thermal interface structure with integrated liquid cooling and methods |
| 02/05/2008 | US7327026 Vacuum diode-type electronic heat pump device and electronic equipment having the same |
| 02/05/2008 | US7327025 Heat spreader for thermally enhanced semiconductor package |
| 02/05/2008 | US7327024 Power module, and phase leg assembly |
| 02/05/2008 | US7327023 Semiconductor component with plastic housing, and process for producing the same |
| 02/05/2008 | US7327022 Assembly, contact and coupling interconnection for optoelectronics |
| 02/05/2008 | US7327021 Multi-level semiconductor module |
| 02/05/2008 | US7327020 Multi-chip package including at least one semiconductor device enclosed therein |
| 02/05/2008 | US7327019 Semiconductor device of a charge storage type |
| 02/05/2008 | US7327018 Chip package structure, package substrate and manufacturing method thereof |
| 02/05/2008 | US7327017 Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound |
| 02/05/2008 | US7327016 High permeability composite films to reduce noise in high speed interconnects |
| 02/05/2008 | US7327015 Semiconductor device package |
| 02/05/2008 | US7327014 Semiconductor integrated circuit device and process for manufacturing the same |
| 02/05/2008 | US7327010 Inductors for integrated circuits |
| 02/05/2008 | US7327007 Semiconductor device with high breakdown voltage |
| 02/05/2008 | US7327005 Optical semiconductor package with incorporated lens and shielding |
| 02/05/2008 | US7327000 Patterned thin film graphite devices and method for making same |
| 02/05/2008 | US7326999 Chip resistor and method for manufacturing same |
| 02/05/2008 | US7326998 Effective I/O ESD protection device for high performance circuits |
| 02/05/2008 | US7326993 Nonvolatile semiconductor memory and method for fabricating the same |
| 02/05/2008 | US7326985 Method for fabricating metallic bit-line contacts |
| 02/05/2008 | US7326974 Sensor for measuring a gas concentration or ion concentration |
| 02/05/2008 | US7326973 Method and an apparatus for a hard-coded bit value changeable in any layer of metal |
| 02/05/2008 | US7326960 Semiconductor circuit constructions |
| 02/05/2008 | US7326958 Solid state imaging device |
| 02/05/2008 | US7326907 Wiring substrate and radiation detector using same |
| 02/05/2008 | US7326648 Semiconductor device and fabrication process of forming silicide layer on a polysilicon pattern by reducing thickness of metal layer before forming silicide layer on the polysilicon pattern |
| 02/05/2008 | US7326641 Semiconductor device and method for manufacturing the same |
| 02/05/2008 | US7326639 Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating |
| 02/05/2008 | US7326637 Method and system for bonding a semiconductor chip onto a carrier using micro-pins |
| 02/05/2008 | US7326636 Method and circuit structure employing a photo-imaged solder mask |
| 02/05/2008 | US7326623 Method of manufacturing display device |
| 02/05/2008 | US7326618 Low OHMIC layout technique for MOS transistors |
| 02/05/2008 | US7326598 Method of fabricating polycrystalline silicon |
| 02/05/2008 | US7326596 High voltage power device with low diffusion pipe resistance |
| 02/05/2008 | US7326594 Connecting a plurality of bond pads and/or inner leads with a single bond wire |
| 02/05/2008 | US7326593 Method of producing a package for semiconductor chips |
| 02/05/2008 | US7326590 Method for manufacturing ball grid array package |
| 02/05/2008 | US7326465 Metal multilayer system includes a high-melting metal layer, a metal separating layer, a catalyst layer, and a metal separating layer; high-melting metal layer is of tantalum, molybdenum, and tungsten; metal separating layer is composed of aluminum, gold, or silver |
| 02/05/2008 | US7326460 Device, method of manufacturing the same, electro-optic device, and electronic equipment |
| 02/05/2008 | US7326446 Method for coating metal surfaces and substrate having a coated metal surface |
| 02/05/2008 | US7326041 Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same |
| 02/05/2008 | US7325990 Method of deck stain applicator |
| 02/05/2008 | US7325716 Dense intermetallic compound layer |
| 02/05/2008 | US7325588 High serviceability liquid cooling loop using flexible bellows |
| 02/05/2008 | US7325302 Method of forming an interconnection element |
| 02/05/2008 | CA2437243C Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads |
| 02/05/2008 | CA2373368C Semiconductor radiation emitter package |
| 01/31/2008 | WO2008014506A2 Dual inductor circuit for multi-band wireless communication device |
| 01/31/2008 | WO2008014197A2 Array-processed stacked semiconductor packages |
| 01/31/2008 | WO2008014193A2 Electrically inactive via for electromigration reliability improvement |
| 01/31/2008 | WO2008014171A2 Thermal interconnect and interface materials, methods of production and uses thereof |
| 01/31/2008 | WO2008013931A2 Bottom source ldmosfet structure and method |
| 01/31/2008 | WO2008013673A2 High speed, high density, low power die interconnect system |
| 01/31/2008 | WO2008013279A1 Electronic component storing package and electronic device |
| 01/31/2008 | WO2008013054A1 Interposer and electronic device using the same |
| 01/31/2008 | WO2008012684A1 A method of fabricating a nanostructure on a pre-etched substrate. |
| 01/31/2008 | WO2008012678A2 Leaded stacked packages having elevated die paddle |
| 01/31/2008 | WO2008012533A1 Antenna arrangment as heat sink |
| 01/31/2008 | WO2008012481A1 Process for fabricating an encapsulated integrated circuit and associated encapsulated integrated circuit |
| 01/31/2008 | WO2008012209A2 Integrated circuit heat dissipation device |
| 01/31/2008 | WO2008011724A1 Light source comprising edge emitting elements |
| 01/31/2008 | WO2007137049A3 Double-sided integrated circuit chips |
| 01/31/2008 | WO2007095100A3 Electronic assembly with detachable components |